IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch
参数名称 | 属性值 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 16 |
Reach Compliance Code | unknown |
系列 | F/FAST |
JESD-30 代码 | R-CDFP-F16 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP |
位数 | 6 |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
最大电源电流(ICC) | 45 mA |
传播延迟(tpd) | 11.5 ns |
认证状态 | Not Qualified |
座面最大高度 | 2.159 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
宽度 | 6.731 mm |
最小 fmax | 80 MHz |
Base Number Matches | 1 |
54F174/BFA | N54F174/B2A | 54F174/BEA | N54F174/BFA | 54F174/B2A | |
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描述 | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, FF/Latch | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16, FF/Latch | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, FP-16, FF/Latch | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LLCC-20, FF/Latch |
零件包装代码 | DFP | QLCC | DIP | DFP | QLCC |
包装说明 | DFP, | QCCN, | DIP, | DFP, | QCCN, |
针数 | 16 | 20 | 16 | 16 | 20 |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown |
系列 | F/FAST | F/FAST | F/FAST | F/FAST | F/FAST |
JESD-30 代码 | R-CDFP-F16 | S-CQCC-N20 | R-GDIP-T16 | R-CDFP-F16 | S-CQCC-N20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
位数 | 6 | 6 | 6 | 6 | 6 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 20 | 16 | 16 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | QCCN | DIP | DFP | QCCN |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER |
最大电源电流(ICC) | 45 mA | 45 mA | 45 mA | 45 mA | 45 mA |
传播延迟(tpd) | 11.5 ns | 11.5 ns | 11.5 ns | 11.5 ns | 11.5 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.159 mm | 1.905 mm | 5.08 mm | 2.159 mm | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | YES |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
宽度 | 6.731 mm | 8.89 mm | 7.62 mm | 6.731 mm | 8.89 mm |
最小 fmax | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
长度 | - | 8.89 mm | 19.05 mm | - | 8.89 mm |
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