IDT54/74FCT162543T/AT/CT/ET
FAST CMOS 16-BIT LATCHED TRANSCEIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
FAST CMOS
16-BIT LATCHED
TRANSCEIVER
FEATURES:
−
−
−
−
−
−
−
−
−
−
−
0.5 MICRON CMOS Technology
High-speed, low-power CMOS replacement for ABT functions
Typical t
SK
(o) (Output Skew) < 250ps
Low input and output leakage
≤1µ
A (max.)
ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
25 mil pitch SSOP, 19.6 mil pitch TSSOP, 15.7 mil pitch TVSOP
and 25 mil pitch CERPACK packages
Extended commercial range of -40°C to +85°C
V
CC
= 5V ±10%
Balanced Output Drivers:
•
±24mA (commercial)
•
±16mA (military)
Reduced system switching noise
Typical V
OLP
(Output Ground Bounce) < 0.6V at V
CC
= 5V, T
A
=
25°C
IDT54/74FCT162543T/AT/CT/ET
DESCRIPTION:
The FCT162543T/AT/CT/ET 16-bit latched transceivers are built
using advanced dual metal CMOS technology. These high-speed, low-
power devices are organized as two independent 8-bit D-type latched
transceivers with separate input and output control to permit independent
control of data flow in either direction. For example, the A-to-B Enable
(xCEAB) must be low in order to enter data from the A port or to output data
from the B port. xLEAB controls the latch function. When xLEAB is low, the
latches are transparent. A subsequent low-to-high transition of xLEAB
signal puts the A latches in the storage mode. xOEAB performs output
enable function on the B port. Data flow from the B port to the A port is similar
but requires using xCEBA, xLEBA, and xOEBA inputs. Flow-through
organization of signal pins simplifies layout. All inputs are designed with
hysteresis for improved noise margin.
The FCT162543T/AT/CT/ET have balanced output drive with current
limiting resistors. This offers low ground bounce, minimal undershoot, and
controlled output fall times–reducing the need for external series terminat-
ing resistors. The FCT162543T/AT/CT/ET are plug-in replacements for
the FCT16543T/AT/CT/ET and 54/74ABT16543 for on-board bus inter-
face applications.
FUNCTIONAL BLOCK DIAGRAM
1
OEBA
1
CEBA
56
2
OEBA
2
CEBA
29
31
54
1
LEBA
1
OEAB
1
CEAB
1
LEAB
55
1
2
LEBA
2
OEAB
2
CEAB
2
LEAB
30
28
3
2
26
27
C
1
A
1
5
C
2
A
1
15
52
D
C
D
1
B
1
D
C
D
42
2
B
1
TO SEVEN OTH ER CHANN ELS
TO SEVEN OTH ER CHANN ELS
MILITARY AND COMMERCIAL TEMPERATURE RANGES
1
c
1999 Integrated Device Technology, Inc.
AUGUST 1999
DSC-5445/-
IDT54/74FCT162543T/AT/CT/ET
FAST CMOS 16-BIT LATCHED TRANSCEIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATION
1
OEAB
1
LEAB
1
CE AB
ABSOLUTE MAXIMUM RATINGS
(1)
56
55
54
53
52
51
50
49
48
47
46
45
44
1
OEBA
1
LEBA
1
CEBA
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
SO56-1
SO56-2
SO56-3
E56-1
Symbol
V
TERM(2)
V
TERM(3)
T
STG
I
OUT
Description
Terminal Voltage with Respect to GND
Terminal Voltage with Respect to GND
Storage Temperature
DC Output Current
Max
–0.5 to +7
–0.5 to V
CC
+0.5
–65 to +150
–60 to +120
Unit
V
V
°C
mA
5v16-link
GND
1
A
1
1
A
2
GND
1
B
1
1
B
2
V
CC
1
A
3
1
A
4
1
A
5
V
CC
1
B
3
1
B
4
1
B
5
GND
1
A
6
1
A
7
1
A
8
2
A
1
2
A
2
2
A
3
GND
1
B
6
1
B
7
1
B
8
2
B
1
2
B
2
2
B
3
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM
RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or
any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. All device terminals except FCT162XXXT Output and I/O terminals.
