MASK ROM, 512KX8, 100ns, CMOS, CQFP44, 10 X 10 MM, QFP-44
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | QFP |
| 包装说明 | WQFP, TQFP44,.6SQ,32 |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| 备用内存宽度 | 16 |
| JESD-30 代码 | S-CQFP-G44 |
| JESD-609代码 | e0 |
| 长度 | 10 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQFP |
| 封装等效代码 | TQFP44,.6SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, WINDOW |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| KM23C4100HFP2-10 | KM23C4100HFP1-10 | KM23C4100HFP1-15 | KM23C4100HFP1-12 | KM23C4100HFP2-12 | KM23C4100HFP2-15 | |
|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 512KX8, 100ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 100ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 120ns, CMOS, CQFP44, 14 X 14 MM, QFP-44 | MASK ROM, 512KX8, 120ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 | MASK ROM, 512KX8, 150ns, CMOS, CQFP44, 10 X 10 MM, QFP-44 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | WQFP, TQFP44,.6SQ,32 | WQFP, QFP44,.7SQ,32 | WQFP, QFP44,.7SQ,32 | WQFP, QFP44,.7SQ,32 | 10 X 10 MM, QFP-44 | WQFP, TQFP44,.6SQ,32 |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 100 ns | 150 ns | 120 ns | 120 ns | 150 ns |
| 备用内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 | S-CQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 10 mm | 14 mm | 14 mm | 14 mm | 10 mm | 10 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WQFP | WQFP | WQFP | WQFP | WQFP | WQFP |
| 封装等效代码 | TQFP44,.6SQ,32 | QFP44,.7SQ,32 | QFP44,.7SQ,32 | QFP44,.7SQ,32 | TQFP44,.6SQ,32 | TQFP44,.6SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW | FLATPACK, WINDOW |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 10 mm | 14 mm | 14 mm | 14 mm | 10 mm | 10 mm |
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