7052L35GB: 产品描述PGA-108, Tray; 产品类别存储存储; 文件大小408KB，共13页; 制造商IDT (Integrated Device Technology)

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7052L35GB在线购买

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7052L35GB概述

PGA-108, Tray

7052L35GB规格参数

参数名称	属性值
Brand Name	Integrated Device Technology
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	PGA
包装说明	PGA, PGA108,12X12
针数	108
制造商包装代码	GU108
Reach Compliance Code	compliant
ECCN代码	3A001.A.2.C
Samacsys Description	CGA CAV UP
最长访问时间	35 ns
其他特性	AUTOMATIC POWER-DOWN; BATTERY BACKUP
I/O 类型	COMMON
JESD-30 代码	S-CPGA-P108
JESD-609代码	e0
长度	30.48 mm
内存密度	16384 bit
内存集成电路类型	FOUR-PORT SRAM
内存宽度	8
湿度敏感等级	1
功能数量	1
端口数量	4
端子数量	108
字数	2048 words
字数代码	2000
工作模式	ASYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	2KX8
输出特性	3-STATE
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	PGA
封装等效代码	PGA108,12X12
封装形状	SQUARE
封装形式	GRID ARRAY
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
电源	5 V
认证状态	Not Qualified
筛选级别	MIL-PRF-38535 Class Q
座面最大高度	5.207 mm
最大待机电流	0.0018 A
最小待机电流	2 V
最大压摆率	0.36 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG
端子节距	2.54 mm
端子位置	PERPENDICULAR
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	30.48 mm
Base Number Matches	1

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HIGH-SPEED

2K x 8 FourPort

STATIC RAM

Features

◆

7052S/L

◆

High-speed access

– Commercial: 20/25/35ns (max.)

– Industrial: 25ns (max.)

– Military: 35ns (max.)

Low-power operation

– IDT7052S

Active: 750mW (typ.)

Standby: 7.5mW (typ.)

– IDT7052L

Active: 750mW (typ.)

Standby: 1.5mW (typ.)

True FourPort memory cells which allow simultaneous

access of the same memory locations

Fully asynchronous operation from each of the four ports:

P1, P2, P3, P4

Versatile control for write-inhibit: separate

BUSY

input to

control write-inhibit for each of the four ports

◆

Battery backup operation—2V data retention

TTL-compatible; single 5V (±10%) power supply

Available in 120 pin Thin Quad Flatpacks and 108 pin PGA

Military product compliant to MIL-PRF-38535 QML

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Green parts available, see ordering information

Description

The IDT7052 is a high-speed 2K x 8 FourPort™ Static RAM designed

to be used in systems where multiple access into a common RAM is

required. This FourPort Static RAM offers increased system performance

in multiprocessor systems that have a need to communicate in real time and

also offers added benefit for high-speed systems in which multiple access

is required in the same cycle.

