CM1204
4-Channel ESD Array in CSP
Features
•
•
•
•
•
•
•
•
Functionally and pin compatible with CMD’s
CSPESD304
Optiguard
™
coated for improved reliability
Four channels of ESD protection
+
15kV ESD protection on each channel
(IEC 61000-4-2 Level 4, contact discharge)
+
30kV ESD protection on each channel (HBM)
Chip Scale Package features extremely low
lead inductance for optimum ESD protection
5-bump, 0.960mm X 1.330mm footprint
Chip Scale Package (CSP)
Lead-free version available
Product Description
The CM1204 is a quad ESD transient voltage supres-
sion diode array. Each diode provides a very high level
of protection for sensitive electronic components that
may be subjected to electrostatic discharge (ESD).
These diodes are designed and characterized to safely
dissipate ESD strikes of
+
15kV, exceeding the maxi-
mum requirement of the IEC 61000-4-2 international
standard. Using the MIL-STD-883 (Method 3015)
specification for Human Body Model (HBM) ESD, the
device provides protection for contact discharges to
greater than
+
30kV.
The CM1204 is particularly well suited for portable
electronics (e.g., cellular telephones, PDAs, notebook
computers) because of its small package format and
low weight.
The CM1204 features Optiguard
™
coating which
results in improved reliability at assembly. It is available
in a space-saving, low-profile chip scale package with
optional lead-free finishing.
Applications
•
•
•
•
•
•
•
•
ESD protection for sensitive electronic equipment
I/O port and keypad and button circuitry
protection for portable devices
Wireless Handsets
Handheld PCs / PDAs
MP3 Players
Digital Camcorders
Notebooks
Desktop PCs
Electrical Schematic
ESD_1 ESD_2 ESD_3 ESD_4
C1
C3
A1
A3
GND
B2
© 2004 California Micro Devices Corp. All rights reserved.
05/10/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
1
CM1204
PACKAGE / PINOUT DIAGRAMS
TOP VIEW
(Bumps Down View)
Orientation
Marking
(see note 2)
BOTTOM VIEW
(Bumps Up View)
ESD_3
ESD_4
1 2 3
A
C1
GND
C3
B2
S
Orientation
Marking
ESD_1
B
C
ESD_2
A1
A3
A1
CM1204
Notes:
CSP Package with OptiGuard
™
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN
A1
A3
B2
C1
C3
NAME
ESD1
ESD2
GND
ESD3
ESD4
DESCRIPTION
ESD Channel1
ESD Channel 2
Device Ground
ESD Channel 3
ESD Channel 4
Ordering Information
PART NUMBERING INFORMATION
Standard Finish
Ordering Part
Pins
5
Package
CSP
Number
1
CM1204-03CS
Part Marking
S
Lead-free Finish
2
Ordering Part
Number
1
CM1204-03CP
Part Marking
S
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "
+
" character for the top side orientation mark.
© 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
05/10/04
CM1204
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Storage Temperature Range
DC Package Power Rating
RATING
-65 to +150
200
UNITS
°C
mW
STANDARD OPERATING CONDITIONS
PARAMETER
Operating Temperature Range
RATING
-40 to +85
UNITS
°C
ELECTRICAL OPERATING CHARACTERISTICS
(SEE NOTE 1)
SYMBOL
V
DIODE
I
LEAK
V
SIG
PARAMETER
Diode Reverse Breakdown Voltage
Diode Leakage Current
Signal Voltage
Positive Clamp
Negative Clamp
In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Diode Capacitance
CONDITIONS
I
DIODE
= 10µA
V
IN
=3.3V, T
A
=25°C
I
DIODE
= 10mA
5.6
-0.4
Notes 2, 3 and 4
±30
±15
Notes 2, 3 and 4
+15
-8
At 2.5VDC Reverse Bias,
1MHz, 30mVAC
22
27
32
V
V
pF
kV
kV
6.8
-0.8
9.0
-1.5
V
V
MIN
5.5
100
TYP
MAX
UNITS
V
nA
V
ESD
V
CL
C
DIODE
Note 1:
Note 2:
Note 3:
Note 4:
T
A
=-40 to +85
°
C unless otherwise specified.
ESD applied to input and output pins with respect to GND, one at a time.
Unused pins are left open
These parameters are guaranteed by design and characterization.
© 2004 California Micro Devices Corp. All rights reserved.
05/10/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
3
CM1204
Performance Information
Diode Characteristics (nominal conditions unless specified otherwise)
Capacitance (Normalized)
DC Voltage
Figure 1. Typical Diode Capacitance VS. Input Voltage (normalized to 2.5VDC)
© 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
05/10/04
CM1204
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask defined pads
0.325mm Round
0.125mm - 0.150mm
0.330mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
+50µm
+20µm
60 seconds
260°C
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Stencil Opening
0.330mm DIA.
Solder Mask Opening
0.325mm DIA.
Figure 2. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (°C)
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 3. Eutectic (SnPb) Solder
Ball Reflow Profile
© 2004 California Micro Devices Corp. All rights reserved.
05/10/04
Figure 4. Lead-free (SnAgCu) Solder
Ball Reflow Profile
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
▲
Tel: 408.263.3214
▲
Fax: 408.263.7846
▲
www.calmicro.com
5
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