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MA4E974L-1000

产品描述SILICON, LOW BARRIER SCHOTTKY, S BAND, MIXER DIODE
产品类别分立半导体    二极管   
文件大小62KB,共2页
制造商TE Connectivity(泰科)
官网地址http://www.te.com
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MA4E974L-1000概述

SILICON, LOW BARRIER SCHOTTKY, S BAND, MIXER DIODE

MA4E974L-1000规格参数

参数名称属性值
厂商名称TE Connectivity(泰科)
包装说明S-CXMW-F3
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性HIGH RELIABILITY
最小击穿电压2 V
配置SINGLE
最大二极管电容0.5 pF
二极管元件材料SILICON
二极管类型MIXER DIODE
频带S BAND
JESD-30 代码S-CXMW-F3
元件数量1
端子数量3
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状SQUARE
封装形式MICROWAVE
最大功率耗散0.075 W
认证状态Not Qualified
表面贴装YES
技术SCHOTTKY
端子形式FLAT
端子位置UNSPECIFIED
肖特基势垒类型LOW BARRIER
Base Number Matches1

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Schottky Barrier Packaged
and Beam Lead Tees
Features
q
q
q
q
q
MA4E20, MA4E970 Series
V3.00
Case Styles
Small Physical Size for Microstrip Mounting
High Reliability
Closely Matched Junctions for High Isolation
Three Diode Barrier Heights are Available
Minimum Parasitics for Broadband Designs
Description
Each Schottky barrier beam lead Tee consists of two close-
ly matched diodes connected in the classic Tee configura-
tion. The diodes are formed monolithically to assure close
matching of electrical characteristics such as capacitance,
forward voltage and series resistance. The silicon that
originally connected the diodes on the wafer is removed.
The beam lead construction assures minimum parasitic
capacitance, connecting lead inductance and permits the
interconnection of the diodes into Tees at the wafer level.
Three barrier levels are available allowing different levels
of local oscillator drive power. The L series features a low
barrier for applications which have low available local
oscillator power. Both medium barrier (M series) and high
barrier (H series) devices are available for applications
with higher drive levels. The RF and local oscillator fre-
quencies can range up to 18 GHz with selection of an
appropriate junction capacitance. Each series is available
in three case styles which are compatible with microstrip
or stripline assembly techniques. The 270 case style is her-
metically sealed and is suggested for harsh environments
or for military or high reliability circuits. The 272 case style
is a low cost plastic enclosure similar in case style. The
beam lead case styles 271 and 1012 are designed for max-
imum bandwidth. The case style 271 is a forward tee and
the 1012 is a reverse tee. The case style 1000 is the small-
est stripline package and has the lowest parasitic capaci-
tance and inductance.
271
1012
Absolute Maximum Ratings at 25°C
Parameter
Operating and Storage
Temperature Range
-65°C to +150°C
(Case Style 270, 271 and 1012)
-65°C to +125°C
(Case Styles 272, 1000)
Maximum Power Dissipation
(derate linearly to zero
allowable dissipation at 150°C)
Absolute Maximum
75 mW/junction
235°C for 10 sec. (Case Style 270)
150°C for 5 sec.
(Case Styles 271, 272)
Soldering Temperature
Beam Strength
2g (Case Style 271, 1012)
Case Styles
(See appendix for complete dimensions.)
Specifications Subject to Change Without Notice.
M/A-COM, Inc.
North America:
Tel. (800) 366-2266
Fax (800) 618-8883
s
1
Asia/Pacific: Tel. +81 (03) 3226-1671
Fax +81 (03) 3226-1451
s
Europe: Tel. +44 (1344) 869 595
Fax +44 (1344) 300 020

 
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