BTA204W-600C
3Q Hi-Com Triac
28 March 2013
Product data sheet
1. General description
Planar passivated high commutation three quadrant triac in a SOT223 surface mountable
plastic package intended for use in circuits where high static and dynamic dV/dt and
high dI/dt can occur. This triac will commutate the full rated RMS current at the maximum
rated junction temperature without the aid of a snubber.
2. Features and benefits
SO
T2
23
3Q technology for improved noise immunity
High commutation capability with maximum false trigger immunity
High immunity to false turn-on by dV/dt
Less sensitive gate for very high noise immunity
Planar passivated for voltage ruggedness and reliability
Surface mountable package
3. Applications
•
•
•
General purpose motor controls
Home appliances
Rectifier-fed DC inductive loads e.g. DC motors and solenoids
4. Quick reference data
Table 1.
Symbol
V
DRM
I
TSM
Quick reference data
Parameter
repetitive peak off-
state voltage
non-repetitive peak on- full sine wave; T
j(init)
= 25 °C;
state current
t
p
= 20 ms;
Fig. 4; Fig. 5
Conditions
Min
-
-
Typ
-
-
Max
600
10
Unit
V
A
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NXP Semiconductors
BTA204W-600C
3Q Hi-Com Triac
Symbol
I
T(RMS)
Parameter
RMS on-state current
Conditions
full sine wave; T
sp
≤ 108 °C;
Fig. 1;
Fig. 2; Fig. 3
Min
-
Typ
-
Max
1
Unit
A
Static characteristics
I
GT
gate trigger current
V
D
= 12 V; I
T
= 0.1 A; T2+ G+;
T
j
= 25 °C;
Fig. 9
V
D
= 12 V; I
T
= 0.1 A; T2+ G-;
T
j
= 25 °C;
Fig. 9
V
D
= 12 V; I
T
= 0.1 A; T2- G-;
T
j
= 25 °C;
Fig. 9
-
-
35
mA
-
-
35
mA
-
-
35
mA
5. Pinning information
Table 2.
Pin
1
2
3
4
Pinning information
Symbol Description
T1
T2
G
mb
main terminal 1
main terminal 2
gate
mounting base; connected to
main terminal 2
1
2
3
Simplified outline
4
Graphic symbol
T2
sym051
T1
G
SC-73 (SOT223)
6. Ordering information
Table 3.
Ordering information
Package
Name
BTA204W-600C
SC-73
Description
plastic surface-mounted package with increased heatsink; 4
leads
Version
SOT223
Type number
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DRM
I
T(RMS)
I
TSM
Parameter
repetitive peak off-state voltage
RMS on-state current
non-repetitive peak on-state
current
full sine wave; T
sp
≤ 108 °C;
Fig. 1;
Fig. 2; Fig. 3
full sine wave; T
j(init)
= 25 °C;
t
p
16.7 ms
-
11
A
Conditions
Min
-
-
Max
600
1
Unit
V
A
BTA204W-600C
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© NXP B.V. 2013. All rights reserved
Product data sheet
28 March 2013
2 / 14
NXP Semiconductors
BTA204W-600C
3Q Hi-Com Triac
Symbol
Parameter
Conditions
full sine wave; T
j(init)
= 25 °C;
t
p
= 20 ms;
Fig. 4; Fig. 5
Min
-
-
-
-
-
Max
10
0.5
100
2
5
0.5
150
125
003aak841
Unit
A
2
I t
dI
T
/dt
I
GM
P
GM
P
G(AV)
T
stg
T
j
6
I
T(RMS )
(A)
5
4
2
I t for fusing
rate of rise of on-state current
peak gate current
peak gate power
average gate power
storage temperature
junction temperature
2
t
p
= 10 ms; SIN
I
T
= 1.5 A; I
G
= 0.2 A; dI
G
/dt = 0.2 A/µs
A s
A/µs
A
W
W
°C
°C
over any 20ms period
-
-40
-
003a a k837
1.25
I
T(RMS)
(A)
1.00
108 °C
0.75
3
0.50
2
1
0
10
-2
0.25
10
-1
1
10
s urge duration (s)
0
-50
0
50
100
T
sp
(°C)
150
f = 50 Hz; T
sp
= 108 °C
Fig. 1.
RMS on-state current as a function of surge
duration; maximum values
Fig. 2.
RMS on-state current as a function of solder
point temperature; maximum values
BTA204W-600C
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© NXP B.V. 2013. All rights reserved
Product data sheet
28 March 2013
3 / 14
NXP Semiconductors
BTA204W-600C
3Q Hi-Com Triac
1.6
P
tot
(W)
1.2
003aak839
conduction
angle
(degrees)
30
60
90
120
180
form
factor
a
4
2.8
2.2
1.9
1.57
α
α = 180°
120°
90°
60°
30°
101
T
sp(max)
(°C)
107
0.8
113
0.4
119
0
0
0.25
0.5
0.75
1.0
I
T(RMS)
(A)
125
1.25
α = conduction angle
Fig. 3.
Total power dissipation as a function of RMS on-state current; maximum values
10
3
I
T
I
TSM
(A)
003aak840
I
TSM
t
t
p
T
j(init)
= 25 °C max
10
2
10
10
-5
10
-4
10
-3
10
-2
t
p
(s)
10
-1
t
p
≤ 20 ms
Fig. 4.
Non-repetitive peak on-state current as a function of pulse width; maximum values
BTA204W-600C
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© NXP B.V. 2013. All rights reserved
Product data sheet
28 March 2013
4 / 14
NXP Semiconductors
BTA204W-600C
3Q Hi-Com Triac
15
I
TSM
(A)
10
003aak838
5
I
T
I
TSM
t
1/f
T
j(init)
= 25 °C max
0
1
10
10
2
number of cycles
10
3
f = 50 Hz
Fig. 5.
Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values
8. Thermal characteristics
Table 5.
Symbol
R
th(j-sp)
Thermal characteristics
Parameter
thermal resistance
from junction to solder
point
thermal resistance
from junction to
ambient
Conditions
full cycle or half cycle;
Fig. 8
Min
-
Typ
-
Max
15
Unit
K/W
R
th(j-a)
printed circuit board mounted: minimum
pad area;
Fig. 6
printed circuit board mounted: minimum
footprint;
Fig. 7
-
-
70
156
-
-
K/W
K/W
BTA204W-600C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved
Product data sheet
28 March 2013
5 / 14
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