3. Output and I/O terminals for FCT162XXXT.
CAPACITANCE
(T
A
= +25
O
C, f = 1.0MHz)
Symbol
C
IN
C
OUT
Parameter
(1)
Input Capacitance
Output Capacitance
Conditions
V
IN
= 0V
V
OUT
= 0V
Typ.
3.5
3.5
Max.
6
8
Unit
pF
pF
5v16-link
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NOTE:
1. This parameter is measured at characterization but not tested.
GND
2
A
4
2
A
5
2
A
6
GND
2
B
4
2
B
5
2
B
6
V
CC
2
A
7
2
A
8
V
CC
2
B
7
2
B
8
FUNCTION TABLE
(1, 2)
For A-to-B (Symmetric with B-to-A)
Inputs
xCEAB
H
X
L
L
L
L
xLEAB
X
H
L
H
L
H
xOEAB
X
X
L
L
H
H
Latch
Status
xAx to xBx
Storing
Storing
Transparent
Storing
Transparent
Storing
Output
Buffers
xBx
High Z
X
Current A Inputs
Previous* A Inputs
High Z
High Z
GND
2
CE AB
2
LEAB
2
OEAB
GND
2
CEBA
2
LEBA
2
OEBA
SSOP/ TSSOP/ TVSOP/ CERPACK
TOP VIEW
PIN DESCRIPTION
Pin Names
xOEAB
xOEBA
xCEAB
xCEBA
xLEAB
xLEBA
xAx
xBx
Description
A-to-B Output Enable Input (Active LOW)
B-to-A Output Enable Input (Active LOW)
A-to-B Enable Input (Active LOW)
B-to-A Enable Input (Active LOW)
A-to-B Latch Enable Input (Active LOW)
B-to-A Latch Enable Input (Active LOW)
A-to-B Data Inputs or B-to-A 3-State Outputs
B-to-A Data Inputs or A-to-B 3-State Outputs
NOTES:
1. * Before xLEAB LOW-to-HIGH Transition
H = HIGH Voltage Level
L = LOW Voltage Level
X = Don’t Care
2. A-to-B data flow shown; B-to-A flow control is the same, except using
xCEBA, xLEBA and xOEBA.
2
IDT54/74FCT162543T/AT/CT/ET
FAST CMOS 16-BIT LATCHED TRANSCEIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
DC ELECTRICAL CHARACTERISTICS OVER OPERATING RANGE
Following Conditions Apply Unless Otherwise Specified:
Commercial: T
A
= -40°C to +85°C, V
CC
= 5.0V ±10%; Military: T
A
= -55°C to +125°C, V
CC
= 5.0V ±10%
Symbol
V
IH
V
IL
I
IH
I
IL
I
OZH
I
OZL
V
IK
I
OS
V
H
I
CCL
I
CCH
I
CCZ
Parameter
Input HIGH Level
Input LOW Level
Input HIGH Current (Input pins)
(5)
Input HIGH Current (I/O pins)
(5)
Input LOW Current (Input pins)
(5)
Input LOW Current (I/O pins)
(5)
High Impedance Output Current
(3-State Output pins)
(5)
Clamp Diode Voltage
Short Circuit Current
Input Hysteresis
Quiescent Power Supply Current
V
CC
= Max.
V
IN
= GND or V
CC
V
CC
= Min., I
IN
= –18mA
V
CC
= Max., V
O
= GND
(3)
—
V
CC
= Max.
V
O
= 2.7V
V
O
= 0.5V
V
I
= GND
Test Conditions
(1)
Guaranteed Logic HIGH Level
Guaranteed Logic LOW Level
V
CC
= Max.
V
I
= V
CC
Min.
2
—
—
—
—
—
—
—
—
–80
—
—
Typ.
(2)
—
—
—
—
—
—
—
—
–0.7
–140
100
5
Max.
