BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DFP |
| 包装说明 | CERAMIC, DFP-20 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | 33 OHM OUTPUT SERIES RESISTOR |
| 系列 | BCT/FBT |
| JESD-30 代码 | R-GDFP-F20 |
| 长度 | 13.09 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 传播延迟(tpd) | 7.1 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 |
| 座面最大高度 | 2.54 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.92 mm |
| Base Number Matches | 1 |
| 5962-9074101MSX | 5962-9074101MRX | 5962-9074101M2X | |
|---|---|---|---|
| 描述 | BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 | BCT/FBT SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 |
| 零件包装代码 | DFP | DIP | QLCC |
| 包装说明 | CERAMIC, DFP-20 | DIP, | CERAMIC, LCC-20 |
| 针数 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | compli | compliant |
| 其他特性 | 33 OHM OUTPUT SERIES RESISTOR | 33 OHM OUTPUT SERIES RESISTOR | 33 OHM OUTPUT SERIES RESISTOR |
| 系列 | BCT/FBT | BCT/FBT | BCT/FBT |
| JESD-30 代码 | R-GDFP-F20 | R-GDIP-T20 | S-CQCC-N20 |
| 长度 | 13.09 mm | 24.195 mm | 8.89 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | IN-LINE | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟(tpd) | 7.1 ns | 7.1 ns | 7.1 ns |
| 认证状态 | Not Qualified | Qualified | Qualified |
| 筛选级别 | MIL-PRF-38535 | MIL-PRF-38535 | MIL-PRF-38535 |
| 座面最大高度 | 2.54 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES |
| 技术 | BICMOS | BICMOS | BICMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.92 mm | 7.62 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| 控制类型 | - | ENABLE LOW | ENABLE LOW |
| 计数方向 | - | UNIDIRECTIONAL | UNIDIRECTIONAL |
| 负载电容(CL) | - | 50 pF | 50 pF |
| 最大I(ol) | - | 0.012 A | 0.012 A |
| 翻译 | - | N/A | N/A |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved