refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*This package is inherently Pb−Free.
Preferred
devices are recommended choices for future use
and best overall value.
1
May, 2006 − Rev. 3
Publication Order Number:
80SQ045N/D
80SQ045N
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Lead
(See Note 2 − Mounting Data)
Thermal Resistance, Junction−to−Ambient (See Note 2 − Mounting Data)
Symbol
R
qJL
R
qJA
0.9 in x 0.9 in
Copper Pad Size
13
50
6.75 in x 6.75 in
Copper Pad Size
12
40
Unit
°C/W
ELECTRICAL CHARACTERISTICS
(T
L
= 25°C unless otherwise noted)
Characteristic
Maximum Instantaneous Forward Voltage (Note 1)
(i
F
= 8.0 A, T
L
= 25°C)
Maximum Instantaneous Reverse Current @ Rated dc Voltage (Note 1)
T
L
= 25°C
T
L
= 100°C
1. Pulse Test: Pulse Width = 300
ms,
Duty Cycle = 2.0%.
Symbol
v
F
0.55
i
R
1.0
50
mA
Max
Unit
V
30
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
10
I
F
, INSTANTANEOUS FORWARD
CURRENT (AMPS)
30
10
100°C
1
125°C
75°C
MBR845
1
100°C
125°C
25°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.8
75°C
0.1
25°C
0.1
0.2
0.3
0.4
0.5
0.6
0.7
V
F
, INSTANTANEOUS VOLTAGE (VOLTS)
0.8
0.1
Figure 1. Typical Forward Voltage
I
R
, INSTANTANEOUS REVERSE CURRENT (AMPS)
Figure 2. Maximum Forward Voltage
1E−01
125°C
100°C
75°C
10,000
C, CAPACITANCE (pF)
1E−02
1E−03
f = 1 MHz
T
J
= 25°C
1000
1E−04
25°C
1E−05
1E−06
100
0
5
10 15 20
25 30 35 40
V
R
, REVERSE VOLTAGE (VOLTS)
45
50
0.1
1
10
V
R
, REVERSE VOLTAGE (VOLTS)
100
Figure 3. Typical Reverse Current
Figure 4. Typical Capacitance
http://onsemi.com
2
80SQ045N
75
70
COPPER AREA (sq in)
65
60
55
50
See Note 2
45
40
35
30
0
2
4
6
8
10
R
qJA
(°C/W)
I
F
, AVERAGE FORWARD
CURRENT (AMPS)
9
8
dc
7
6
5
4
3
2
1
0
0
20
40
60
80
100
120
140
T
L
, LEAD TEMPERATURE (°C)
SQUARE
WAVE
R
qJL
= 12°C/W
Figure 5. R
qJA
versus Copper Area
Figure 6. Current Derating − Lead
4.5
NOTE 2 — MOUNTING DATA
4
P
FO
, AVERAGE POWER
DISSIPATION (WATTS)
3.5
3
2.5
2
1.5
1
0.5
0
0
2
4
6
8
10
I
O
, AVERAGE FORWARD CURRENT (AMPS)
dc
SQUARE
WAVE
T
J
= 125°C
Mounting Method
P.C. Board with 6.75 sq. in.
copper surface.
Figure 7. Forward Power Dissipation
r(t), NORMALIZED EFFECTIVE TRANSIENT
THERMAL RESISTANCE
1
D = 0.5
0.2
0.1
0.1
0.05
0.01
P
(pk)
Copper Area = 0.271 sq. in.
R
qJA
= 61.8
°C/W
t
2
DUTY CYCLE, D = t
1
/t
2
10
100
1000
t
1
0.01
SINGLE PULSE
0.0001
0.001
0.01
0.001
0.1
t, TIME (sec)
Figure 8. Thermal Response, Junction−to−Ambient
http://onsemi.com
3
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
ÉÉ
1.0
L = 3/8,
Board Ground Plane
80SQ045N
PACKAGE DIMENSIONS
AXIAL LEAD
CASE 267−05
ISSUE G
K
D
1
A
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
B
D
K
INCHES
MIN
MAX
0.287
0.374
0.189
0.209
0.047
0.051
1.000
−−−
MILLIMETERS
MIN
MAX
7.30
9.50
4.80
5.30
1.20
1.30
25.40
−−−
B
K
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax:
303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
卡巴斯基的安全研究人员称其发现了如何攻击Intel微处理器的远程攻击代码，据传，这一代码可以通过TCP/IP包和JavaScript代码到达用户系统。 目前受影响的系统包括Windows XP，Vista，Windows Server 2003，Windows Server 2008，Linux甚至是BSD和Mac。但所幸大多数错误可以由Intel和BIOS厂商联合进行修复。 卡...[详细]
中兴（ZTE）在2008年7月22日开始举办的“Wireless Japan 2008”上召开了记者招待会。ZTE于2008年4月设立日本法人——日本中兴并首次进入日本市场，开始向移动虚拟网络运营商（MVNO）——日本通信提供支持W-CDMA的数据通信终端。“在进入日本市场之际，已确立明确的销售目标：从08年起的3年内实现1亿美元的销售额”（中兴东南亚地区总裁钱强）。预计08年的销售额为2...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