—
0.8
±1
±1
±1
±1
±1
±1
–1.2
–250
—
500
V
mA
mV
µA
µA
Unit
V
V
µA
5v16-link
OUTPUT DRIVE CHARACTERISTICS
Symbol
I
ODL
I
ODH
V
OH
V
OL
Parameter
Output LOW Current
Output HIGH Current
Output HIGH Voltage
Output LOW Voltage
Test Conditions
(1)
V
CC
= 5V, V
IN
= V
IH
or V
IL
, V
O
= 1.5V
(3)
V
CC
= 5V, V
IN
= V
IH
or V
IL
, V
O
= 1.5V
(3)
V
CC
= Min.
V
IN
= V
IH
or V
IL
V
CC
= Min.
V
IN
= V
IH
or V
IL
I
OH
= –16mA MIL.
I
OH
= –24mA COM’L.
I
OL
= 16mA MIL.
I
OL
= 24mA COM’L
5v16-link
Min.
60
–60
2.4
—
Typ.
(2)
115
–115
3.3
0.3
Max.
200
–200
—
0.55
Unit
mA
mA
V
V
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Not more than one output should be shorted at one time. Duration of the test should not exceed one second.
4. Duration of the condition can not exceed one second.
5. The test limit for this parameter is ±5µA at T
A
= -55°C.
3
IDT54/74FCT162543T/AT/CT/ET
FAST CMOS 16-BIT LATCHED TRANSCEIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
POWER SUPPLY CHARACTERISTICS
Symbol
∆I
CC
I
CCD
Parameter
Quiescent Power Supply
Current TTL Inputs HIGH
Dynamic Power Supply Current
(4)
V
CC
= Max.
V
IN
= 3.4V
(3)
V
CC
= Max., Outputs Open
xCEAB and xOEAB = GND
xCEBA = V
CC
One Input Toggling
50% Duty Cycle
V
CC
= Max., Outputs Open
f
i
= 10MHz
50% Duty Cycle
xLEAB, xCEAB and
xOEAB = GND
xCEBA = V
CC
One Bit Toggling
V
CC
= Max., Outputs Open
f
i
= 2.5MHz
50% Duty Cycle
xLEAB, xCEAB and
xOEAB = GND
xCEBA = V
CC
Sixteen Bits Toggling
V
IN
= V
CC
V
IN
= GND
Test Conditions
(1)
Min.
—
—
Typ.
(2)
0.5
60
Max.
1.5
100
Unit
mA
µA/
MHz
I
C
Total Power Supply Current
(6)
V
IN
= V
CC
V
IN
= GND
—
0.6
1.5
mA
V
IN
= 3.4V
V
IN
= GND
—
0.9
2.3
V
IN
= V
CC
V
IN
= GND
—
2.4
4.5
(5)
V
IN
= 3.4V
V
IN
= GND
—
6.4
16.5
(5)
NOTES:
1. For conditions shown as Max. or Min., use appropriate value specified under Electrical Characteristics for the applicable device type.
2. Typical values are at V
CC
= 5.0V, +25°C ambient.
3. Per TTL driven input (V
IN
= 3.4V). All other inputs at V
CC
or GND.
4. This parameter is not directly testable, but is derived for use in Total Power Supply Calculations.
5. Values for these conditions are examples of the I
CC
formula. These limits are guaranteed but not tested.
6. I
C
= I
QUIESCENT
+ I
INPUTS
+ I
DYNAMIC
I
C
= I
CC
+
∆I
CC
D
H
N
T
+ I
CCD
(f
CP
N
CP
/2 + f
i
N
i
)
I
CC
= Quiescent Current (I
CCL
,
I
CCH
and I
CCZ
)
∆I
CC
= Power Supply Current for a TTL High Input (V
IN
= 3.4V)
D
H
= Duty Cycle for TTL Inputs High
N
T
= Number of TTL Inputs at D
H
I
CCD
= Dynamic Current Caused by an Input Transition Pair (HLH or LHL)
f
CP
= Clock Frequency for Register Devices (Zero for Non-Register Devices)
N
CP
= Number of Clock Inputs at f
CP
f
i
= Input Frequency
N
i
= Number of Inputs at f
i
4
IDT54/74FCT162543T/AT/CT/ET
FAST CMOS 16-BIT LATCHED TRANSCEIVER
MILITARY AND COMMERCIAL TEMPERATURE RANGES
SWITCHING CHARACTERISTICS OVER OPERATING RANGE
FCT162543T
Com'l.