The IDT7052 is also designed to be used in systems where on-chip

hardware port arbitration is not needed. This part lends itself to those

Functional Block Diagram

R/W

I/O

0P1

-I/O

7P1

BUSY

PORT 1

ADDRESS

DECODE

LOGIC

PORT 2

ADDRESS

DECODE

LOGIC

PORT 4

ADDRESS

DECODE

LOGIC

PORT 3

ADDRESS

DECODE

LOGIC

COLUMN

I/O

COLUMN

I/O

R/W

I/O

0P4

-I/O

7P4

BUSY

0P1

- A

10P1

0P4

- A

10P4

MEMORY

ARRAY

0P2

- A

10P2

BUSY

I/O

0P2

-I/O

7P2

R/W

0P3

- A

10P3

BUSY

COLUMN

I/O

COLUMN

I/O

0P3

-I/O

7P3

R/W

2674 drw 01

JULY 2019

DSC 2674/17

7052L35GB相似产品对比

	7052L35GB	7052L25G	7052L20PFG	7052S35PQF	7052L20PFG8	7052S25PQF	7052S25G	7052S20PQF
描述	PGA-108, Tray	PGA-108, Tray	TQFP-120, Tray	PQFP-132, Tray	TQFP-120, Reel	PQFP-132, Tray	PGA-108, Tray	PQFP-132, Tray
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
是否无铅	含铅	含铅	不含铅	含铅	不含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	符合	不符合	符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	PGA	PGA	TQFP	PQFP	TQFP	PQFP	PGA	PQFP
包装说明	PGA, PGA108,12X12	PGA, PGA108,12X12	LFQFP, QFP120,.63SQ,16	0.950 X 0.950 INCH, 0.140 INCH HEIGHT, PLASTIC, QFP-132	LFQFP,	0.950 X 0.950 INCH, 0.140 INCH HEIGHT, PLASTIC, QFP-132	PGA, PGA108,12X12	0.950 X 0.950 INCH, 0.140 INCH HEIGHT, PLASTIC, QFP-132
针数	108	108	120	132	120	132	108	132
制造商包装代码	GU108	GU108	PNG120	PQ132	PNG120	PQ132	GU108	PQ132
Reach Compliance Code	compliant	compliant	compliant	not_compliant	compliant	not_compliant	compliant	not_compliant
ECCN代码	3A001.A.2.C	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	35 ns	25 ns	20 ns	35 ns	20 ns	25 ns	25 ns	20 ns
JESD-30 代码	S-CPGA-P108	S-CPGA-P108	S-PQFP-G120	S-PQFP-G132	S-PQFP-G120	S-PQFP-G132	S-CPGA-P108	S-PQFP-G132
JESD-609代码	e0	e0	e3	e0	e3	e0	e0	e0
长度	30.48 mm	30.48 mm	14 mm	24.13 mm	14 mm	24.13 mm	30.48 mm	24.13 mm
内存密度	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit	16384 bit
内存集成电路类型	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM	FOUR-PORT SRAM
内存宽度	8	8	8	8	8	8	8	8
湿度敏感等级	1	1	3	3	3	3	1	3
功能数量	1	1	1	1	1	1	1	1
端子数量	108	108	120	132	120	132	108	132
字数	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words	2048 words
字数代码	2000	2000	2000	2000	2000	2000	2000	2000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	125 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8	2KX8
封装主体材料	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
封装代码	PGA	PGA	LFQFP	QFP	LFQFP	QFP	PGA	QFP
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK	GRID ARRAY	FLATPACK
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	240	260	225	260	225	240	225
座面最大高度	5.207 mm	5.207 mm	1.6 mm	4.572 mm	1.6 mm	4.572 mm	5.207 mm	4.572 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	YES	YES	YES	YES	NO	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Matte Tin (Sn) - annealed	Tin/Lead (Sn/Pb)	Matte Tin (Sn)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	PIN/PEG	PIN/PEG	GULL WING	GULL WING	GULL WING	GULL WING	PIN/PEG	GULL WING
端子节距	2.54 mm	2.54 mm	0.4 mm	0.635 mm	0.4 mm	0.635 mm	2.54 mm	0.635 mm
端子位置	PERPENDICULAR	PERPENDICULAR	QUAD	QUAD	QUAD	QUAD	PERPENDICULAR	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	30	20	NOT SPECIFIED	20	NOT SPECIFIED	20
宽度	30.48 mm	30.48 mm	14 mm	24.13 mm	14 mm	24.13 mm	30.48 mm	24.13 mm
Samacsys Description	CGA CAV UP	CGA CAV UP	TQFP 14.0 X 14.0 X 1.4 MM	-	TQFP 14.0 X 14.0 X 1.4 MM	-	CGA CAV UP	-
其他特性	AUTOMATIC POWER-DOWN; BATTERY BACKUP	AUTOMATIC POWER-DOWN; BATTERY BACKUP	-	AUTOMATIC POWER-DOWN	-	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN
I/O 类型	COMMON	COMMON	COMMON	COMMON	-	COMMON	COMMON	COMMON
端口数量	4	4	4	4	-	4	4	4
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE	3-STATE
封装等效代码	PGA108,12X12	PGA108,12X12	QFP120,.63SQ,16	SPQFP132,1.1SQ	-	SPQFP132,1.1SQ	PGA108,12X12	SPQFP132,1.1SQ
电源	5 V	5 V	5 V	5 V	-	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified
最大待机电流	0.0018 A	0.0006 A	0.0006 A	0.015 A	-	0.015 A	0.015 A	0.015 A
最小待机电流	2 V	2 V	2 V	4.5 V	-	4.5 V	4.5 V	4.5 V
最大压摆率	0.36 mA	0.25 mA	0.25 mA	0.3 mA	-	0.3 mA	0.3 mA	0.3 mA
Base Number Matches	1	1	1	1	1	1	-	-

7052L35GB

7052L35GB在线购买

7052L35GB概述

7052L35GB规格参数

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7052L35GB相似产品对比

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