HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6824
Issued Date : 1993.08.27
Revised Date : 2002.10.25
Page No. : 1/3
HMBT5088
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5088 is designed for low noise, high gain, general purpose
amplifier applications.
Absolute Maximum Ratings
SOT-23
•
Maximum Temperatures
Storage Temperature ........................................................................................... -55 ~ +150
°C
Junction Temperature.................................................................................... +150
°C
Maximum
•
Maximum Power Dissipations
Total Power Dissipation (Ta=25°C) ............................................................................... 225 mW
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ......................................................................................... 35 V
VCEO Collector to Emitter Voltage...................................................................................... 30 V
VEBO Emitter to Base Voltage........................................................................................... 4.5 V
IC Collector Current ......................................................................................................... 50 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
35
30
4.5
-
-
-
-
300
350
300
50
-
Typ.
-
-
-
-
-
-
-
-
-
-
-
-
Max.
-
-
-
50
50
500
800
900
-
-
-
4
Unit
V
V
V
nA
nA
mV
mV
Test Conditions
IC=100uA
IC=1mA
IE=10uA
VCB=20V
VEB=3V
IC=10mA, IB=1mA
IC=10mA, IB=1mA
VCE=5V, IC=0.1mA
VCE=5V, IC=1mA
VCE=5V, IC=10mA
VCE=5V, IC=0.5mA, f=20MHz
VCB=5V, f=1MHz, IE=0
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
HMBT5088
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
1
Spec. No. : HE6824
Issued Date : 1993.08.27
Revised Date : 2002.10.25
Page No. : 2/3
Saturation Voltage & Collector Current
V
BE(sat)
@ I
C
=10I
B
V
CE
=5V
Saturation Voltage (V)
hFE
100
0.1
V
CE(sat)
@ I
C
=10I
B
10
0.1
1
10
100
0.01
0.01
0.1
1
10
100
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
1
1000
Cutoff Frequene & Collector Current
V
BE(ON)
@ V
CE
=5V
Cutoff Frequence (MHz)
VCE=5V
100
On Voltage (V)
10
0.1
0.01
1
0.1
1
10
100
1
10
100
C ollec tor C urr ent( m A)
Collector Current (mA)
Capacitance & Reverse-Biased Voltge
10
10000
Safe Operating Area
1000
PT=1ms
Cob
1
Collector Current-I
C
(mA)
Capacitance (pF)
PT=100ms
100
PT=1s
10
0.1
0.1
1
10
100
1
1
10
100
Reverse-Biased Voltage (V)
Forward Voltage-V
CE
(V)
HMBT5088
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6824
Issued Date : 1993.08.27
Revised Date : 2002.10.25
Page No. : 3/3
A
L
Marking:
3
B S
1
V
G
2
1 Q
Rank Code
Control Code
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
C
D
H
K
J
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102
0.1204
0.0472
0.0630
0.0335
0.0512
0.0118
0.0197
0.0669
0.0910
0.0005
0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034
0.0070
0.0128
0.0266
0.0335
0.0453
0.0830
0.1083
0.0098
0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT5088
HSMC Product Specification
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