HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 1/3
HMPSA93
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMPSA93 is designed for application as a video output to drive color
CRT, or as a dialer circuit in electronics telephone.
Features
•
High Collector-Emitter Breakdown Voltage
•
Low Collector-Emitter Saturation Voltage
•
For Complementary Use with NPN Type HMPSA43
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ....................................................................................................... -55 ~ +150
°C
Junction Temperature ............................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................................ 625 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage.................................................................................................. -200 V
VCEO Collector to Emitter Voltage............................................................................................... -200 V
VEBO Emitter to Base Voltage......................................................................................................... -5 V
IC Collector Current ................................................................................................................. -500 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
*hFE3
*hFE4
fT
Cob
Min.
-200
-200
-5
-
-
-
-
25
40
40
-
50
-
Typ.
-
-
-
-
-
-
-
-
-
-
100
-
-
Max.
-
-
-
-100
-100
-350
-900
-
-
-
-
-
8
Unit
V
V
V
nA
nA
mV
mV
Test Conditions
IC=-100uA, IE=0
IC=-1mA, IB=0
IE=-10uA, IC=0
VCB=-160V, IE=0
VEB=-3V, IC=0
IC=-20mA, IB=-2mA
IC=-20mA, IB=-2mA
IC=-1mA, VCE=-10V
IC=-10mA, VCE=-10V
IC=-30mA, VCE=-10V
IC=-80mA, VCE=-10V
IC=-10mA, VCE=-20V, f=100MHZ
VCB=-20V, f=1MHz, IE=0
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
Classification Of hFE2 & V
CE(sat)
Rank
NS
N
hFE1
>60
>25
hFE2
>80
>40
hFE3
>80
>40
hFE4
>80
-
VCE(sat)
<200mV
<350mV
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
100000
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 2/3
Saturation Voltage & Collector Current
100
hFE @ V
CE
=10V
Saturation Voltage (mV)
10000
hFE
1000
V
BE(sat)
@ I
C
=10I
B
100
V
CE(sat)
@ I
C
=10I
B
10
1
0.1
1
10
100
1000
10
0.1
1
10
100
1000
Collector Current (mA)
Collector Current (mA)
Cutoff Frequency & Collector Current
1000
100
Capacitance & Reverse-Biased Voltage
Cutoff Frequencey (MHz)
Capacitance (pF)
100
10
Cob
V
CE
=20V
10
1
10
100
1
0.1
1
10
100
Collector Current (mA)
Reverse-Biased Voltage (V)
Safe Operating Area
10000
P
T
=1ms
1000
P
T
=1s
700
600
PD-Ta
Power Dissipation-PD(mW)
P
T
=100ms
Collector Current-I
C
(mA)
500
400
300
200
100
100
10
1
1
10
100
1000
0
0
20
40
60
80
100
o
120
140
160
Forward Voltage-V
CE
(V)
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A
B
1 2
3
Spec. No. : HE6353-B
Issued Date : 1992.11.25
Revised Date : 2000.10.01
Page No. : 3/3
α
2
Marking :
HSMC Logo
Part Number
Date Code
Rank
Product Series
α
3
Laser Mark
HSMC Logo
Product Series
C
D
Part Number
H
I
E
F
G
Ink Mark
Style : Pin 1.Emitter 2.Base 3.Collector
α
1
3-Lead TO-92 Plastic Package
HSMC Package Code : A
*:Typical
DIM
A
B
C
D
E
F
Inches
Min.
Max.
0.1704
0.1902
0.1704
0.1902
0.5000
-
0.0142
0.0220
-
*0.0500
0.1323
0.1480
Millimeters
Min.
Max.
4.33
4.83
4.33
4.83
12.70
-
0.36
0.56
-
*1.27
3.36
3.76
DIM
G
H
I
α1
α2
α3
Inches
Min.
Max.
0.0142
0.0220
-
*0.1000
-
*0.0500
-
*5°
-
*2°
-
*2°
Millimeters
Min.
Max.
0.36
0.56
-
*2.54
-
*1.27
-
*5°
-
*2°
-
*2°
Notes :
1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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