HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E
5962-93140
90 V/1.0 Ω, Hermetically Sealed, Power MOSFET Optocoupler
Data Sheet
Description
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and
SMD 5962-93140 are single channel power MOSFET
optocouplers, constructed in eight-pin, hermetic, dual-
in-line, ceramic packages. The devices operate exactly
like a solid-state relay.
The products are capable of operation and storage
over the full military temperature range and may be
purchased as a standard product (HSSR-7110), with full
MIL-PRF-38534 Class H testing (HSSR-7111 and HSSR-
7112), with MIL-PRF-38534 Class E testing (Class K with
exceptions) (HSSR-711E) or from the DSCC Standard Mi-
crocircuit Drawing (SMD) 5962-93140. Details of the Class
E program may be found on page 11 of this datasheet.
Features
•
Dual Marked with Device Part Number and DSCC
Standard Microcircuit Drawing
•
ac½dc Signal ½½ Power Switching
•
Compact Solid-State ½idirectional Switch
•
Manufactured and Tested on a MIL-PRF-38534
Certified Line
•
½ML-38534
•
MIL-PRF-38534 Class H
•
Modified Space Level Processing ½vailable
(Class E)
•
Hermetically Sealed 8-Pin Dual In-Line Package
•
Small Si½e and ½eight
•
Performance ½uaranteed over -55½C to ½125½C
•
Connection ½ 0.8 ½, 1.0 ½
•
Connection ½ 1.6 ½, 0.25 ½
•
1500 ½dc ½ithstand Test ½oltage
•
High Transient Immunity
•
5 ½mp Output Surge Current
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
1 NC
+ 2
- 3
4 NC
8
7
6
5
V
O
-
I
O
+
I
F
V
F
CONNECTION B
DC CONNECTION
1 NC
+ 2
- 3
4 NC
TRUTH TABLE
INPUT
H
L
OUTPUT
CLOSED
OPEN
I
F
V
F
8
7
6
5
I
O
+
V
O
-
Applications
•
•
•
•
•
•
Military and Space
High Reliability Systems
Standard 28 ½dc and 48 ½dc Load Driver
Standard 24 ½ac Load Driver
½ircraft Controls
ac½dc Electromechanical and Solid State Relay
Replacement
•
I½O Modules
•
Harsh Industrial Environments
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
½ll devices are manufactured and tested on a MIL-
PRF-38534 certified line and are included in the DSCC
½ualified Manufacturers List, ½ML-38534 for Hybrid Mi-
crocircuits. Each device contains an ½l½a½s light emitting
diode optically coupled to a photovoltaic diode stack
which drives two discrete power MOSFETs. The device
operates as a solid-state replacement for single-pole,
normally open, (1 Form ½) relay used for general purpose
switching of signals and loads in high reliability applica-
tions.
The devices feature logic level input control and very low
output on-resistance, making them suitable for both ac
and dc loads. Connection ½, as shown in the Functional
Diagram, allows the device to switch either ac or dc loads.
Connection ½, with the polarity and pin configuration
as shown, allows the device to switch dc loads only. The
advantage of Connection ½ is that the on-resistance is
significantly reduced, and the output current capability
increases by a factor of two.
The devices are convenient replacements for mechanical
and solid state relays where high component reliability
with standard footprint lead configuration is desirable.
Devices may be purchased with a variety of lead bend
and plating options. See Selection ½uide table for details.
Standard Microcircuit Drawing (SMD) parts are available
for each package and lead style.
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E and
SMD 5962-93140 are designed to switch loads on 28 ½dc
power systems. They meet 80 ½ surge and ± 600 ½ spike
requirements.
Selection Guide – Lead Configuration Options
Avago Technologies’s Part Number and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class E
Standard Lead Finish
Solder Dipped*
Butt Joint/Gold Plate
Gull Wing/Soldered*
Crew Cut/Gold Plate
SMD Part Number
Prescript for all below
Either Gold or Soldered
Gold Plate
Solder Dipped*
Butt Joint/Gold Plate
Butt Joint/Soldered*
Gull Wing/Soldered*
Crew Cut/Gold Plate
Crew Cut/Soldered*
* Solder Contains Lead
HSSR-7110
HSSR-7111
Gold Plate
Option #200
Option #100
Option #300
Option #600
5962-
9314001HPX
9314001HPC
9314001HPA
9314001HYC
9314001HYA
9314001HXA
9314001HZC
9314001HZA
5962-
9314002HPX
9314002HPC
9314002HPA
9314002HYC
9314002HYA
9314002HXA
9314001EPX
9314001EPC
9314001EPA
HSSR-7112
HSSR-711E
Gold Plate
Option -200
Option -100
Option -300
Gold Plate
Option -200
CAUTION: Maximum Switching Frequency – Care should be taken during repetitive switching of loads so as not to exceed the
maximum output current, maximum output power dissipation, maximum case temperature, and maximum junction temperature.
2
Outline Drawing
8-pin DIP Through Hole
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
Device Marking
AVAGO
DESIGNATOR
AVAGO P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX
(IF NEEDED)
COUNTRY OF MFR.
