Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, DIP-22
参数名称 | 属性值 |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 22 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.2.C |
最长访问时间 | 45 ns |
JESD-30 代码 | R-CDIP-T22 |
长度 | 29.337 mm |
内存密度 | 65536 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 4 |
功能数量 | 1 |
端子数量 | 22 |
字数 | 16384 words |
字数代码 | 16000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 16KX4 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class C |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
5962-8685922TA | 5962-8685924TA | 5962-8685921TA | 5962-8685920TA | 5962-8969206XA | 5962-8969204XA | 5962-8685923TA | 5962-8969202XA | 5962-8685919TA | MT5C6804C-20/883C | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 45ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 25ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 20ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 35ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 15ns, CMOS, CDIP22, DIP-22 | Standard SRAM, 16KX4, 55ns, CMOS, CDIP22, DIP-22 | Standard SRAM |
包装说明 | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | , |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
零件包装代码 | DIP | DIP | DIP | DIP | - | - | DIP | - | DIP | - |
针数 | 22 | 22 | 22 | 22 | - | - | 22 | - | 22 | - |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
最长访问时间 | 45 ns | 35 ns | 45 ns | 55 ns | 25 ns | 20 ns | 35 ns | 15 ns | 55 ns | - |
JESD-30 代码 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | R-CDIP-T22 | - |
长度 | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | 29.337 mm | - |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | - |
内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | - |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
端子数量 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | - |
字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | - |
字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | - |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
组织 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | 16KX4 | - |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | - |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | - |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
筛选级别 | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | MIL-STD-883 Class C | - |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | - |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO | NO | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | - |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | - |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | - |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | - |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
厂商名称 | - | Micross | Micross | Micross | Micross | Micross | Micross | Micross | Micross | Micross |
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