REVISIONS
LTR
A
B
C
DESCRIPTION
Change in paragraph 1.3, 1.4, 4.3.1c and figure 3. Technical changes in table
I. Editorial changes throughout.
Add vendor CAGE F8859. Add device Class V criteria. Add delta limits, table
III. Add case outline X. Update boilerplate. Editorial changes throughout. – lgt
Change to the propagation delay time value,
E
1
to
On
test in table I. Update
to latest MIL-PRF-38535 requirements. - lgt
Add section 1.5, radiation features. Update the boilerplate to include radiation
hardness assured requirements. Editorial changes throughout. - LTG
Add appendix A, microcircuit die. Update the boilerplate to MIL-PRF-38535
requirements and to include radiation hardness assurance requirements. - jak
Add device with case outline Y. Add case outline Y for flat pack with the
grounded lid to section 1.2.4 and figure 1. Update radiation features in section
1.5 and SEP table IB. Update the boilerplate paragraphs to MIL-PRF-38535
requirements - MAA
DATE (YR-MO-DA)
88-11-30
00-10-23
01-01-30
APPROVED
D. R. Cool
Raymond Monnin
Raymond Monnin
D
04-05-14
Charles F. Saffle
E
07-03-07
Thomas M. Hess
F
13-05-14
Thomas M. Hess
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
F
15
F
16
F
17
F
18
REV
SHEET
PREPARED BY
Jeffery Tunstall
F
19
F
20
F
21
F
1
F
22
F
2
F
23
F
3
F
24
F
4
F
5
F
6
F
7
F
8
F
9
F
10
F
11
F
12
F
13
F
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
Ray Monnin
APPROVED BY
D. R. Cool
DRAWING APPROVAL DATE
87-08-12
REVISION LEVEL
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
MICROCIRCUIT, DIGITAL, ADVANCED
CMOS, RADIATION HARDENED, 1-OF-8
DECODER/DEMULTIPLEXER,
MONOLITHIC SILICON
SIZE
CAGE CODE
AMSC N/A
F
A
67268
SHEET
1 OF
5962-87622
24
DSCC FORM 2233
APR 97
5962-E377-13
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
For device classes M and Q:
5962
-
87622
01
E
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
For device class V:
5962
F
87622
01
V
X
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
\/
Drawing number
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
54AC138
Circuit function
1-of-8 decoder/demultiplexer
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
F
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
E
F
2
X
Y
Descriptive designator
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
CDFP4-F16
CDFP4-F16
Terminals
16
16
20
16
16
Package style
Dual-in-line
Flat pack
Square leadless chip carrier
Flat pack 7/
Flat pack 8/
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/ 2/ 3/
Supply voltage range (V
CC
) .................................................................................. -0.5 V dc to +7.0 V dc
DC input voltage range (V
IN
) ................................................................................ -0.5 V dc to V
CC
+ 0.5 V dc
DC output voltage range (V
OUT
) ........................................................................... -0.5 V dc to V
CC
+ 0.5 V dc
Clamp diode current (I
IK
, I
OK
) ...............................................................................
±20
mA
DC output current ................................................................................................
±50
mA
DC V
CC
or GND current (per pin) .........................................................................
±50
mA
Storage temperature range (T
STG
) ....................................................................... -65°C to +150°C
Maximum power dissipation (P
D
) ......................................................................... 500 mW
Lead temperature (soldering, 10 seconds) .......................................................... +260°C
Thermal resistance, junction-to-case (θ
JC
) ........................................................... See MIL-STD-1835
Junction temperature (T
J
) ................................................................................... +175°C 4/
1.4 Recommended operating conditions. 2/ 3/ 5/
Supply voltage range (V
CC
) .................................................................................. +2.0 V dc to +6.0 V dc
Input voltage range (V
IN
) ...................................................................................... +0.0 V dc to V
CC
Output voltage range (V
OUT
)................................................................................. +0.0 V dc to V
CC
Case operating temperature range (T
C
) ............................................................... -55°C to +125°C
Input rise or fall times (t
r
, t
f
):
V
CC
= 3.6 V .................................................................................................... 0 to 8 ns
V
CC
= 5.5 V .................................................................................................... 0 to 8 ns
1.5 Radiation features.
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) .................... 300 krads (Si)
Single Event Phenomenon (SEP):
2
No Single Event Latchup (SEL) occurs at effective LET (see 4.4.4.2) .......... ≤ 93 MeV–cm /mg 6/
2
No Single Event upsets (SEU) occurs at effective LET (see 4.4.4.2) ........... ≤ 93 MeV–cm /mg 6/
1/
2/
3/
4/
5/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise noted, all voltages are referenced to GND.
The limits for the parameters specified herein shall apply over the full specified V
CC
range and case temperature range of
-55°C to +125°C.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
Operation from 2.0 V dc to 3.0 V dc is provided for compatibility with data retention and battery back-up systems. Data
retention implies no input transition and no stored data loss with the following conditions: V
IH
≥
70% V
CC
, V
IL
≤
30% V
CC
,
V
OH
≥
70% V
CC
@ -20µA, V
OL
≤
30% V
CC
@ 20
µA.
Limits are guaranteed by design or process, but not production tested unless specified by the customer through the
purchase order or contract.
Package case outline X flat pack with isolated lid.
Package case outline Y flat pack with grounded lid.
6/
7/
8/
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
F
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil/
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JEDEC Standard JESD20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed
CMOS Devices.
((Copies of these documents are available online at
http://www.jedec.org
or from JEDEC – Solid State Technology
th
Association, 3103 North 10 Street, Suite 240-S Arlington, VA 22201)
ASTM INTERNATIONAL (ASTM)
ASTM F1192
-
Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion
Irradiation of semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from ASTM International, 100 Barr Harbor Drive,
P.O. Box C700, West Conshohocken, PA, 19428-2959).
2.3 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements of microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
F
4
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth table. The truth table shall be as specified on figure 2.
3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3.
3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4.
3.2.6 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing or acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table IA and shall apply over the
full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-
PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or
for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime-VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime's agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 39 (see MIL-PRF-38535, appendix A).
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87622
SHEET
F
5
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