512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | TSOP |
| 包装说明 | 8 X 14 MM, PLASTIC, TSOP-32 |
| 针数 | 32 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 命令用户界面 | YES |
| 数据轮询 | YES |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e0 |
| 长度 | 12.4 mm |
| 内存密度 | 524288 bi |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 65536 words |
| 字数代码 | 64000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 64KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP32,.56,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 电源 | 3/3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 切换位 | YES |
| 类型 | NOR TYPE |
| 宽度 | 8 mm |
| M29W512B120NZ1T | M29W512B90NZ1T | M29W512B70NZ1T | M29W512B70K1T | M29W512B55NZ1T | M29W512B55K1T | M29W512B120K1T | M29W512B | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory | 512 Kbit 64Kb x8, Bulk Low Voltage Single Supply Flash Memory |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | - |
| 零件包装代码 | TSOP | TSOP | TSOP | QFJ | TSOP | QFJ | QFJ | - |
| 包装说明 | 8 X 14 MM, PLASTIC, TSOP-32 | 8 X 14 MM, PLASTIC, TSOP-32 | 8 X 14 MM, PLASTIC, TSOP-32 | PLASTIC, LCC-32 | 8 X 14 MM, PLASTIC, TSOP-32 | PLASTIC, LCC-32 | PLASTIC, LCC-32 | - |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - |
| Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli | unknow | - |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | - |
| 最长访问时间 | 90 ns | 90 ns | 70 ns | 70 ns | 55 ns | 55 ns | 90 ns | - |
| 命令用户界面 | YES | YES | YES | YES | YES | YES | - | - |
| 数据轮询 | YES | YES | YES | YES | YES | YES | - | - |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PQCC-J32 | R-PDSO-G32 | R-PQCC-J32 | R-PQCC-J32 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | - |
| 长度 | 12.4 mm | 12.4 mm | 12.4 mm | 13.995 mm | 12.4 mm | 13.995 mm | 13.995 mm | - |
| 内存密度 | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | 524288 bi | - |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | - |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - |
| 字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | - |
| 字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | - |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - |
| 组织 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSOP1 | TSOP1 | TSOP1 | QCCJ | TSOP1 | QCCJ | QCCJ | - |
| 封装等效代码 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | LDCC32,.5X.6 | TSSOP32,.56,20 | LDCC32,.5X.6 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | CHIP CARRIER | - |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3.3 V | 3.3 V | - | - |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 3 V | 3 V | 2.7 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 3.56 mm | 1.2 mm | 3.56 mm | 3.56 mm | - |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | - | - |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | - | - |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | - |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | J BEND | GULL WING | J BEND | J BEND | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.5 mm | 1.27 mm | 1.27 mm | - |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | QUAD | - |
| 切换位 | YES | YES | YES | YES | YES | YES | - | - |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | - |
| 宽度 | 8 mm | 8 mm | 8 mm | 11.455 mm | 8 mm | 11.455 mm | 11.455 mm | - |
测试/测量
嵌入式系统
TI技术论坛
汽车电子
求职招聘
模拟电子
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
