RPC Series — Pulse Withstanding Thick Film Chip Resistor
Features
• Excellent pulse withstanding performance
• Broad resistance range
• Higher anti-surge performance compared
with RMC series
• Stability class: 5%
• RoHS compliant / lead-free
Electrical Specifications
Type / Code
Power Rating
(Watts)
@ 70°C
0.125W
(0.250W**)
0.250W
(0.333W**)
0.333W
(0.500W**)
0.750W
1.000W
Maximum Working
Voltage*
Ohmic Range and Tolerance
Resistance Temperature Coefficient
1%, 5%, 10%, 20%
±200 ppm/°C
±200 ppm/°C
0.27Ω – 22MΩ
200V
200V
200V
±200 ppm/°C
±200 ppm/°C
±200 ppm/°C
RPC 0805
RPC 1206
RPC 1210
RPC 2010
RPC 2512
150V
200V
* Lesser of
√PR
or maximum working voltage.
** Higher power rating for each package size is valid if ambient temp <= 80C and terminal temp <= 105C
How to Order
RPC
SEI Type
Type
RPC
Description
Pulse Withstanding
Code
0805
1206
1210
2010
2512
0805
Code
Wattage
0.125W
0.250W
0.333W
0.750W
1.000W
10M
Nominal Resistance
Tolerance EIA Values
1%
5%
10%
20%
E24
5%
Tolerance
A
Packaging
SEI Types
0805, 1206
1210, 2010, 2512
Pkg Qty
5,000
4,000
Description
Code
G
R
R
10,000 10" reel - Paper
7" reel - Paper
Toll Free: (888) SEI-SEIS
(888) 734-7347
www.seielect.com
15
email: marketing@seielect.com
Rev 10/08
RPC Series — Pulse Withstanding Thick Film Chip Resistor
Mechanical Specifications
Type / Code
RPC 0805
RPC 1206
RPC 1210
RPC 2010
RPC 2512
L
Body Length
0.079 ± 0.004
2.00 ± 0.10
0.126 ± 0.006
3.20 ± 0.15
0.126 ± 0.006
3.20 ± 0.15
0.197 ± 0.006
5.00 ± 0.15
0.248 ± 0.006
6.30 ± 0.15
W
Body Width
0.049 ± 0.004
1.25 ± 0.10
0.063 ± 0.006
1.60 ± 0.15
0.098 ± 0.006
2.50 ± 0.15
0.098 ± 0.006
2.50 ± 0.15
0.126 ± 0.006
3.20 ± 0.15
H
Body Height
0.021 ± 0.004
0.55 ± 0.10
0.021 ± 0.004
0.55 ± 0.10
0.021 ± 0.006
0.55 ± 0.15
0.021 ± 0.006
0.55 ± 0.15
0.021 ± 0.006
0.55 ± 0.15
a
Top Termination
0.012 ± 0.008
0.30 ± 0.20
0.012 ± 0.008
0.30 ± 0.20
0.012 ± 0.008
0.30 ± 0.20
0.012 ± 0.008
0.30 ± 0.20
0.012 ± 0.008
0.30 ± 0.20
b
Bottom Termination
0.016 ± 0.008
0.40 ± 0.20
0.020 ± 0.010
0.50 ± 0.25
0.020 ± 0.010
0.50 ± 0.25
0.024 ± 0.008
0.60 ± 0.20
0.024 ± 0.008
0.60 ± 0.20
Units
inches
mm
inches
mm
inches
mm
inches
mm
inches
mm
Performance Characteristics
Test
Voltage Proof
Variation of Resistance
with Temperature
Overload
Solderability
Resistance to Soldering
Heat
Rapid Change of
Temperature
Climatic Sequence
Damp Test, Steady
State
Endurance @ 70°C
Endurance at the Upper
Category Temperature
Adhesion
Bend of Strength of the
Face Plating
Test Results
No breakdown or flashover R
≥
1G
ohm
See ratings table
∆R ≤
± 1% + 0.05Ω
No visible damage, legible markings
In accordance with Clause 4.17.4.5
∆R ≤
± 1% + 0.05Ω
∆R ≤
± 1% + 0.05Ω
No visible damage
∆R ≤
± 5% + 0.10Ω
No visible damage
∆R ≤
± 5% + 0.10Ω
No visible damage, legible markings
∆R ≤
± 5% + 0.10Ω
No visible damage
∆R ≤
± 5% + 0.10Ω
No visible damage
No visible damage
∆R ≤
± 1% + 0.05Ω
Clause 4.33
Clause 4.18
Clause 4.8
Test Methods (JIS C 520-1:1198)
Clause 4.7
500Va.c.,60s
+20°C/ -55°C/ +20°C/ +125°C/ +20°C : RPC 2010 RPC 2512
+20°C/ -55°C/ +20°C/ +155°C/ +20°C : RPC 0805 RPC 1206 RPC 1210
Clause 4.13 The applied voltage shall be 2.5 times of the rated voltage or twice of the limiting
element voltage, whichever is the less severe, 2s.
Clause 4.17
235°C, 2s.
After immersion into the flux, the immersion into solder shall be carried out in
Solder bath at 260°C for 5s.
Clause 4.19 Cycle: -55°C/ + 125°C 5 times: RPC 2010 RPC 2512
Cycle: -55°C/ +155°C 5 times: RPC 0805 RPC 1206 RPC 1210
Clause 4.23
Dry/Damp heat (12+12h cycle), first cycle./
Cold/Damp heat (12+12h cycle), remaining cycle./ D.C. Load
Clause 4.24
40°C, 95% R.H., 56 days, test a) and b) of Clause 4.24.2.1
Rated voltage, 1.5h "ON", 05.h "OFF", 70°C, 1,000h
Clause 4.25.1
Clause 4.25.3 125°C, no load, 1,000h: RPC 2010 RPC 2512
155°C, no load, 1,000h: RPC 0805 RPC 1206 RPC 1210
Clause 4.32
5N, 10s
Amount of bend: 3mm RPC 0805 RPC 1206 RPC 1210
Amount of bend: 1mm RPC 2010 RPC 2512
Operating Temperature Range : -55°C to +155°C
Toll Free: (888) SEI-SEIS
(888) 734-7347
www.seielect.com
16
email: marketing@seielect.com
Rev 10/08
嵌入式系统
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