Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14,
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Fairchild |
| Reach Compliance Code | compliant |
| 计数方向 | UP |
| JESD-30 代码 | R-XDIP-T14 |
| JESD-609代码 | e0 |
| 负载/预设输入 | NO |
| 逻辑集成电路类型 | BINARY COUNTER |
| 工作模式 | ASYNCHRONOUS |
| 湿度敏感等级 | 2A |
| 功能数量 | 1 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 250 |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| Base Number Matches | 1 |
| 4024BDM | 4024BDCQR | 4024BDC | 4024BDCQM | 5962-01-159-3567 | |
|---|---|---|---|---|---|
| 描述 | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, | Binary Counter, Asynchronous, Up Direction, CMOS, CDIP14, |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 计数方向 | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 | R-XDIP-T14 |
| 负载/预设输入 | NO | NO | NO | NO | YES |
| 逻辑集成电路类型 | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER | BINARY COUNTER |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 湿度敏感等级 | 2A | 2A | 2A | 2A | 2A |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -40 °C | -40 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 | DIP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 250 | 250 | 250 | 250 | 250 |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Fairchild | Fairchild | Fairchild | Fairchild | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | - |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
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