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CY7C1473V33-100AC

产品描述ZBT SRAM, 4MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
产品类别存储    存储   
文件大小467KB,共26页
制造商Cypress(赛普拉斯)
下载文档 详细参数 全文预览

CY7C1473V33-100AC概述

ZBT SRAM, 4MX18, 8.5ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

CY7C1473V33-100AC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码QFP
包装说明14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数100
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间8.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)100 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e0
长度20 mm
内存密度75497472 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数4194304 words
字数代码4000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织4MX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最小待机电流3.14 V
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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PRELIMINARY
CY7C1471V33
CY7C1473V33
CY7C1475V33
2M x 36/4M x 18/1M x 72 Flow-through
SRAM with NoBL™ Architecture
Features
• Zero Bus Latency, no dead cycles between Write and
Read cycles
• Supports 133-MHz bus operations
• 2M × 36/4M × 18/1M × 72 common I/O
• Fast clock-to-output times
— 5.5 ns (for 150-MHz device)
— 6.5 ns (for 133-MHz device)
— 7.5 ns (for 117-MHz device)
— 8.5 ns (for 100-MHz device)
Single 3.3V –5% and +5% power supply V
DD
Separate V
DDQ
for 3.3V or 2.5V
Clock Enable (CEN) pin to suspend operation
Burst Capability–linear or interleaved burst order
Available in 119-ball bump BGA and 100-pin TQFP
packages (CY7C1471V33 and CY7C1473V33)
165-ball FBGA and 209-ball BGA(CY7C1475V33)
packages are offered by opportunity basis. (Please
contact Cypress sales or marketing
inputs include all addresses, all data inputs, depth-expansion
Chip Enables (CE
1
, CE
2
, and CE
3
), cycle start input (ADV/LD),
Clock Enable (CEN), Byte Write Selects (BWS
a
, BWS
b
,
BWS
c
, BWS
d
, BWS
e
, BWS
f
, BWS
g
, BWS
h
), and Read-Write
control (WE). BWS
c
and BWS
d
apply to CY7C1471V33 and
CY7C1475V33 only. BWS
e
, BWS
f
, BWS
g
, and BWS
h
apply to
CY7C1475V33 only.
A Clock Enable (CEN) pin allows operation of the
CY7C1471V33, CY7C1473V33, and CY7C1475V33 to be
suspended as long as necessary. All synchronous inputs are
ignored when (CEN) is HIGH and the internal device registers
will hold their previous values.
There are three Chip Enable (CE
1
, CE
2
, CE
3
) pins that allow
the user to deselect the device when desired. If any one of
these three are not active when ADV/LD is LOW, no new
memory operation can be initiated and any burst cycle in
progress is stopped. However, any pending data transfers
(Read or Write) will be completed. The data bus will be in
high-impedance state two cycles after chip is deselected or a
Write cycle is initiated.
The CY7C1471V33, CY7C1473V33, and CY7C1475V33
have an on-chip two-bit burst counter. In the burst mode,
CY7C1471V33, CY7C1473V33, and CY7C1475V33 provide
four cycles of data for a single address presented to the
SRAM. The order of the burst sequence is defined by the
MODE input pin. The MODE pin selects between linear and
interleaved burst sequences. The ADV/LD signal is used to
load a new external address (ADV/LD = LOW) or increment
the internal burst counter (ADV/LD = HIGH).
Output Enable (OE) and burst sequence select (MODE) are
the asynchronous signals. OE can be used to disable the
outputs at any given time. ZZ may be tied to LOW if it is not
used.
Four pins are used to implement JTAG test capabilities. The
JTAG circuitry is used to serially shift data to and from the
device. JTAG inputs use LVTTL/LVCMOS levels to shift data
during this testing mode of operation.
Functional Description
The CY7C1471V33, CY7C1473V33, and CY7C1475V33
SRAMs are designed to eliminate dead cycles when transi-
tions from Read to Write or vice versa. These SRAMs are
optimized for 100 percent bus utilization and achieves Zero
Bus Latency. They integrate 2,097,152 × 36/4,194,304 × 18/
1,048,576 × 72 SRAM cells, respectively, with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. The Synchronous Burst SRAM family
employs high-speed, low-power CMOS designs using
advanced single layer polysilicon, three-layer metal
technology. Each memory cell consists of six transistors.
All synchronous inputs are gated by registers controlled by a
positive-edge-triggered Clock Input (CLK). The synchronous
Logic Block Diagram
CLK
CE
ADV/LD
A
x
CEN
CE
1
CE2
BWS
X
CE3
WE
CONTROL
and Write
LOGIC
D
Data-In REG.
Q
A
X
DQ
X
DP
X
X = a, b,
2M × 36
X = 20:0 X = a, b, X= a, b, c, d
c, d
c, d
BWS
x
Mode
2M × 36/
4M × 18/
1M × 72
MEMORY
ARRAY
DQ
x
DP
x
4M × 18
X = 21:0 X = a, b X = a, b X = a, b
X = a, b, X = a, b,
1M × 72
X = 19:0 X = a, b,
c,d,e,f,g,h c,d,e,f,g,h c,d,e,f,g,h
OE
Cypress Semiconductor Corporation
Document #: 38-05288 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised January 27, 2003
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