电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HCPL-2731#520

产品描述Logic IC Output Optocoupler, 2-Element, 5000V Isolation, 0.1MBps, 0.300 INCH, SURFACE MOUNT, DIP-8
产品类别光电子/LED    光电   
文件大小567KB,共17页
制造商Broadcom(博通)
下载文档 详细参数 全文预览

HCPL-2731#520概述

Logic IC Output Optocoupler, 2-Element, 5000V Isolation, 0.1MBps, 0.300 INCH, SURFACE MOUNT, DIP-8

HCPL-2731#520规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Broadcom(博通)
Reach Compliance Codecompliant
ECCN代码EAR99
Base Number Matches1

文档预览

下载PDF文档
Data Sheet
HCPL-2730/0730/2731/0731
Dual-Channel Low Input Current, High-Gain
Optocouplers
Overview
These dual-channel optocouplers contain a separated pair
of GaAsP light-emitting diodes optically coupled to a pair of
integrated high-gain photodetectors. They provide
extremely high current transfer ratio and excellent
input-output common mode transient immunity. A separate
pin for the photodiodes and first gain stages (V
CC
) permits
lower output saturation voltage and higher speed operation
than possible with conventional photo-darlington type
optocouplers. In addition, V
CC
may be as low as 1.6V
without adversely affecting the parametric performance.
These dual-channel optocouplers are available in an 8-pin
DIP and in an industry standard SO-8 package. The
following is a cross reference table listing the 8-pin DIP part
number and the electrically equivalent SOIC-8 part number.
8-Pin DIP
HCPL-2730
HCPL-2731
SO-8
HCPL-0730
HCPL-0731
Features
High current transfer ratio – 1800% typical
Low input current requirements – 0.5 mA
Low output saturation voltage – 0.1V
High density packaging
Performance guaranteed over temperature 0°C to 70°C
LSTTL compatible
High output current – 60mA
Safety approval:
– UL recognized – 3750 V rms for 1 minute and
5000 Vrms (see Note) for 1 minute
– CSA approved
Available in 8-pin DIP and SO-8 footprint
MIL-PRF-38534 hermetic version available
(HCPL-5730/5731)
Surface mount gull wing option available for 8-pin DIP
(Option 300)
5000 V rms/1 minute withstand voltage rating is for
Option 020 (HCPL-2730, HCPL-2731) products
only.
NOTE:
The SO-8 does not require “through holes” in a PCB. This
package occupies approxmately one-third the footprint area
of the standard dual-inline package. The lead profile is
designed to be compatible with standard surface mount
processes.
CAUTION!
Take normal static precautions in handling and
assembly of this component to prevent
damage, degradation, or both that may be
induced by ESD. The components featured in
this data sheet are not to be used in military or
aerospace applications or environments.
Applications
Digital logic ground isolation
Telephone ring detector
Level shifting
EIA RS-232C line receiver
Polarity sensing
Low input current line receiver – long line or party line
Microprocessor bus isolation
Current loop receiver
Line voltage status indicator – low input power
dissipation
Broadcom
AV02-0546EN
August 25, 2017

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2716  2782  1308  240  1134  38  26  55  36  3 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved