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IDT70V9379L12PRFGI

产品描述Dual-Port SRAM, 32KX18, 12ns, CMOS, PQFP128, TQFP-128
产品类别存储    存储   
文件大小222KB,共15页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT70V9379L12PRFGI概述

Dual-Port SRAM, 32KX18, 12ns, CMOS, PQFP128, TQFP-128

IDT70V9379L12PRFGI规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明TQFP-128
针数128
Reach Compliance Codecompliant
ECCN代码3A991.B.2.B
最长访问时间12 ns
其他特性PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE
JESD-30 代码R-PQFP-G128
JESD-609代码e3
长度20 mm
内存密度589824 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量128
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织32KX18
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

文档预览

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HIGH-SPEED 3.3V 32K x 18
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
Features:
x
x
PRELIMINARY
IDT70V9379L
x
x
x
x
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 7.5/9/12ns (max.)
Low-power operation
– IDT70V9379L
Active: 500mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
x
x
x
x
x
Full synchronous operation on both ports
– 4ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 7.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 12ns cycle time, 83MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for
multiplexed bus and bus matching compatibility
LVTTL- compatible, single 3.3V (±0.3V) power supply
Industrial temperature range (–40°C to +85°C) is
available for selected speeds
Available in a 128-pin Thin Quad Flatpack (TQFP)
Functional Block Diagram
R/
W
L
UB
L
CE
0L
R/
W
R
UB
R
CE
0R
CE
1L
LB
L
OE
L
1
0
0/1
1
0
0/1
CE
1R
LB
R
OE
R
FT
/PIPE
L
0/1
1b 0b
b a
1a 0a
0a 1a
a
b
0b 1b
0/1
FT
/PIPE
R
I/O
9L
-I/O
17L
I/O
0L
-I/O
8L
I/O
Control
I/O
9R
-I/O
17R
I/O
Control
I/O
0R
-I/O
8R
A
14L
A
0L
CLK
L
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A
14R
A
0R
CLK
R
ADS
L
CNTEN
L
CNTRST
L
ADS
R
CNTEN
R
CNTRST
R
4857 drw 01
AUGUST 1999
1
©1999 Integrated Device Technology, Inc.
DSC-4857/1

IDT70V9379L12PRFGI相似产品对比

IDT70V9379L12PRFGI IDT70V9379L12PRFI IDT70V9379L9PRFGI IDT70V9379L9PRFGI8 IDT70V9379L7PRFGI IDT70V9379L7PRFI
描述 Dual-Port SRAM, 32KX18, 12ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 32KX18, 12ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 32KX18, 9ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 32KX18, 9ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 32KX18, 7.5ns, CMOS, PQFP128, TQFP-128 Dual-Port SRAM, 32KX18, 7.5ns, CMOS, PQFP128, TQFP-128
是否无铅 不含铅 含铅 不含铅 不含铅 不含铅 含铅
是否Rohs认证 符合 不符合 符合 符合 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP QFP QFP
包装说明 TQFP-128 TQFP-128 TQFP-128 TQFP-128 TQFP-128 TQFP-128
针数 128 128 128 128 128 128
Reach Compliance Code compliant not_compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B 3A991.B.2.B
最长访问时间 12 ns 12 ns 9 ns 9 ns 7.5 ns 7.5 ns
其他特性 PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE
JESD-30 代码 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609代码 e3 e0 e3 e3 e3 e0
长度 20 mm 20 mm 20 mm 20 mm 20 mm 20 mm
内存密度 589824 bit 589824 bit 589824 bit 589824 bit 589824 bit 589824 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 18 18 18 18 18 18
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 128 128 128 128 128 128
字数 32768 words 32768 words 32768 words 32768 words 32768 words 32768 words
字数代码 32000 32000 32000 32000 32000 32000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 32KX18 32KX18 32KX18 32KX18 32KX18 32KX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP LFQFP LFQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 240 260 260 260 240
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 MATTE TIN TIN LEAD MATTE TIN MATTE TIN Matte Tin (Sn) TIN LEAD
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 20 30 30 30 20
宽度 14 mm 14 mm 14 mm 14 mm 14 mm 14 mm

 
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