HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6737-A
Issued Date : 1993.09.24
Revised Date : 1999.08.01
Page No. : 1/3
HMJE3055T
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HMJE3055T is designed for general purpose of amplifier and
switching applications.
Absolute Maximum Ratings
(Ta=25°C)
•
Maximum Temperature
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature ..................................................................................... 150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 75 W
Total Power Dissipation (Ta=25°C) ................................................................................... 0.6 W
•
Maximum Voltages and Currents (Ta=25°C)
BVCBO Collector to Base Voltage ...................................................................................... 70 V
BVCEO Collector to Emitter Voltage................................................................................... 60 V
BVEBO Emitter to Base Voltage ........................................................................................... 5 V
IC Collector Current ........................................................................................................... 10 A
IB Base Current .................................................................................................................... 6 A
Characteristics
(Ta=25°C)
Symbol
BVCEO
BVCBO
BVEBO
ICBO
ICEX
ICEO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(on)
*hFE1
*hFE2
fT
Min.
60
70
5
-
-
-
-
-
-
-
20
5
2
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
1.
1.
700
5
1.1
8.0
1.8
100
-
-
Unit
V
V
V
mA
mA
uA
mA
V
V
V
Test Conditions
IC=200mA, IB=0
IC=10mA, IE=0
IE=10mA, IC=0
VCB=70V, IE=0
VCE=70V, VEB(off)=1.5V
VCE=30V, IB=0
VEB=5V, IC=0
IC=4A, IB=400mA
IC=10A, IB=3.3A
IC=4A, VCE=4V
IC=4A, VCE=4V
IC=10A, VCE=4V
VCE=10V, IC=500mA, f=0.5MHz
MHz
*Pulse Test : Pulse Width
≤380us,
Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100
10000
Spec. No. : HE6737-A
Issued Date : 1993.09.24
Revised Date : 1999.08.01
Page No. : 2/3
Saturation Voltage & Collector Current
hFE @ V
CE
=4V
Saturation Voltage (mV)
1000
V
BE (sat)
@ I
C
=10I
B
hFE
100
V
CE (sat)
@ I
C
=10I
B
10
1
10
100
1000
10000
10
1
10
100
1000
10000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000
10
Switching Time & Collector Current
Switching Times (us)
On Voltage (mV)
1
Tstg
1000
Ton
0.1
Tf
V
BE (on)
@ V
CE
=4V
100
1
10
100
1000
10000
0.01
0.1
1.0
10.0
Collector Current (mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
100000
Safe Operating Area
10000
Collector Current-I
C
(mA)
Capacitance (pF)
1000
P
T
=1 ms
100
P
T
=100 ms
P
T
=1 s
100
Cob
10
10
0.1
1
10
100
1
1
10
100
1000
Reverse-Biased Voltage (V)
Forward Voltage-V
CE
(V)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
Marking :
A
D
B
E
C
HSMC Logo
Part Number
Date Code
Spec. No. : HE6737-A
Issued Date : 1993.09.24
Revised Date : 1999.08.01
Page No. : 3/3
Product Series
Rank
H
I
G
4
P
M
3
2
1
N
K
Style : Pin 1.Base 2.Collector 3.Emitter
O
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
*:Typical
DIM
A
B
C
D
E
G
H
Inches
Min.
Max.
0.2197 0.2949
0.3299 0.3504
0.1732
0.185
0.0453 0.0547
0.0138 0.0236
0.3803 0.4047
*
0.6398
-
Millimeters
Min.
Max.
5.58
7.49
8.38
8.90
4.40
4.70
1.15
1.39
0.35
0.60
9.66
10.28
*
16.25
-
DIM
I
K
M
N
O
P
Inches
Min.
Max.
*
0.1508
-
0.0295 0.0374
0.0449 0.0551
*
0.1000
-
0.5000 0.5618
0.5701 0.6248
Millimeters
Min.
Max.
*
3.83
-
0.75
0.95
1.14
1.40
*
2.54
-
12.70
14.27
14.48
15.87
Notes :
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
•
Head Office
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
•
Factory 2 :
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification
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