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5962-9458506HMX

产品描述EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQMA68, DUAL CAVITY, CERAMIC, QFP-68
产品类别存储    存储   
文件大小172KB,共12页
制造商Micross
官网地址https://www.micross.com
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5962-9458506HMX概述

EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQMA68, DUAL CAVITY, CERAMIC, QFP-68

5962-9458506HMX规格参数

参数名称属性值
零件包装代码QMA
包装说明DUAL CAVITY, CERAMIC, QFP-68
针数68
Reach Compliance Codecompliant
ECCN代码3A001.A.2.C
最长访问时间120 ns
其他特性USER CONFIGURABLE AS 512K X 8
备用内存宽度16
JESD-30 代码S-CQMA-G68
内存密度4194304 bit
内存集成电路类型EEPROM MODULE
内存宽度32
功能数量1
端子数量68
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX32
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状SQUARE
封装形式MICROELECTRONIC ASSEMBLY
并行/串行PARALLEL
编程电压5 V
认证状态Not Qualified
筛选级别MIL-STD-883
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式GULL WING
端子位置QUAD
最长写入周期时间 (tWC)10 ms
Base Number Matches1

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ACT–E128K32 High Speed
4 Megabit EEPROM Multichip Module
Features
Package
Organized as 128K x 32
User
CIRCUIT TECHNOLOGY
www.aeroflex.com
4 Low Power 128K x 8 EEPROM Die in One MCM
Packaging – Hermetic Ceramic
Configurable to 256K x 16 or 512K x 8
CMOS and TTL Compatible Inputs and Outputs
Access Times of 120,140,150, 200, 250& 300ns
+5V ±10% Supply
Automatic Page Write Operation
Page Write Cycle Time: 10ms Max
Data Retention Ten Years Minimum
Low Power CMOS
Data Polling for End of Write Detection
Industry Standard Pinouts
66 Pin, 1.08" x 1.08" x .160" PGA Type, No Shoulder,
Aeroflex code# "P3"
66 Pin, 1.08" x 1.08" x .185" PGA Type, With
Shoulder, Aeroflex code# "P7"
68 Lead, .88" x .88" x .200" Dual-Cavity Small
Outline Gull Wing, Aeroflex code# "F2"
(Drops into
the 68 Lead JEDEC .99"SQ CQFJ footprint)
MIL-PRF-38534 Compliant MCMs Available
Hardware and Software Data Protection
Internal Decoupling Capacitors for Low Noise
Operation
Commercial, Industrial and Military Temperature
Ranges
SMD# 5962–94585 Released (P7 & F2)
General Description
Block Diagram – PGA Type Package (P3,P7) & CQFP (F2)
The ACT–E128K32 is a high
speed, 4 megabit, CMOS
EEPROM multichip module
(MCM) designed for full
temperature range military,
space, or high reliability
applications. The MCM can be
organized as a 256K x 16 bits
or 512K x 8 bits device and is
input and output CMOS and
TTL compatible. Writing is
executed when the write enable
(WE) and chip enable (CE)
inputs are low and output
enable (OE) is high. Reading is
accomplished when WE is high
and CE and OE are both low.
Access
times
grades
of
120, 140, 150, 200, 250 & 300ns
are standard.
The
ACT–E128K32
is
packaged in a choice of
hermetically sealed co-fired
ceramic packages, a 66 pin,
1.08" sq PGA or a 68 lead, .88"
sq gullwing CQFP. The device
operates over the temperature
range of -55°C to +125°C and
military environment.
WE
1
CE
1
WE
2
CE
2
WE
3
CE
3
WE
4
CE
4
A
0
– A
16
OE
128Kx8
128Kx8
128Kx8
128Kx8
8
8
8
8
I/O
0-7
I/O
8-15
I/O
16
-
23
I/O
24-31
Pin Description
I/O
0-31
Data I/O
A
0–16
Address Inputs
WE
1-4
Write Enables
OE
CE
1-4
V
CC
GND
Output Enable
Chip Enables
Power Supply
Ground
eroflex Circuit Technology - Advanced Multichip Modules © SCD1662 REV B 9/5/01

5962-9458506HMX相似产品对比

5962-9458506HMX 5962-9458506H4X 5962-9458506H5X
描述 EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CQMA68, DUAL CAVITY, CERAMIC, QFP-68 EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66 EEPROM Module, 128KX32, 120ns, Parallel, CMOS, CPGA66, CERAMIC, PGA-66
零件包装代码 QMA PGA PGA
包装说明 DUAL CAVITY, CERAMIC, QFP-68 CERAMIC, PGA-66 CERAMIC, PGA-66
针数 68 66 66
Reach Compliance Code compliant compli compliant
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C
最长访问时间 120 ns 120 ns 120 ns
其他特性 USER CONFIGURABLE AS 512K X 8 USER CONFIGURABLE AS 512K X 8 USER CONFIGURABLE AS 512K X 8
备用内存宽度 16 16 16
JESD-30 代码 S-CQMA-G68 S-CPGA-P66 S-CPGA-P66
内存密度 4194304 bit 4194304 bi 4194304 bit
内存集成电路类型 EEPROM MODULE EEPROM MODULE EEPROM MODULE
内存宽度 32 32 32
功能数量 1 1 1
端子数量 68 66 66
字数 131072 words 131072 words 131072 words
字数代码 128000 128000 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C
组织 128KX32 128KX32 128KX32
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 SQUARE SQUARE SQUARE
封装形式 MICROELECTRONIC ASSEMBLY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL
编程电压 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883 MIL-STD-883
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 YES NO NO
技术 CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY
端子形式 GULL WING PIN/PEG PIN/PEG
端子位置 QUAD PERPENDICULAR PERPENDICULAR
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms
Base Number Matches 1 1 1
封装代码 - PGA PGA
座面最大高度 - 4.699 mm 4.699 mm
端子节距 - 2.54 mm 2.54 mm

 
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