Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Infineon(英飞凌) |
包装说明 | FLANGE MOUNT, S-CSFM-P3 |
Reach Compliance Code | compliant |
其他特性 | AVALANCHE RATED; RADIATION HARDENED |
雪崩能效等级(Eas) | 500 mJ |
外壳连接 | ISOLATED |
配置 | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V |
最大漏极电流 (ID) | 35 A |
最大漏源导通电阻 | 0.03 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-254AA |
JESD-30 代码 | S-CSFM-P3 |
元件数量 | 1 |
端子数量 | 3 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE |
封装形式 | FLANGE MOUNT |
峰值回流温度(摄氏度) | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 140 A |
表面贴装 | NO |
端子形式 | PIN/PEG |
端子位置 | SINGLE |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
Base Number Matches | 1 |
IRHM7054PBF | IRHM8054 | IRHM8054PBF | IRHM3054 | IRHM7054 | |
---|---|---|---|---|---|
描述 | Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3 | Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3 | Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3 | Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3 | Power Field-Effect Transistor, 35A I(D), 60V, 0.03ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-254AA, HERMETIC SEALED, CERAMIC PACKAGE-3 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 |
包装说明 | FLANGE MOUNT, S-CSFM-P3 | HERMETIC SEALED, CERAMIC PACKAGE-3 | FLANGE MOUNT, S-CSFM-P3 | HERMETIC SEALED, CERAMIC PACKAGE-3 | HERMETIC SEALED, CERAMIC PACKAGE-3 |
Reach Compliance Code | compliant | unknown | compliant | compliant | unknown |
雪崩能效等级(Eas) | 500 mJ | 500 mJ | 500 mJ | 500 mJ | 500 mJ |
配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 60 V | 60 V | 60 V | 60 V | 60 V |
最大漏极电流 (ID) | 35 A | 35 A | 35 A | 35 A | 35 A |
最大漏源导通电阻 | 0.03 Ω | 0.03 Ω | 0.03 Ω | 0.03 Ω | 0.03 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-254AA | TO-254AA | TO-254AA | TO-254AA | TO-254AA |
JESD-30 代码 | S-CSFM-P3 | S-CSFM-P3 | S-CSFM-P3 | S-CSFM-P3 | S-CSFM-P3 |
元件数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 | 3 | 3 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 140 A | 140 A | 140 A | 140 A | 140 A |
表面贴装 | NO | NO | NO | NO | NO |
端子形式 | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG | PIN/PEG |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON |
厂商名称 | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | - | Infineon(英飞凌) |
其他特性 | AVALANCHE RATED; RADIATION HARDENED | AVALANCHE RATED; RADIATION HARDENED | AVALANCHE RATED; RADIATION HARDENED | - | AVALANCHE RATED; RADIATION HARDENED |
外壳连接 | ISOLATED | ISOLATED | ISOLATED | - | ISOLATED |
Base Number Matches | 1 | 1 | 1 | 1 | - |
ECCN代码 | - | EAR99 | - | EAR99 | EAR99 |
最大漏极电流 (Abs) (ID) | - | 35 A | - | 35 A | 35 A |
JESD-609代码 | - | e0 | - | e0 | e0 |
最大功率耗散 (Abs) | - | 150 W | - | 150 W | 150 W |
认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified |
端子面层 | - | Tin/Lead (Sn/Pb) | - | TIN LEAD | Tin/Lead (Sn/Pb) |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved