HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 1/2
HMBD2003\C\S
Description
The HMBD2003\C\S are general purpose diodes fabricated in planar
technology, and encapsulated in small plastic SMD SOT-23 package.
Features
•
Small plastic SMD package
•
Switching speed: max. 50 nS
•
General application:
Continuous reverse voltage: Max. 200 V
Repetitive peak reverse voltage: Max. 250 V
Repetitive peak forward current: Max. 625 mA
SOT-23
Absolute Maximum Ratings
(Ta=25°C)
Characteristic
HMBD2003 Repetitive Peak Reverse Voltage
HMBD2003C Repetitive Peak Reverse Voltage
HMBD2003S Repetitive Peak Reverse Voltage
HMBD2003 Continuous reverse voltage
HMBD2003C Continuous reverse voltage
HMBD2003S Continuous reverse voltage
Forward Continuous Current at Ta=25°C
Repetitive Peak Forward Current at Ta=25°C
Surge Forward Current at t =1mS, Ta=25°C
Power Dissipation
Junction Temperature
Storage Temperature Range
Symbol
VRRM
Value
250
250
250
200
200
200
225
625
1
250 Max
150
-65~+150
Unit
V
VR
lF
IFRM
IFSM
PD
Tj
Tstg
V
mA
mA
A
mV
°C
°C
Characteristics
(Ta=25°C)
Characteristic
Forward Voltage
HMBD2003 Reverse Current
HMBD2003C Reverse Current
HMBD2003S Reverse Current
Total Capacitance
Reverse Recovery Time
BV
R
Symbol
VF(1)
VF(2)
IR
CT
Trr
BV
R
Condition
IF=100mA
IF=200mA
VR=200V
VR=200V
VR=200V
VR=0V, f=1MHz
IF=30mA to IR=30mA
RL=100Ω measured at
IR=3mA
IR=100uA
Min
-
-
-
-
-
5
50
250
Max
1
1.25
100
100
100
-
-
-
Unit
V
nA
pF
nS
V
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Diagram:
L
1
3
Spec. No. : HE6857
Issued Date : 1994.01.25
Revised Date : 2002.10.25
Page No. : 2/2
A
Marking:
A82
2
1
2
3
3
HMBD2003
3
HMBD2003
B S
1
V
G
2
1
2
1
2
C3C
C3S
HMBD2003C
HMBD2003S
HMBD2003C
HMBD2003S
3-Lead SOT-23 Plastic Surface Mounted Package
HSMC Package Code: N
C
D
H
K
J
*: Typical
DIM
A
B
C
D
G
H
Inches
Min.
Max.
0.1102
0.1204
0.0472
0.0630
0.0335
0.0512
0.0118
0.0197
0.0669
0.0910
0.0005
0.0040
Millimeters
Min.
Max.
2.80
3.04
1.20
1.60
0.89
1.30
0.30
0.50
1.70
2.30
0.013
0.10
DIM
J
K
L
S
V
Inches
Min.
Max.
0.0034
0.0070
0.0128
0.0266
0.0335
0.0453
0.0830
0.1083
0.0098
0.0256
Millimeters
Min.
Max.
0.085
0.177
0.32
0.67
0.85
1.15
2.10
2.75
0.25
0.65
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD2003, HMBD2003C, HMBD2003S
HSMC Product Specification
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