Symbol
Parameter
t
PLH
Propagation Delay
t
PHL
Transparent Mode
xAx to xBx or xBx to xAx
t
PLH
Propagation Delay
t
PHL
xLEBA to xAx, xLEAB to xBx
t
PZH
Output Enable Time
t
PZL
xOEBA or xOEAB to xAx or xBx
xCEBA or xCEAB to xAx or xBx
t
PHZ
Output Disable Time
t
PLZ
xOEBA or xOEAB to xAx or xBx
xCEBA or xCEAB to xAx or xBx
t
SU
Set-up Time HIGH or LOW
xAx or xBx to xLEAB or xLEBA
t
H
Hold Time HIGH or LOW
xAx or xBx to xLEAB or xLEBA
t
W
xLEBA or xLEAB Pulse Width LOW
t
SK
(o) Output Skew
(3)
Condition
(1)
C
L
= 50pF
R
L
= 500Ω
Min
.
(2)
1.5
Max
.
8.5
Min
.
(2)
1.5
Mil.
Max
.
10
Min
.
(2)
1.5
FCT162543AT
Com'l.
Max
.
6.5
Min
.
(2)
1.5
Mil.
Max
.
7.5
Unit
ns
1.5
1.5
12.5
12
1.5
1.5
14
14
1.5
1.5
8
9
1.5
1.5
9
10
ns
ns
1.5
9
1.5
13
1.5
7.5
1.5
8.5
ns
2
2
4
—
—
—
—
0.5
3
2
5
—
—
—
—
0.5
2
2
4
—
—
—
—
0.5
2
2
5
—
—
—
—
0.5
ns
ns
ns
ns
FCT162543CT
Com'l.
Symbol
Parameter
t
PLH
Propagation Delay
t
PHL
Transparent Mode
xAx to xBx or xBx to xAx
t
PLH
Propagation Delay
t
PHL
xLEBA to xAx, xLEAB to xBx
t
PZH
Output Enable Time
t
PZL
xOEBA or xOEAB to xAx or xBx
xCEBA or xCEAB to xAx or xBx
t
PHZ
Output Disable Time
t
PLZ
xOEBA or xOEAB to xAx or xBx
xCEBA or xCEAB to xAx or xBx
t
SU
Set-up Time, HIGH or LOW
xAx or xBx to xLEBA or xLEAB
t
H
Hold Time HIGH or LOW
xAx or xBx to xLEBA or xLEAB
t
W
xLEBA or xLEAB Pulse Width LOW
t
SK
(o) Output Skew
(3)
Condition
(1)
C
L
= 50pF
R
L
= 500Ω
Min
.
(2)
1.5
Max
.
5.1
Min
.
(2)
1.5
Mil.
Max
.
6.1
Min
.
(2)
1.5
FCT162543ET
Com'l.
Max
.
3.4
Min
.
(2)
—
Mil.
Max
.
—
Unit
ns
1.5
1.5
5.6
7.8
1.5
1.5
8
9
1.5
1.5
3.7
4.8
—
—
—
—
ns
ns
1.5
6.5
1.5
7.5
1.5
4
—
—
ns
2
2
4
—
—
—
—
0.5
2
2
5
—
—
—
—
0.5
1
1
3
(4)
—
—
—
—
0.5
—
—
—
—
—
—
—
—
ns
ns
ns
ns
NOTES:
1. See test circuits and waveforms.
2. Minimum limits are guaranteed but not tested on Propagation Delays.
3. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
4. This limit is guaranteed but not tested.
5
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