IC SPECIALTY ANALOG CIRCUIT, CDIP14, CERAMIC, DIP-14, Analog IC:Other
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
| JESD-30 代码 | R-GDIP-T14 |
| JESD-609代码 | e0 |
| 长度 | 19.43 mm |
| 标称负供电电压 (Vsup) | -5 V |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | +-5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大供电电流 (Isup) | 63 mA |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9451701MCA | 5962-9451701M2A | CLC522AJ-QML | CLC522A8D | CLC522AJE-TR13 | |
|---|---|---|---|---|---|
| 描述 | IC SPECIALTY ANALOG CIRCUIT, CDIP14, CERAMIC, DIP-14, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, CQCC20, Analog IC:Other | IC OP-AMP, 165 MHz BAND WIDTH, CDIP8, CERDIP-14, Operational Amplifier | IC SPECIALTY ANALOG CIRCUIT, CDIP14, CERDIP-14, Analog IC:Other | IC SPECIALTY ANALOG CIRCUIT, PDSO14, 0.150 INCH, PLASTIC, SOP-14, Analog IC:Other |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP14,.3 | QCCN, LCC20,.35SQ | DIP, DIP14,.3 | DIP, DIP14,.3 | SOP, SOP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-GDIP-T14 | S-CQCC-N20 | R-GDIP-T8 | R-GDIP-T14 | R-PDSO-G14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 19.43 mm | 8.89 mm | 19.43 mm | 19.43 mm | 8.65 mm |
| 标称负供电电压 (Vsup) | -5 V | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 20 | 8 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DIP | QCCN | DIP | DIP | SOP |
| 封装等效代码 | DIP14,.3 | LCC20,.35SQ | DIP14,.3 | DIP14,.3 | SOP14,.3 |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | +-5 V | +-5 V | +-5 V | +-5 V | +-5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 1.905 mm | 5.08 mm | 5.08 mm | 1.75 mm |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) - hot dipped | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 8.89 mm | 7.62 mm | 7.62 mm | 3.9 mm |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） |
| 模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | - | ANALOG CIRCUIT | ANALOG CIRCUIT |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | - |
| 最大供电电流 (Isup) | 63 mA | 63 mA | - | 63 mA | 63 mA |
| Base Number Matches | 1 | 1 | 1 | - | - |
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