电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N5937UR-1E3

产品描述Zener Diode, 33V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小377KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

1N5937UR-1E3概述

Zener Diode, 33V V(Z), 20%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, GLASS, MELF-2

1N5937UR-1E3规格参数

参数名称属性值
包装说明O-LELF-R2
Reach Compliance Codecompli
ECCN代码EAR99
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
极性UNIDIRECTIONAL
最大功率耗散1.25 W
标称参考电压33 V
表面贴装YES
技术ZENER
端子形式WRAP AROUND
端子位置END
最大电压容差20%
工作测试电流11.4 mA
Base Number Matches1

文档预览

下载PDF文档
1N5913BUR-1 thru 1N5956BUR-1
(or MLL5913B thru MLL5956B)
SCOTTSDALE DIVISION
METALLURGICALLY BONDED GLASS
SURFACE MOUNT 1.5 WATT ZENERS
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB
package is similar in electrical features to the JEDEC registered 1N5913B
thru 1N5956B axial-leaded package for 3.3 to 200 V. It is an ideal selection
for applications of high density and low parasitic requirements. Due to its
glass hermetic qualities and metallurgically enhanced internal contacts, it
may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as
described in Features below. Zener voltage tolerance options are identified
by part number suffix including tight-tolerance. A variety of other Zener
product offerings and packages are available by Microsemi to meet higher
or lower power and test current applications.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Electrically similar to the JEDEC registered 1N5913B
thru 1N5956B zener series
Zener voltages available 3.3V to 200V
Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers, e.g. MX1N5913BUR-1,
MV1N5923CUR-1, MSP1N5952DUR-1, etc.
Surface mount equivalents also available as
SMBJ5913B to SMBJ5956B, SMBG5913B to
SMBG5956B, or SMAJ5913B to SMAJ5956B (see
separate data sheets)
Plastic body axial-leaded Zener equivalents are also
available as 1N5913BP to 1N5956BP (see separate
data sheet)
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 3.3 to 200 V
Leadless package for surface mounting
Ideal for high density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Standard voltage tolerances are +/- 5% with B suffix
and 10 % with A suffix identification
Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to +175
º
C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4
PC board (1 oz Cu) with recommended footprint (see
last page)
Steady-State Power: 1.50 watts at T
EC
< 115
o
C, or
1.25 watts at T
A
= 25
º
C when mounted on FR4 PC
board and recommended footprint as described for
thermal resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed DO-213AB glass MELF
package
TERMINALS: End caps, tin-lead plated solderable
per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-B
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N5913BUR-1−1N5956BUR-1
Copyright
2002
11-05-2003 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
几个单片机之间如何实现通信
用一个单片机作为主机,其余作为从机,主从之间可以互相通信,另请问,51单片机的串口可以做全双工通信吗...
yuyangjing 嵌入式系统
DSP系统电源的设计
DSP系统一般有两种电压:核供电 (低, 多为 1.2, 1.6, 1.8V) 和 I/O (高, 多为5 3.3, 2.5V) ,两者供电是分开的。 电源加电顺序: 核电压要比 I/O 电压先加载, 至少要同时加载。如果IO电压 ......
程序天使 DSP 与 ARM 处理器
raw-os 2.002 发布
raw-os 2.002 发布 下载的地址为: http://www.raw-os.org/download.html 更新方法为直接覆盖原有的工程代码,一行代码也不需要修改。 更新的内容主要为: 1 内核模块的一些细微逻辑的调整 ......
jorya_txj 嵌入式系统
智能手机的硬件体系结构
本帖最后由 jameswangsynnex 于 2015-3-3 19:59 编辑 随着通信产业的不断发展,移动终端已经由原来单一的通话功能向话音、数据、图像、音乐和多媒体方向综合演变。   而对于移动终端,基本 ......
小丸子 消费电子
2013年TI ARM Day技术研讨会(北京站现场图文直播)参与回复送板子哦!
127889 2013 TIARMDay 于2013年9月5日上午9点在北京知春路皇冠假日酒店准时召开,本次会议针对 ARM 产品系列进行了全方位的介绍,并有动手实验课程带您零距离体验 TI 开发工具。系统级解决方 ......
eric_wang TI技术论坛
dll编译问题
请问各位大侠,我有一个在PC机上编译调试好的dll程序,现在想在pda上用该dll,有没有办法直接把程序编译成windows mobile 5.0选用的dll呢?...
jincheng702 嵌入式系统

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 929  2002  2407  1616  2061  57  3  20  25  11 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved