4M High Speed SRAM (256-kword x 16-bit)
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Hitachi (Renesas ) |
零件包装代码 | TSOP2 |
包装说明 | TSOP2, TSOP44,.46,32 |
针数 | 44 |
Reach Compliance Code | unknow |
ECCN代码 | 3A991.B.2.A |
最长访问时间 | 15 ns |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-G44 |
JESD-609代码 | e0 |
长度 | 18.41 mm |
内存密度 | 4194304 bi |
内存集成电路类型 | CACHE SRAM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSOP2 |
封装等效代码 | TSOP44,.46,32 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大待机电流 | 0.0003 A |
最小待机电流 | 2 V |
最大压摆率 | 0.16 mA |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
HM62W16255HLTT-15 | HM62W16255H | HM62W16255HLJP-15 | HM62W16255HTT-12 | HM62W16255HTT-15 | HM62W16255HLTT-12 | HM62W16255HJP-15 | HM62W16255HJP-12 | HM62W16255HLJP-12 | |
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描述 | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) | 4M High Speed SRAM (256-kword x 16-bit) |
厂商名称 | Hitachi (Renesas ) | - | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) | Hitachi (Renesas ) |
零件包装代码 | TSOP2 | - | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ | SOJ | SOJ |
包装说明 | TSOP2, TSOP44,.46,32 | - | SOJ, SOJ44,.44 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | SOJ, SOJ44,.44 | SOJ, | SOJ, |
针数 | 44 | - | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
ECCN代码 | 3A991.B.2.A | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
最长访问时间 | 15 ns | - | 15 ns | 12 ns | 15 ns | 12 ns | 15 ns | 12 ns | 12 ns |
I/O 类型 | COMMON | - | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 代码 | R-PDSO-G44 | - | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 |
长度 | 18.41 mm | - | 28.33 mm | 18.41 mm | 18.41 mm | 18.41 mm | 28.33 mm | 28.33 mm | 28.33 mm |
内存密度 | 4194304 bi | - | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi | 4194304 bi |
内存集成电路类型 | CACHE SRAM | - | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM | CACHE SRAM |
内存宽度 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | - | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 262144 words | - | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | - | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 256KX16 | - | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSOP2 | - | SOJ | TSOP2 | TSOP2 | TSOP2 | SOJ | SOJ | SOJ |
封装等效代码 | TSOP44,.46,32 | - | SOJ44,.44 | TSOP44,.46,32 | TSOP44,.46,32 | TSOP44,.46,32 | SOJ44,.44 | SOJ44,.44 | SOJ44,.44 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | - | 3.76 mm | 1.2 mm | 1.2 mm | 1.2 mm | 3.76 mm | 3.76 mm | 3.76 mm |
最大待机电流 | 0.0003 A | - | 0.0003 A | 0.005 A | 0.005 A | 0.0003 A | 0.005 A | 0.005 A | 0.0003 A |
最小待机电流 | 2 V | - | 2 V | 3 V | 3 V | 2 V | 3 V | 3 V | 2 V |
最大压摆率 | 0.16 mA | - | 0.16 mA | 0.18 mA | 0.16 mA | 0.18 mA | 0.16 mA | 0.18 mA | 0.18 mA |
最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 3 V | - | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 (Vsup) | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | GULL WING | - | J BEND | GULL WING | GULL WING | GULL WING | J BEND | J BEND | J BEND |
端子节距 | 0.8 mm | - | 1.27 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | - | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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