IC AC SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20, Gate
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| 系列 | AC |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 最大I(ol) | 0.012 A |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 11 ns |
| 传播延迟(tpd) | 11.9 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 5962-87549012A | 54AC00MDA | 5962-8754901DA | 5962-8754901CA | 54AC00MDS | |
|---|---|---|---|---|---|
| 描述 | IC AC SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20, Gate | IC AC SERIES, QUAD 2-INPUT NAND GATE, UUC14, Gate | IC AC SERIES, QUAD 2-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14, Gate | IC AC SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14, Gate | IC AC SERIES, QUAD 2-INPUT NAND GATE, UUC14, Gate |
| 包装说明 | QCCN, LCC20,.35SQ | DIE, | DFP, FL14,.3 | DIP, DIP14,.3 | DIE, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
| 系列 | AC | AC | AC | AC | AC |
| JESD-30 代码 | S-CQCC-N20 | X-XUUC-N14 | R-GDFP-F14 | R-GDIP-T14 | X-XUUC-N14 |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 14 | 14 | 14 | 14 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | UNSPECIFIED |
| 封装代码 | QCCN | DIE | DFP | DIP | DIE |
| 封装形状 | SQUARE | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| 封装形式 | CHIP CARRIER | UNCASED CHIP | FLATPACK | IN-LINE | UNCASED CHIP |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 表面贴装 | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | NO LEAD | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD |
| 端子位置 | QUAD | UPPER | DUAL | DUAL | UPPER |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 符合 |
| 负载电容(CL) | 50 pF | - | 50 pF | 50 pF | - |
| 最大I(ol) | 0.012 A | - | 0.012 A | 0.012 A | - |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | - |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | - |
| 封装等效代码 | LCC20,.35SQ | - | FL14,.3 | DIP14,.3 | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | 260 |
| 电源 | 3.3/5 V | - | 3.3/5 V | 3.3/5 V | - |
| Prop。Delay @ Nom-Sup | 11 ns | - | 11 ns | 11 ns | - |
| 传播延迟(tpd) | 11.9 ns | - | 11.9 ns | 11.9 ns | - |
| 施密特触发器 | NO | - | NO | NO | - |
| 筛选级别 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | - |
| 座面最大高度 | 1.905 mm | - | 2.032 mm | 5.08 mm | - |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | - |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | - |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.89 mm | - | 6.2865 mm | 7.62 mm | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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