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IDT72P51339L5BBG

产品描述FIFO, 16KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256
产品类别存储    存储   
文件大小829KB,共87页
制造商IDT (Integrated Device Technology)
标准
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IDT72P51339L5BBG概述

FIFO, 16KX36, 3.6ns, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-256

IDT72P51339L5BBG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明BGA, BGA256,16X16,40
针数256
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间3.6 ns
最大时钟频率 (fCLK)200 MHz
周期时间5 ns
JESD-30 代码S-PBGA-B256
JESD-609代码e1
长度17 mm
内存密度589824 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量256
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织16KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA256,16X16,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源1.8 V
认证状态Not Qualified
座面最大高度3.5 mm
最大待机电流0.1 A
最大压摆率0.15 mA
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度17 mm
Base Number Matches1

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1.8V MULTI-QUEUE FLOW-CONTROL DEVICES
(8 QUEUES) 36 BIT WIDE CONFIGURATION
589,824 bits
1,179,648 bits
2,359,296 bits
4,718,592 bits
IDT72P51339
IDT72P51349
IDT72P51359
IDT72P51369
FEATURES
Choose from among the following memory density options:
IDT72P51339
Total Available Memory = 589,824 bits
IDT72P51349
Total Available Memory = 1,179,648 bits
IDT72P51359
Total Available Memory = 2,359,296 bits
IDT72P51369
Total Available Memory = 4,718,592 bits
Configurable from 1 to 8 Queues
Default configuration of 8 or 4 symmetrical queues
Default multi-queue device configurations
– IDT72P51339: 2,048 x 36 x 8Q
– IDT72P51349: 4,096 x 36 x 8Q
– IDT72P51359: 8,192 x 36 x 8Q
– IDT72P51369: 16,384 x 36 x 8Q
Default configuration can be augmented via the queue address
bus
Number of queues and individual queue sizes may be
configured at master reset though serial programming
200 MHz High speed operation (5ns cycle time)
3.6ns access time
Independent Read and Write access per queue
User Selectable Bus Matching Options:
– x36 in to x36 out
– x18 in to x36 out
– x9 in to x36 out
– x36in to x18out
– x18 in to x18 out
– x9 in to x18 out
– x36in to x9out
– x18 in to x9 out
– x9 in to x9 out
User selectable I/O: 1.5V HSTL, 1.8V eHSTL, or 2.5V LVTTL
100% Bus Utilization, Read and Write on every clock cycle
Selectable First Word Fall Through (FWFT) or IDT standard
mode of operation
Ability to operate on packet or word boundaries
Mark and Re-Write operation
Mark and Re-Read operation
Individual, Active queue flags (OR /
EF, IR
/
FF, PAE, PAF, PR)
8 bit parallel flag status on both read and write ports
Direct or polled operation of flag status bus
Expansion of up to 64 queues and/or 32Mb logical configura-
tion using up to 8 multi-queue devices in parallel
JTAG Functionality (Boundary Scan)
Available in a 256-pin PBGA, 1mm pitch, 17mm x 17mm
HIGH Performance submicron CMOS technology
Industrial temperature range (-40°C to +85°C) is available
Green parts available, see Ordering Information
FUNCTIONAL BLOCK DIAGRAM
MULTI-QUEUE FLOW-CONTROL DEVICE
WADEN
FSTR
WRADD
WEN
WCLK
WCS
8
READ CONTROL
Q7
RADEN
ESTR
RDADD
8
WRITE CONTROL
Q6
REN
RCLK
RCS
OE
Q5
Din
Qout
x36, 18 or x9
DATA IN
x36, x18 or x9
DATA OUT
READ FLAGS
EF/OR
PR
PAE
PAEn
8
WRITE FLAGS
FF/IR
PAF
PAFn
8
Q0
PRn
6716 drw01
IDT and the IDT logo are trademarks of Integrated Device Technology, Inc
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
2005
Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
AUGUST 2005
DSC-6716/3

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