PRELIMINARY
CM1425
4 Channel EMI Filter Array with ESD Protection
Features
•
•
•
•
•
•
•
•
Four channels of EMI filtering with ESD protection
Pin compatible with CMD’s CSPRC032A
Greater than 30dB attenuation over the 800MHz to
3GHz frequency range
±
15kV ESD protection (IEC 61000-4-2, contact
discharge)
±
30kV ESD protection (HBM)
9-bump, 2.470mm x 0.970mm footprint Chip Scale
Package (CSP)
Available with Optiguard
™
coating for improved
reliability
Lead-free versions available
Product Description
CAMD's CM1425 is an EMI filter array with ESD pro-
tection, which integrates 4 pi filters (C-R-C). The
CM1425 has component values of 20pF-100Ω-20pF.
The parts include ESD protection diodes on every pin,
which provide a very high level of protection for sensi-
tive electronic components that may be subjected to
electrostatic discharge (ESD). The ESD diodes con-
nected to the filter ports are designed and character-
ized to safely dissipate ESD strikes of
±
15kV, beyond
the maximum requirement of the IEC 61000-4-2 inter-
national standard. Using the MIL-STD-883 (Method
3015) specification for Human Body Model (HBM)
ESD, the pins are protected for contact discharges at
greater than
±
30kV.
This device is particularly well suited for portable elec-
tronics (e.g. mobile handsets, PDAs, notebook comput-
ers) because of its small package format and easy-to-
use pin assignments. In particular, the CM1425 is
ideal for EMI filtering and protecting data lines from
ESD in wireless handsets.
All CM1425 devices are optionally available with Opti-
Guard
™
coating which results in improved reliability at
assembly. These devices are also available with stan-
dard and lead-free finishing. The CM1425 is housed in
a space-saving, low-profile, chip-scale package and is
fabricated with California Micro Devices' Centurion
™
processes.
Applications
•
•
•
•
FIltering for antenna and keypad data lines
I/O port protection for mobile handsets, notebook
computers, PDAs etc.
EMI filtering for data ports in cell phones, PDAs or
notebook computers.
EMI filtering for LCD and chip-to-chip data lines in
mobile electronic devices that use flexible PCB
interconnections
Electrical Schematic
100Ω
FILTER+ESD1*
20pF
20pF
FILTER+ESD1*
FILTER+ESD3*
20pF
20pF
100Ω
FILTER+ESD3*
GND
(Pin B3)
100Ω
FILTER+ESD2*
20pF
20pF
FILTER+ESD2*
FILTER+ESD4*
100Ω
FILTER+ESD4*
20pF
20pF
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
1
PRELIMINARY
CM1425
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
BOTTOM VIEW
(Bumps Up View)
Orientation
Marking
(see note 2)
1
A
B
2
3
4
5
A5
B5
A4
B4
B3
A2
B2
A1
B1
N251
1
2
3
4
5
CM1425-01
CSP Package (No coating)
Orientation
Marking
(see note 2)
A
B
N253
A5
B5
A4
B4
B3
A2
B2
A1
B1
Notes:
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM1425-03
CSP Package (OptiGuard
™
coating)
PIN DESCRIPTIONS
PIN(s)
A1
A2
A4
A5
B3
NAME
FILTER+ESD1
FILTER+ESD2
FILTER+ESD3
FILTER+ESD4
GND
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Device Ground
PIN(s)
B1
B2
B4
B5
NAME
FILTER+ESD1
FILTER+ESD2
FILTER+ESD3
FILTER+ESD4
DESCRIPTION
Filter Channel 1
Filter Channel 2
Filter Channel 3
Filter Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
No Coating
Ordering Part
Bumps
9
PKG
CSP
Number
1
CM1425-01CS
Part
Marking
N251
Optiguard
™
Coated
Ordering Part
Number
1
CM1425-03CS
Part
Marking
N253
Lead-free Finish
2
No Coating
Ordering Part
Number
1
CM1425-01CP
Part
Marking
N251
Optiguard
™
Coated
Ordering Part
Number
1
CM1425-03CP
Part
Marking
N253
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
04/21/04
PRELIMINARY
CM1425
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
Power Rating per Resistor
Package Power Rating
RATING
-65 to +150
100
300
UNITS
°C
mW
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
1
SYMBOL
R
C
V
DIODE
I
LEAK
V
SIG
PARAMETER
Resistance
Capacitance
Diode Standoff Voltage
Diode Leakage Current (reverse bias)
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-
2 Level 4
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Cut-off Frequency
Z
SOURCE
=50Ω, Z
LOAD
=50Ω
At 2.5V DC, 1MHz, 30mV AC
I
DIODE
= 10µA
V
DIODE
= 3.3V
I
LOAD
= 10mA
I
LOAD
= -10mA
Notes 2,4 and 5
±30
±15
Notes 2,3,4 and 5
+12
-7
R = 100Ω, C = 20pF
86
MHz
V
V
kV
kV
5.6
-1.5
6.8
-0.8
CONDITIONS
MIN
80
16
5.5
100
9.0
-0.4
TYP
100
20
MAX
120
24
UNITS
Ω
pF
V
nA
V
V
V
ESD
V
CL
f
C
Note 1: T
A
=25
°
C unless otherwise specified.
Note 2: ESD applied to input and output pins with respect to GND, one at a time.
Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1,
then clamping voltage is measured at Pin C1.
Note 4: Unused pins are left open
Note 5: These parameters are guaranteed by design and characterization.
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
3
PRELIMINARY
CM1425
Performance Information
.
Figure 1. CM1425 Filter Typical Measured Frequency Response
Figure 2. Filter Capacitance vs. Input Voltage over Temperature
(normalized to capacitance at 2.5VDC and 25°C)
© 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
04/21/04
PRELIMINARY
CM1425
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125 - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2004 California Micro Devices Corp. All rights reserved.
04/21/04
Figure 5. Lead-free (SnAgCu) Solder
Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
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