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MPC5606BK0BMLL6R

产品描述RISC MICROCONTROLLER
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小762KB,共96页
制造商NXP(恩智浦)
官网地址https://www.nxp.com
下载文档 详细参数 全文预览

MPC5606BK0BMLL6R概述

RISC MICROCONTROLLER

MPC5606BK0BMLL6R规格参数

参数名称属性值
厂商名称NXP(恩智浦)
包装说明,
Reach Compliance Codeunknown
技术CMOS
uPs/uCs/外围集成电路类型MICROCONTROLLER, RISC
Base Number Matches1

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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: MPC5606B
Rev. 3, 9/2013
MPC5606BK
100 LQFP
14 mm x 14 mm
144 LQFP
20 mm x 20 mm
Qorivva MPC5606BK
Microcontroller Data Sheet
1
1.1
176 LQFP
24 mm x 24 mm
Introduction
Document overview
1
This document describes the features of the family and
options available within the family members, and highlights
important electrical and physical characteristics of the device.
2
3
1.2
Description
This family of 32-bit system-on-chip (SoC) microcontrollers
is the latest achievement in integrated automotive application
controllers. It belongs to an expanding family of
automotive-focused products designed to address the next
wave of body electronics applications within the vehicle.
The advanced and cost-efficient e200z0 host processor core of
this automotive controller family complies with the Power
Architecture
®
technology and only implements the VLE
(variable-length encoding) APU (Auxiliary Processor Unit),
providing improved code density. It operates at speeds of up
to 64 MHz and offers high performance processing optimized
for low power consumption. It capitalizes on the available
development infrastructure of current Power Architecture
devices and is supported with software drivers, operating
systems and configuration code to assist with users
implementations.
4
5
6
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Device comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.4 Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package pinouts and signal descriptions . . . . . . . . . . . . . . . . . . 4
2.1 Package pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2 Pin muxing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.1 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.2 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.3 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . 27
3.4 Recommended operating conditions . . . . . . . . . . . . . . . 28
3.5 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 31
3.6 I/O pad electrical characteristics . . . . . . . . . . . . . . . . . . 33
3.7 RESET electrical characteristics . . . . . . . . . . . . . . . . . . 45
3.8 Power management electrical characteristics . . . . . . . . 48
3.9 Power consumption in different application modes . . . . 53
3.10 Flash memory electrical characteristics . . . . . . . . . . . . . 54
3.11 Electromagnetic compatibility (EMC) characteristics . . . 56
3.12 Fast external crystal oscillator (4 to 16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
3.13 Slow external crystal oscillator (32 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
3.14 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . . 63
3.15 Fast internal RC oscillator (16 MHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
3.16 Slow internal RC oscillator (128 kHz) electrical
characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
3.17 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . . 66
3.18 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4.1 Package mechanical data. . . . . . . . . . . . . . . . . . . . . . . . 86
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
© Freescale Semiconductor, Inc., 2011–2013. All rights reserved.

 
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