256MB, 512MB, 1GB Unbuffered DIMM
DDR SDRAM
DDR SDRAM Unbuffered Module
184pin Unbuffered Module based on 512Mb D-die
with 64/72-bit Non ECC/ECC
66 TSOP-II with Pb-Free
(RoHS compliant)
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL
INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar
applications where Product failure could result in loss of life or personal or physical harm, or any military or
defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
Rev. 0.1 June 2005
256MB, 512MB, 1GB Unbuffered DIMM
Table of Contents
DDR SDRAM
1.0 Ordering Information................................................................................................................... 4
2.0 Operating Frequencies................................................................................................................ 4
3.0 Feature.......................................................................................................................................... 4
4.0 Pin Configuration (Front side/back side) ................................................................................. 5
5.0 Pin Description ............................................................................................................................ 5
6.0 Functional Block Diagram .......................................................................................................... 6
6.1 256MB, 32M x 64 Non ECC Module (M368L3324DUS) .......................................................................................
6
6.2 512MB, 64M x 64 Non ECC Module (M368L6523DUS) ......................................................................................
7
6.3 512MB, 64M x 72 ECC Module (M381L6523DUM)..............................................................................................
8
6.4 1GB, 128M x 64 Non ECC Module (M368L2923DUN) .........................................................................................
9
6.5 1GB, 128M x 72 ECC Module (M381L2923DUM).............................................................................................
10
7.0 Absolute Maximum Ratings...................................................................................................... 11
8.0 DC Operating Conditions.......................................................................................................... 11
9.0 DDR SDRAM IDD spec table ..................................................................................................... 12
9.1 M368L3324DUS [ (32M x 16) * 4, 256MB Non ECC Module ]
.................................................................................
12
9.2 M368L6523DUS [ (64M x 8) * 8, 512MB Non ECC Module ]
....................................................................................
12
9.3 M381L6523DUM [ (64M x 8) * 9, 512MB ECC Module ]
............................................................................................
13
9.4 M368L2923DUN [ (64M x 8) * 16, 1GB Non ECC Module ]
......................................................................................
13
9.5 M381L2923DUM [ (64M x 8) * 18, 1GB ECC Module ]
.............................................................................................
14
10.0 AC Operating Conditions........................................................................................................ 15
11.0 Input/Output Capacitance ....................................................................................................... 15
12.0 AC Timming Parameters & Specifications ............................................................................ 16
13.0 System Characteristics for DDR SDRAM .............................................................................. 17
14.0 Component Notes.................................................................................................................... 18
15.0 System Notes ........................................................................................................................... 19
16.0 Command Truth Table............................................................................................................. 20
17.0 Physical Dimensions............................................................................................................... 21
17.1 32M x 64 (M368L3324DUS)
....................................................................................................... 21
17.2 64Mx64 (M368L6523DUS)
......................................................................................................... 22
17.3 64Mx72 (M381L6523DUM)
