Changes to Figure 8 and Figure 10................................................. 6
7/08—Revision 0: Initial Version
Rev. B | Page 2 of 16
AD8274
SPECIFICATIONS
V
S
= ±15 V, V
REF
= 0 V, T
A
= 25°C, R
L
= 2 kΩ, unless otherwise noted.
Table 2.
Parameter
DYNAMIC PERFORMANCE
Bandwidth
Slew Rate
Settling Time to 0.1%
Settling Time to 0.01%
NOISE/DISTORTION
1
THD + Noise
Noise Floor, RTO
2
Output Voltage Noise
(Referred to Output)
GAIN
Gain Error
Gain Drift
Gain Nonlinearity
INPUT CHARACTERISTICS
Offset
3
vs. Temperature
vs. Power Supply
Common-Mode Rejection Ratio
Input Voltage Range
4
Impedance
5
Differential
Common Mode
6
OUTPUT CHARACTERISTICS
Output Swing
Short-Circuit Current Limit
Capacitive Load Drive
POWER SUPPLY
Supply Current (per Amplifier)
TEMPERATURE RANGE
Specified Performance
1
2
Conditions
Min
G=½
Typ
20
Max
Min
G=2
Typ
10
Max
Unit
MHz
V/μs
ns
ns
%
dBu
μV rms
nV/√Hz
20
10 V step on output, C
L
= 100 pF
10 V step on output, C
L
= 100 pF
f = 1 kHz, V
OUT
= 10 V p-p,
600 Ω load
20 kHz BW
f = 20 Hz to 20 kHz
f = 1 kHz
650
725
0.00025
−106
3.5
26
0.03
2
750
800
20
675
750
0.00035
−100
7
52
0.03
2
775
825
−40°C to +85°C
V
OUT
= 10 V p-p, 600 Ω load
Referred to output
−40°C to +85°C
V
S
= ±2.5 V to ±18 V
V
CM
= ±40 V, R
S
= 0 Ω, referred
to input
0.5
2
150
3
77
−3V
S
+ 4.5
86
0.5
2
300
6
83
92
%
ppm/°C
ppm
μV
μV/°C
μV/V
dB
V
700
5
1100
10
+3V
S
− 4.5
36
9
−1.5V
S
+ 2.3
9
9
+1.5V
S
− 2.3
V
CM
= 0 V
kΩ
kΩ
+V
S
−
1.5
V
mA
mA
pF
2.6
+85
mA
°C
−V
S
+
1.5
Sourcing
Sinking
90
60
200
2.3
−40
+V
S
−
1.5
−V
S
+
1.5
90
60
1200
2.6
+85
−40
2.3
Includes amplifier voltage and current noise, as well as noise of internal resistors.
dBu = 20 log(V rms/0.7746).
3
Includes input bias and offset current errors.
4
May also be limited by absolute maximum input voltage or by the output swing. See the Absolute Maximum Ratings section and Figure 8 through Figure 11 for details.
5
Internal resistors are trimmed to be ratio matched but to have ±20% absolute accuracy.
6
Common mode is calculated by looking into both inputs. The common-mode impedance at only one input is 18 kΩ.
Rev. B | Page 3 of 16
AD8274
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Maximum Voltage at Any Input Pin
Minimum Voltage at Any Input Pin
Storage Temperature Range
Specified Temperature Range
Package Glass Transition Temperature (T
G
)
Rating
±18 V
−V
S
+ 40 V
+V
S
– 40 V
−65°C to +150°C
−40°C to +85°C
150°C
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the AD8274 is limited
by the associated rise in junction temperature (T
J
) on the die. At
approximately 150°C, which is the glass transition temperature,
the properties of the plastic change. Even temporarily exceeding
this temperature limit may change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the amplifiers. Exceeding a temperature of 150°C for an
extended period may result in a loss of functionality.
2.0
T
J
MAX = 150°C
MAXIMUM POWER DISSIPATION (W)
1.6
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.2
SOIC
θ
JA
= 121°C/W
MSOP
θ
JA
= 135°C/W
THERMAL RESISTANCE
The θ
JA
values in Table 4 assume a 4-layer JEDEC standard
board with zero airflow.
Table 4. Thermal Resistance
Package Type
8-Lead MSOP
8-Lead SOIC
θ
JA
135
121
Unit
°C/W
°C/W
0.8
0.4
07362-004
0
–50
–25
0
25
50
75
100
125
AMBIENT TEMERATURE (°C)
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
SHORT-CIRCUIT CURRENT
The AD8274 has built-in, short-circuit protection that limits the
output current (see Figure 16 for more information). While the
short-circuit condition itself does not damage the part, the heat
generated by the condition can cause the part to exceed its
maximum junction temperature, with corresponding negative
effects on reliability. Figure 2 and Figure 16, combined with
knowledge of the part’s supply voltages and ambient temperature,
can be used to determine whether a short circuit will cause the
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
