Standard SRAM, 512KX8, 15ns, CMOS
参数名称 | 属性值 |
厂商名称 | Microchip(微芯科技) |
包装说明 | DFP, FL36,.5 |
Reach Compliance Code | compliant |
ECCN代码 | 3A001.A.2.C |
最长访问时间 | 15 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-XDFP-F36 |
JESD-609代码 | e4 |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 36 |
字数 | 524288 words |
字数代码 | 512000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512KX8 |
输出特性 | 3-STATE |
封装主体材料 | UNSPECIFIED |
封装代码 | DFP |
封装等效代码 | FL36,.5 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
并行/串行 | PARALLEL |
电源 | 3.3 V |
认证状态 | Qualified |
筛选级别 | MIL-PRF-38535 Class V |
座面最大高度 | 3.05 mm |
最大待机电流 | 0.0015 A |
最小待机电流 | 2 V |
最大压摆率 | 0.18 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | GOLD |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
总剂量 | 300k Rad(Si) V |
宽度 | 12.195 mm |
Base Number Matches | 1 |
5962R0520802VYC | 5962-0520802VYC | 5962R0520802VXC | 5962-0520802QYC | 5962-0520802QXC | 5962-0520802VXC | AT60142F-DD15MSV | AT60142F-DS15M-E | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS | Standard SRAM, 512KX8, 15ns, CMOS |
包装说明 | DFP, FL36,.5 | DFP, FL36,.5 | DFP, FL36,.5 | DFP, FL36,.5 | DFP, FL36,.5 | 0.500 INCH, DFP-36 | DIE, | DFP, |
Reach Compliance Code | compliant | compliant | not_compliant | compliant | unknown | unknown | compliant | compliant |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
最长访问时间 | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns | 15 ns |
JESD-30 代码 | R-XDFP-F36 | R-XDFP-F36 | R-XDFP-F36 | R-XDFP-F36 | R-XDFP-F36 | R-XDFP-F36 | X-XUUC-N | R-XDFP-F36 |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
字数 | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words | 524288 words |
字数代码 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 | 512000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
组织 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 | 512KX8 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DFP | DFP | DFP | DFP | DFP | DFP | DIE | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | UNCASED CHIP | FLATPACK |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT | NO LEAD | FLAT |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER | DUAL |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) |
I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - | - |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | - | - |
端子数量 | 36 | 36 | 36 | 36 | 36 | 36 | - | 36 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - | - |
封装等效代码 | FL36,.5 | FL36,.5 | FL36,.5 | FL36,.5 | FL36,.5 | FL36,.5 | - | - |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - |
筛选级别 | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class V | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class Q | MIL-PRF-38535 Class V | MIL-STD-883 Class V | - |
座面最大高度 | 3.05 mm | 3.05 mm | 3.05 mm | 3.05 mm | 3.05 mm | 3.05 mm | - | 3.05 mm |
最大待机电流 | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | 0.0015 A | - | - |
最小待机电流 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | - | - |
最大压摆率 | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | 0.18 mA | - | - |
端子面层 | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD | - | - |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm |
宽度 | 12.195 mm | 12.195 mm | 12.195 mm | 12.195 mm | 12.195 mm | 12.195 mm | - | 12.195 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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