4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16
| 参数名称 | 属性值 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | CERDIP-16 |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.05 mm |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | 66 dB |
| 通态电阻匹配规范 | 15.4 Ω |
| 最大通态电阻 (Ron) | 300 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | JFET |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-8771801EX | 5962-8771802EX | 5962-8771602EX | 5962-8771601EX | |
|---|---|---|---|---|
| 描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, CDIP16, CERDIP-16, Multiplexer or Switch |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP |
| 包装说明 | CERDIP-16 | CERDIP-16 | DIP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | compliant | compliant |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
| 长度 | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 4 | 4 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | 66 dB | 66 dB | 60 dB | 60 dB |
| 通态电阻匹配规范 | 15.4 Ω | 27 Ω | 80 Ω | 45 Ω |
| 最大通态电阻 (Ron) | 300 Ω | 400 Ω | 400 Ω | 300 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Qualified | Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | NO | NO |
| 技术 | JFET | JFET | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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