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GS8180D18D-133IT

产品描述Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
产品类别存储    存储   
文件大小1MB,共28页
制造商GSI Technology
官网地址http://www.gsitechnology.com/
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GS8180D18D-133IT概述

Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165

GS8180D18D-133IT规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称GSI Technology
零件包装代码BGA
包装说明LBGA,
针数165
Reach Compliance Codeunknown
ECCN代码3A991.B.2.B
最长访问时间3 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度1.4 mm
最大供电电压 (Vsup)1.95 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm
Base Number Matches1

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GS8180D18D-250/200/167/133/100
165-Bump BGA
Commercial Temp
Industrial Temp
Features
• Simultaneous Read and Write SigmaQuad™ Interface
• JEDEC-standard pinout and package
• Dual Double Data Rate interface
• Byte Write controls sampled at data-in time
• Burst of 4 Read and Write
• 1.8 V +150/–100 mV core power supply
• 1.5 V or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive strength
• IEEE 1149.1 JTAG-compliant Boundary Scan
• 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package
• Pin-compatible with future 36Mb, 72Mb, and 144Mb devices
• Pb-Free 165-bump BGA package available
18Mb Burst of 4
SigmaQuad SRAM
250 MHz–100 MHz
1.8 V V
DD
1.8 V or 1.5 V I/O
SigmaRAM™ Family Overview
GS8180D18 are built in compliance with the SigmaQuad
SRAM pinout standard for Separate I/O synchronous SRAMs.
They are 18,874,368-bit (18Mb) SRAMs. These are the first in
a family of wide, very low voltage HSTL I/O SRAMs designed
to operate at the speeds needed to implement economical high
performance networking systems.
me
nd
ed
for
-250
Ne
w
Parameter Synopsis
-200
5.0 ns
2.3 ns
-167
6.0 ns
2.5 ns
-133
7.5 ns
3.0 ns
-100
10 ns
3.0 ns
tKHKH
4.0 ns
tKHQV
2.1 ns
Rev: 2.04 4/2005
No
t
Re
co
m
1/28
De
sig
n—
Di
sco
nt
inu
ed
Pr
od
u
SigmaQuad SRAMs are offered in a number of configurations.
Some emulate and enhance other synchronous separate I/O
SRAMs. A higher performance SDR (Single Data Rate) Burst
of 2 version is also offered. The logical differences between
the protocols employed by these RAMs hinge mainly on
various combinations of address bursting, output data
registering, and write cueing. Along with the Common I/O
family of SigmaRAMs, the SigmaQuad family of SRAMs
allows a user to implement the interface protocol best suited to
the task at hand.
Clocking and Addressing Schemes
A Burst of 4 SigmaQuad SRAM is a synchronous device. It
employs two input register clock inputs, K and K. K and K are
independent single-ended clock inputs, not differential inputs
to a single differential clock input buffer. The device also
allows the user to manipulate the output register clock inputs
quasi independently with the C and C clock inputs. C and C are
also independent single-ended clock inputs, not differential
inputs. If the C clocks are tied high, the K clocks are routed
internally to fire the output registers instead.
Because Separate I/O Burst of 4 RAMs always transfer data in
four packets, A0 and A1 are internally set to 0 for the first read
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ct
© 2002, GSI Technology
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