........................................................................................................ 23
17.4 128Mx64 (M368L2923DUN)
....................................................................................................... 24
17.5 128Mx72 (M381L2923DUM)
...................................................................................................... 25
Rev. 0.1 June 2005
256MB, 512MB, 1GB Unbuffered DIMM
Revision History
Revision
0.0
0.1
Month
April
June
Year
2005
2005
- First version for internal review.
- Changed master format.
History
DDR SDRAM
Rev. 0.1 June 2005
256MB, 512MB, 1GB Unbuffered DIMM
DDR SDRAM
184Pin Unbuffered DIMM based on 512Mb C-die (x8, x16)
1.0 Ordering Information
Part Number
M368L3324DUS-C(L)CC/B3
M368L6523DUS-C(L)CC/B3
M381L6523DUM-C(L)CC/B3
M368L2923DUN-C(L)CC/B3
M381L2923DUM-C(L)CC/B3
Density
256MB
512MB
512MB
1GB
1GB
Organization
32M x 64
64M x 64
64M x 72
128M x 64
128M x 72
Component Composition
32Mx16 (K4H511638D) * 4EA
64Mx8 (K4H510838D) * 8EA
64Mx8 (K4H510838D) * 9EA
64Mx8 (K4H510838D) * 16EA
64Mx8 (K4H510838D) * 18EA
Height
1,250mil
1,250mil
1,250mil
1,250mil
1,250mil
2.0 Operating Frequencies
CC(DDR400@CL=3)
Speed @CL2
Speed @CL2.5
Speed @CL3
CL-tRCD-tRP
-
166MHz
200MHz
3-3-3
B3(DDR333@CL=2.5)
133MHz
166MHz
-
2.5-3-3
3.0 Feature
• VDD : 2.5V ± 0.2V, VDDQ : 2.5V ± 0.2V for DDR333
• VDD : 2.6V ± 0.1V, VDDQ : 2.6V ± 0.1V for DDR400
• Double-data-rate architecture; two data transfers per clock cycle
• Bidirectional data strobe [DQ] (x4,x8) & [L(U)DQS] (x16)
• Differential clock inputs(CK and CK)
• DLL aligns DQ and DQS transition with CK transition
• Programmable Read latency : DDR333(2.5 Clock), DDR400(3 Clock)
• Programmable Burst length (2, 4, 8)
• Programmable Burst type (sequential & interleave)
• Edge aligned data output, center aligned data input
• Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
• Serial presence detect with EEPROM
• PCB : Height 1,250 (mil) & single (256, 512MB), double (1GB) sided
• SSTL_2 Interface
• 66pin TSOP II
Pb-Free
package
•
RoHS compliant
Rev. 0.1 June 2005
256MB, 512MB, 1GB Unbuffered DIMM
4.0 Pin Configuration (Front side/back side)
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Front
VREF
DQ0
VSS
DQ1
DQS0
DQ2
VDD
DQ3
NC
NC
VSS
DQ8
DQ9
DQS1
VDDQ
CK1
CK1
VSS
DQ10
DQ11
CKE0
VDDQ
DQ16
DQ17
DQS2
VSS
A9
DQ18
A7
VDDQ
DQ19
Pin
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
Front
A5
DQ24
VSS
DQ25
DQS3
A4
VDD
DQ26
DQ27
A2
VSS
A1
CB0
CB1
VDD
DQS8
A0
CB2
VSS
CB3
BA1
KEY
DQ32
VDDQ
DQ33
DQS4
DQ34
VSS
BA0
DQ35
DQ40
Pin
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
Front
VDDQ
WE
DQ41
CAS
VSS
DQS5
DQ42
DQ43
VDD
*CS2
DQ48
DQ49
VSS
*CK2
*CK2
VDDQ
DQS6
DQ50
DQ51
VSS
VDDID
DQ56
DQ57
VDD
DQS7
DQ58
DQ59
VSS
NC
SDA
SCL
Pin
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
Back
VSS
DQ4
DQ5
VDDQ
DM0
DQ6
DQ7
VSS
NC
NC
NC
VDDQ
DQ12
DQ13
DM1
VDD
DQ14
DQ15
CKE1
VDDQ
*BA2
DQ20
A12
VSS
DQ21
A11
DM2
VDD
DQ22
A8
DQ23
Pin
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
Back
VSS
A6
DQ28
DQ29
VDDQ
DM3
A3
DQ30
VSS
DQ31
CB4
CB5
VDDQ
CK0
CK0
VSS
DM8
A10
CB6
VDDQ
CB7
KEY
VSS
DQ36
DQ37
VDD
DM4
DQ38
DQ39
VSS
DQ44
DDR SDRAM
Pin
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
Back
RAS
DQ45
VDDQ
CS0
CS1
DM5
VSS
DQ46
DQ47
*CS3
VDDQ
DQ52
DQ53
*A13
VDD
DM6
DQ54
DQ55
VDDQ
NC
DQ60
DQ61
VSS
DM7
DQ62
DQ63
VDDQ
SA0
SA1
SA2
VDDSPD
Note :
1. * : These pins are not used in this module.
2. Pins 44, 45, 47, 49, 51, 134, 135, 140, 142, 144 are used on x72 module ( M381~ ), and are not used on x64 module.
3. Pins 111, 158 are NC for 1row modules & used for 2row modules[ M368(81)L2923DUN(M) ].
4. Pins 137, 138 are NC for x16 1Row module (M368L3324DUS).
5.0 Pin Description
Pin Name
A0 ~ A12
BA0 ~ BA1A
DQ0 ~ DQ63
DQS0 ~ DQS8
CK0,CK0 ~ CK2, CK2
CKE0, CKE1(for double banks)
CS0, CS1(for double banks)
RAS
CAS
WE
CB0 ~ CB7(for x72 module)
Function
Address input (Multiplexed)
Bank Select Address
Data input/output
Data Strobe input/output
Clock input
Clock enable input
Chip select input
Row address strobe
Column address strobe
Write enable
Check bit(Data-in/data-out)
Pin Name
Function
DM0 ~7,8(for ECC) Data - in mask
Power supply
VDD
(2.5V for DDR333, 2.6V for DDR400)
Power Supply for DQS
VDDQ
(2.5V for DDR333, 2.6V for DDR400)
VSS
Ground
VREF
Power supply for reference
VDDSPD
Serial EEPROM Power/Supply ( 2.3V to 3.6V )
SDA
Serial data I/O
SCL
Serial clock
SA0 ~ 2
Address in EEPROM
VDDID
VDD, VDDQ level detection
NC
No connection
Note : VDDID defines relationship of VDD and VDDQ, and the default status of it is open (VDD=VDDQ)
Rev. 0.1 June 2005
DSP 与 ARM 处理器
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