ADC, Successive Approximation,
参数名称 | 属性值 |
是否无铅 | 含铅 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 18 |
Reach Compliance Code | unknown |
最大模拟输入电压 | 5 V |
最小模拟输入电压 | -5 V |
最长转换时间 | 40 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-CDIP-T18 |
长度 | 24.38 mm |
标称负供电电压 | -15 V |
模拟输入通道数量 | 1 |
位数 | 8 |
功能数量 | 1 |
端子数量 | 18 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出位码 | OFFSET BINARY |
输出格式 | PARALLEL, 8 BITS |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
采样并保持/跟踪并保持 | SAMPLE |
筛选级别 | MIL-PRF-38535 Class V |
座面最大高度 | 5.08 mm |
标称供电电压 | 5 V |
表面贴装 | NO |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
5962-8680201VA | AD570SD/883B | AD570JD | AD570SD | |
---|---|---|---|---|
描述 | ADC, Successive Approximation, | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP18, SIDE BRAZED, CERAMIC, DIP-18 | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP18, SIDE BRAZED, CERAMIC, DIP-18 | 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, CDIP18, SIDE BRAZED, CERAMIC, DIP-18 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
零件包装代码 | DIP | DIP | DIP | DIP |
包装说明 | DIP, | DIP, | DIP, | DIP, |
针数 | 18 | 18 | 18 | 18 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
最大模拟输入电压 | 5 V | 5 V | 5 V | 5 V |
最小模拟输入电压 | -5 V | -5 V | -5 V | -5 V |
最长转换时间 | 40 µs | 40 µs | 40 µs | 40 µs |
转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
JESD-30 代码 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 | R-CDIP-T18 |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 18 | 18 | 18 | 18 |
最高工作温度 | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | - | -55 °C |
输出位码 | OFFSET BINARY | BINARY | BINARY, OFFSET BINARY | BINARY, OFFSET BINARY |
输出格式 | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
标称供电电压 | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO |
温度等级 | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 |
厂商名称 | Rochester Electronics | - | Rochester Electronics | Rochester Electronics |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 |
JESD-609代码 | - | e0 | e0 | e0 |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
端子面层 | - | TIN LEAD | TIN LEAD | TIN LEAD |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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