IC 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, MO-137AB, QSOP-16, Power Management Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | SSOP |
| 包装说明 | MO-137AB, QSOP-16 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | STAND BY MODE |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 4.9022 mm |
| 信道数量 | 2 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 220 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.7526 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | OTHER |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.635 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 3.9116 mm |
| Base Number Matches | 1 |
| ADM1022ARQZ-REEL7 | ADM1022ARQ-REEL | ADM1022ARQZ-REEL | |
|---|---|---|---|
| 描述 | IC 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, MO-137AB, QSOP-16, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, MO-137AB, QSOP-16, Power Management Circuit | IC 2-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO16, MO-137AB, QSOP-16, Power Management Circuit |
| 是否Rohs认证 | 不符合 | 不符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | SSOP | SSOP | SSOP |
| 包装说明 | MO-137AB, QSOP-16 | MO-137AB, QSOP-16 | SSOP, |
| 针数 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | not_compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 其他特性 | STAND BY MODE | STAND BY MODE | STAND BY MODE |
| 可调阈值 | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e3 |
| 长度 | 4.9022 mm | 4.9022 mm | 4.9022 mm |
| 信道数量 | 2 | 2 | 2 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | SSOP | SSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 220 | 240 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.7526 mm | 1.7526 mm | 1.7526 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 温度等级 | OTHER | OTHER | OTHER |
| 端子面层 | TIN LEAD | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 40 |
| 宽度 | 3.9116 mm | 3.9116 mm | 3.9116 mm |
| Base Number Matches | 1 | 1 | 1 |
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