12-Bit Rail-to-Rail Micropower DAC with Clear Input
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| 制造商包装代码 | N |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输出电压 | 4.145 V |
| 最小模拟输出电压 | |
| 转换器类型 | D/A CONVERTER |
| 输入位码 | BINARY |
| 输入格式 | SERIAL |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 最大线性误差 (EL) | 0.0977% |
| 湿度敏感等级 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.937 mm |
| 标称安定时间 (tstl) | 14 µs |
| 最大压摆率 | 0.65 mA |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| LTC1456CN8 | LTC1456IS8 | LTC1456I | LTC1456IN8 | LTC1456CS8 | LTC1456C | LTC1456 | |
|---|---|---|---|---|---|---|---|
| 描述 | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input | 12-Bit Rail-to-Rail Micropower DAC with Clear Input |
| Brand Name | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology | - | - |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - | - |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | - | - |
| 零件包装代码 | DIP | SOIC | - | DIP | SOIC | - | - |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | - | DIP, DIP8,.3 | SOP, SOP8,.25 | - | - |
| 针数 | 8 | 8 | - | 8 | 8 | - | - |
| 制造商包装代码 | N | S8 | - | N | S8 | - | - |
| Reach Compliance Code | not_compliant | _compli | - | _compli | _compli | - | - |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | - | - |
| 最大模拟输出电压 | 4.145 V | 4.145 V | - | 4.145 V | 4.145 V | - | - |
| 转换器类型 | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | - | - |
| 输入位码 | BINARY | BINARY | - | BINARY | BINARY | - | - |
| 输入格式 | SERIAL | SERIAL | - | SERIAL | SERIAL | - | - |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | - | R-PDIP-T8 | R-PDSO-G8 | - | - |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | - | - |
| 最大线性误差 (EL) | 0.0977% | 0.0977% | - | 0.0977% | 0.0977% | - | - |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | - | - |
| 位数 | 12 | 12 | - | 12 | 12 | - | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | - | - |
| 端子数量 | 8 | 8 | - | 8 | 8 | - | - |
| 最高工作温度 | 70 °C | 85 °C | - | 85 °C | 70 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | DIP | SOP | - | DIP | SOP | - | - |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | - | DIP8,.3 | SOP8,.25 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | IN-LINE | SMALL OUTLINE | - | IN-LINE | SMALL OUTLINE | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 235 | - | NOT SPECIFIED | 235 | - | - |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | - | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - | - |
| 座面最大高度 | 3.937 mm | 1.75 mm | - | 3.937 mm | 1.75 mm | - | - |
| 标称安定时间 (tstl) | 14 µs | 14 µs | - | 14 µs | 14 µs | - | - |
| 最大压摆率 | 0.65 mA | 0.65 mA | - | 0.65 mA | 0.65 mA | - | - |
| 标称供电电压 | 5 V | 5 V | - | 5 V | 5 V | - | - |
| 表面贴装 | NO | YES | - | NO | YES | - | - |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | - | - |
| 温度等级 | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | - | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | GULL WING | - | - |
| 端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | 1.27 mm | - | - |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 20 | - | NOT SPECIFIED | 20 | - | - |
| 宽度 | 7.62 mm | 3.9 mm | - | 7.62 mm | 3.9 mm | - | - |
嵌入式系统
RF/无线
RF/无线
RF/无线
嵌入式系统
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