Parallel 16-Bit Rail-to-Rail Micropower DAC
| LTC1657LC | LTC1657LIN | LTC1657LIGN | LTC1657LI | LTC1657LCN | LTC1657LCGN | LTC1657L | |
|---|---|---|---|---|---|---|---|
| 描述 | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC | Parallel 16-Bit Rail-to-Rail Micropower DAC |
| Brand Name | - | Linear Technology | Linear Technology | - | Linear Technology | Linear Technology | - |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
| 厂商名称 | - | Linear ( ADI ) | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) | - |
| 零件包装代码 | - | DIP | SSOP | - | DIP | SSOP | - |
| 包装说明 | - | DIP, DIP28,.3 | SSOP, SSOP28,.25 | - | DIP, DIP28,.3 | SSOP, SSOP28,.25 | - |
| 针数 | - | 28 | 28 | - | 28 | 28 | - |
| 制造商包装代码 | - | N | GN | - | N | GN | - |
| Reach Compliance Code | - | _compli | _compli | - | _compli | _compli | - |
| ECCN代码 | - | EAR99 | EAR99 | - | EAR99 | EAR99 | - |
| 最大模拟输出电压 | - | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | - |
| 转换器类型 | - | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | - |
| 输入位码 | - | BINARY | BINARY | - | BINARY | BINARY | - |
| 输入格式 | - | PARALLEL, WORD | PARALLEL, WORD | - | PARALLEL, WORD | PARALLEL, WORD | - |
| JESD-30 代码 | - | R-PDIP-T28 | R-PDSO-G28 | - | R-PDIP-T28 | R-PDSO-G28 | - |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 | - |
| 最大线性误差 (EL) | - | 0.0183% | 0.0183% | - | 0.0183% | 0.0183% | - |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 | - |
| 位数 | - | 16 | 16 | - | 16 | 16 | - |
| 功能数量 | - | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | - | 28 | 28 | - | 28 | 28 | - |
| 最高工作温度 | - | 85 °C | 85 °C | - | 70 °C | 70 °C | - |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | - | DIP | SSOP | - | DIP | SSOP | - |
| 封装等效代码 | - | DIP28,.3 | SSOP28,.25 | - | DIP28,.3 | SSOP28,.25 | - |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | - | IN-LINE | SMALL OUTLINE, SHRINK PITCH | - | IN-LINE | SMALL OUTLINE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | - | 255 | 235 | - | 255 | 235 | - |
| 电源 | - | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V | - |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | - |
| 座面最大高度 | - | 3.937 mm | 1.748 mm | - | 3.937 mm | 1.748 mm | - |
| 最大稳定时间 | - | 20 µs | 20 µs | - | 20 µs | 20 µs | - |
| 标称安定时间 (tstl) | - | 20 µs | 20 µs | - | 20 µs | 20 µs | - |
| 最大压摆率 | - | 1.2 mA | 1.2 mA | - | 1.2 mA | 1.2 mA | - |
| 标称供电电压 | - | 3 V | 3 V | - | 3 V | 3 V | - |
| 表面贴装 | - | NO | YES | - | NO | YES | - |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | - |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子形式 | - | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | GULL WING | - |
| 端子节距 | - | 2.54 mm | 0.635 mm | - | 2.54 mm | 0.635 mm | - |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | - | 40 | 20 | - | 40 | 20 | - |
| 宽度 | - | 7.62 mm | 3.899 mm | - | 7.62 mm | 3.899 mm | - |
51单片机
模拟与混合信号
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51单片机
嵌入式系统
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