DATA SHEET
MRSS31U
Micro power Built-in IC ultra-minimum MR sensor
FEATURES
*Micro power (15µW(typ):Vcc=3V)
and High-sensitivity(2mT(typ))
(suited for battery-operation)
*Ultra-small size
MR(Magneto-resistance)sensor
*
Volume and mounting area are 50%
smaller than MRSS22L.
*
Height is about 4mm lower than
MRSS22L.
*Operating in one way magnetic field
*Operating with independent pole
(easily manufacture)
*Superior Temperature stability
*Lead free goods
2.Fundamental Operation
2-1.Direction of Magnetic Field
2-2.Circuit Block
SWITCH
Ｒ1
Ｒ2
2.0
± 0.2
0.3
+0.1
-0.05
MR Sensor
1.Dimension (Unit:mm)
0.25
±0.1
0.15
+0.1
-0.05
Gnd
2 .1
±0.1
1 .6
0 ∼0.05
Vcc
Out
0.6 5
0.65
Ma x0.8
Ｖ½½
SAMPLING
LOGIC
LATCH
Op-Amp
MOS
Operation
ＯＵＴ
Ｒ3
Ｒ4
ＧＮＤ
R1 ∼R4 ：MR Elements
2-3.Performance Characteristics (25±3ºC)
Operating require
Condition
H = 0 mT(
Magnetic Flux Density)
[0 A/m (
Magnetic Field Strength
)]
H
≥
2.0
(Typ)
mT(
Magnetic Flux Density)
[1.6kA/m (
Magnetic Field Strength)
]
H
≤
0.5 mT (
Magnetic Flux Density
)
[0.4kA/m(
Magnetic Field Strength)
]
Output
Voltage
Hi-level
Lo-level
Hi-level
When power switch is ON
When magnetic field is applied
When magnetic field is applied
0.4
±0.1
DATA SHEET
MRSS31U
3.Performance
3-1.Operating Conditions Recommended
(Ta = 25±3ºC unless otherwise specified)
Item
Supply Voltage
Supply Current
Ambient
Temperature
Output Voltage
VOL
Hi-level
output
Hon
Lo-level
output
Hoff
*1)
*2)
MR Sensor
Output
-
-
-
VOH
Condition
-
Vcc=3V
-
Vcc=3V
Iout=2mA
VCC=3V
Iout=-2mA
Min
2.5
-
-20
2.7
-
-
0.5
(0.4)
Std
3.0
5
25
-
-
2.0
(1.6)
-
Max
3.7
-
80
-
0.3
2.5
(2.0)
-
Unit
V
µA
ºC
V
V
mT
(*1
(kA/m)
(*2
Operating Magnetic
Field
1 [mT](SI) = 10 [G] (CGS)
(
) =
[kA/m](SI)
3-2.Absolute Maximum Ratings
(Ta = 25±3ºC unless otherwise specified)
Item
Supply Voltage
Storage
Temperature
Condition
-
-
Specifications
5.0
-40 ~ +125
Unit
V
ºC
The products and product specifications described in this material are subject to change without notice
for reasons of modification or improvement.
DATA SHEET
MRSS31U
MR Sensor
4. Recommended Mount Pad
0.6
0.8
0.65
1.3
0.65
1.9
( Unit : mm)
The products and product specifications described in this material are subject to change without notice
for reasons of modification or improvement.
NEC Corporation
Fiber Optic Device Division
(Shin Tamachi Building) 34-6, Shiba 5-chome, Minato-ku,
Tokyo 108-0014, Japan
Tel:+81-3-3798-5864 Fax:+81-3-3798-5857
http://www.sw.nec.co.jp/on/dd/en/
EWV-19-0087-01E, Feb., 2005
Copyright © 2005 NEC Corporation
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