AVAGO CAGE CODE*
* QUALIFIED PARTS ONLY
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
Thermal Resistance
Maximum Output MOSFET Junction to Case – θ
JC
= 15½C½
½
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
ESD Classification
(MIL-STD-883, Method 3015) .......................... (
), Class 2
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Absolute Maximum Ratings
Parameter
Storage Temperature Range
Operating Ambient Temperature
Junction Temperature
Operating Case Temperature
Lead Solder Temperature
(1.6 mm below seating plane)
Average Input Current
Peak Repetitive Input Current
(Pulse Width < 100 ms; duty cycle < 50%)
Peak Surge Input Current
(Pulse Width < 0.2 ms; duty cycle < 0.1%)
Reverse Input Voltage
Average Output Current - Figure 2
Connection A
Connection B
Single Shot Output Current - Figure 3
Connection A (Pulse width < 10 ms)
Connection B (Pulse width < 10 ms)
Output Voltage
Connection A
Connection B
Average Output Power Dissipation - Figure 4
I
F
I
FPK
I
FPK surge
V
R
I
O
Symbol
T
S
T
A
T
J
T
C
Min.
-65°
-55°
Max.
+150°
+125°
+150°
+145°
260° for 10 s
20
40
100
5
0.8
1.6
5.0
10.0
-90
0
90
90
800
Units
C
C
C
C
C
mA
mA
mA
V
A
A
A
A
V
V
mW
2
1
Note
I
OPK surge
V
O
3
Recommended Operating Conditions
Parameter
Input Current (on)
Input Current (on)
Input Voltage (off)
Operating Temperature
Symbol
I
F(ON)
I
F(ON)
V
F(OFF)
T
A
Min.
5
10
0
-55°
Max.
20
20
0.6
+125°
Units
mA
mA
V
C
Note
10
11
Hermetic Optocoupler Options
Note:
Dimensions in millimeters (inches).
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel
product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product. DSCC Drawing part
numbers contain provisions for lead finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and
hi-rel product. This option has solder dipped leads.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5˚ MAX.
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel
product.
3.81 (0.150)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
0.20 (0.008)
0.33 (0.013)
1.02 (0.040)
TYP.
7.36 (0.290)
7.87 (0.310)
Note:
Solder contains lead.
4
Electrical Specifications
T
½
=-55½C to ½125½C, unless otherwise specified. See note 9.
Parameter
Output Withstand
Voltage
Output On-Resistance
Connection A
Sym.
|V
O(OFF)
|
R
(ON)
Group A,
Sub-group
1, 2, 3
1, 2, 3
Test Conditions
V
F
= 0.6 V, I
O
= 10
mA
I
F
= 10 mA, I
O
= 800 mA,
(pulse duration
≤
30 ms)
I
F
= 5 mA, I
O
= 800 mA,
(pulse duration
≤
30 ms)
Output On-Resistance
Connection B
R
(ON)
1, 2, 3
I
F
= 10 mA, I
O
= 1.6 A,
(pulse duration
≤
30 ms)
I
F
= 5 mA, I
O
= 1.6 A,
(pulse duration
≤
30 ms)
Output Leakage
Current
Input Forward
Voltage
Input Reverse
Breakdown Voltage
Input-Output
Insulation
Turn On Time
I
O(OFF)
V
F
V
R
I
I-O
t
ON
1, 2, 3
1, 2, 3
V
F
= 0.6 V, V
O
= 90 V
I
F
= 10 mA
I
F
= 5 mA
1, 2, 3
1
9, 10, 11
I
R
= 100
mA
RH
≤
65%, t = 5 s,
V
I-O
= 1500 Vdc, T
A
= 25°C
I
F
= 10 mA, V
DD
= 28 V,
I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28 V,
I
O
= 800 mA
Turn Off Time
t
OFF
9, 10, 11
I
F
= 10 mA, V
DD
= 28 V,
I
O
= 800 mA
I
F
= 5 mA, V
DD
= 28 V,
I
O
= 800 mA
Output Transient
Rejection
Input-Output
Transient Rejection
dVo
dt
dVio
dt
9
9
V
PEAK
= 50 V, C
M
= 1000 pF,
C
L
= 15 pF, R
M
≥
1 MW
V
DD
= 5 V, V
I-O(PEAK)
= 50 V,
R
L
= 20 kW, C
L
= 15 pF
1000
500
0.02
1.25
5.0
1.0
6.0
6.0
0.25
0.25
V/ms
V/ms
17
18
ms
V
mA
ms
1,
10, 11,
12, 13
4, 5
11
10
11
10
1.0
10
-4
1.24
0.12
Min.
90
Typ.*
110
0.40
1.0
1.0
0.25
0.25
10
1.7
mA
V
8
9
11
10
W
6, 7
Max.
Units
V
W
Fig.
5
6, 7
3, 11
3, 10
3, 11
3, 10
Notes
1,
10, 14, 15
5
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