Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit)
| HN58X2404SI | HN58X2402SFPI | HN58X2402STI | HN58X2404SFPI | HN58X2402SI | HN58X2404STI | |
|---|---|---|---|---|---|---|
| 描述 | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) | Two-wire serial interface (2k EEPROM 256-word x 8-bit) 4k EEPROM (512-word x 8-bit) |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | - | Hitachi （Renesas ） | Hitachi （Renesas ） | Hitachi （Renesas ） | - | Hitachi （Renesas ） |
| 零件包装代码 | - | SOIC | SOIC | SOIC | - | SOIC |
| 包装说明 | - | 0.150 INCH, PLASTIC, SOP-8 | TSSOP, TSSOP8,.25 | SOP, SOP8,.25 | - | TSSOP, TSSOP8,.25 |
| 针数 | - | 8 | 8 | 8 | - | 8 |
| Reach Compliance Code | - | unknow | unknown | unknow | - | unknow |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 最大时钟频率 (fCLK) | - | 0.4 MHz | 0.4 MHz | 0.4 MHz | - | 0.4 MHz |
| 数据保留时间-最小值 | - | 10 | 10 | 10 | - | 10 |
| 耐久性 | - | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | - | 100000 Write/Erase Cycles |
| I2C控制字节 | - | 1010DDDR | 1010DDDR | 1010DDMR | - | 1010DDMR |
| JESD-30 代码 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 |
| 长度 | - | 4.9 mm | 4.4 mm | 4.9 mm | - | 4.4 mm |
| 内存密度 | - | 2048 bi | 2048 bit | 4096 bi | - | 4096 bi |
| 内存集成电路类型 | - | EEPROM | EEPROM | EEPROM | - | EEPROM |
| 内存宽度 | - | 8 | 8 | 8 | - | 8 |
| 功能数量 | - | 1 | 1 | 1 | - | 1 |
| 端子数量 | - | 8 | 8 | 8 | - | 8 |
| 字数 | - | 256 words | 256 words | 512 words | - | 512 words |
| 字数代码 | - | 256 | 256 | 512 | - | 512 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | - | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | - | -40 °C |
| 组织 | - | 256X8 | 256X8 | 512X8 | - | 512X8 |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | SOP | TSSOP | SOP | - | TSSOP |
| 封装等效代码 | - | SOP8,.25 | TSSOP8,.25 | SOP8,.25 | - | TSSOP8,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | - | SERIAL | SERIAL | SERIAL | - | SERIAL |
| 电源 | - | 2/5 V | 2/5 V | 2/5 V | - | 2/5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 座面最大高度 | - | 1.75 mm | 1.2 mm | 1.75 mm | - | 1.2 mm |
| 串行总线类型 | - | I2C | I2C | I2C | - | I2C |
| 最大待机电流 | - | 0.000003 A | 0.000003 A | 0.000003 A | - | 0.000003 A |
| 最大压摆率 | - | 0.003 mA | 0.003 mA | 0.003 mA | - | 0.003 mA |
| 最大供电电压 (Vsup) | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
| 最小供电电压 (Vsup) | - | 1.8 V | 1.8 V | 1.8 V | - | 1.8 V |
| 标称供电电压 (Vsup) | - | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V |
| 表面贴装 | - | YES | YES | YES | - | YES |
| 技术 | - | CMOS | CMOS | CMOS | - | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL |
| 端子形式 | - | GULL WING | GULL WING | GULL WING | - | GULL WING |
| 端子节距 | - | 1.27 mm | 0.65 mm | 1.27 mm | - | 0.65 mm |
| 端子位置 | - | DUAL | DUAL | DUAL | - | DUAL |
| 宽度 | - | 3.9 mm | 3 mm | 3.9 mm | - | 3 mm |
| 最长写入周期时间 (tWC) | - | 15 ms | 15 ms | 15 ms | - | 15 ms |
| 写保护 | - | HARDWARE | HARDWARE | HARDWARE | - | HARDWARE |
stm32/stm8
微控制器 MCU
DSP 与 ARM 处理器
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