1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32
1通道 14位 专有模式模数转换器, 并行存取, PQCC32
| 参数名称 | 属性值 |
| Brand Name | Linear Technology |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | QFN |
| 包装说明 | HVQCCN, LCC32,.2SQ,20 |
| 针数 | 32 |
| 制造商包装代码 | UH |
| Reach Compliance Code | _compli |
| ECCN代码 | 3A991.C.3 |
| Is Samacsys | N |
| 最大模拟输入电压 | 1 V |
| 最小模拟输入电压 | -1 V |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PQCC-N32 |
| JESD-609代码 | e0 |
| 长度 | 5 mm |
| 最大线性误差 (EL) | 0.0336% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 14 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | OFFSET BINARY, 2'S COMPLEMENT BINARY |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC32,.2SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 105 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| LTC2254IUH | LTC2255 | LTC2253 | LTC2220-1 | LT1993 | |
|---|---|---|---|---|---|
| 描述 | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32 | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32 | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32 | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32 | 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC32 |
| 位数 | 14 | 14 | 14 | 14 | 14 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
| 表面贴装 | YES | Yes | Yes | Yes | Yes |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 最大工作温度 | - | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
| 最小工作温度 | - | -40 Cel | -40 Cel | -40 Cel | -40 Cel |
| 额定供电电压 | - | 3 V | 3 V | 3 V | 3 V |
| 最大线性误差 | - | 0.0336 % | 0.0336 % | 0.0336 % | 0.0336 % |
| 最大限制模拟输入电压 | - | 1 V | 1 V | 1 V | 1 V |
| 最小限制模拟输入电压 | - | -1 V | -1 V | -1 V | -1 V |
| 加工封装描述 | - | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 | 5 X 5 MM, PLASTIC, MO-220-WHHD, QFN-32 |
| 状态 | - | ACTIVE | ACTIVE | ACTIVE | ACTIVE |
| 工艺 | - | CMOS | CMOS | CMOS | CMOS |
| 包装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 包装尺寸 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 端子间距 | - | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm |
| 端子涂层 | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 包装材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 采样率 | - | 105 MHz | 105 MHz | 105 MHz | 105 MHz |
| 转换器的类型 | - | PROPRIETARY METHOD | PROPRIETARY METHOD | PROPRIETARY METHOD | PROPRIETARY METHOD |
| 输出位编码 | - | OFFSET BINARY, 2S COMPLEMENT BINARY | OFFSET BINARY, 2S COMPLEMENT BINARY | OFFSET BINARY, 2S COMPLEMENT BINARY | OFFSET BINARY, 2S COMPLEMENT BINARY |
| 模拟通道数 | - | 1 | 1 | 1 | 1 |
| 采样保持和跟踪保持 | - | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
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