2M X 1 CONFIGURATION MEMORY, PQCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCJ, LDCC20,.4SQ |
| 针数 | 20 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e0 |
| 长度 | 8.966 mm |
| 内存密度 | 2097152 bi |
| 内存集成电路类型 | CONFIGURATION MEMORY |
| 内存宽度 | 1 |
| 湿度敏感等级 | 2 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 2MX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大待机电流 | 0.00075 A |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 8.966 mm |
| AT17C002-10JI | AT17C002 | AT17C002-10BJI | AT17C002-10BJC | AT17C002-10CI | AT17C002-10CC | AT17C002-10TQI | AT17C002-10JC | AT17C002-10TQC | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 | 2M X 1 CONFIGURATION MEMORY, PQCC20 |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 44 | 44 | 8 | 8 | 44 | 20 | 44 |
| 组织 | 2MX1 | 2M × 1 | 2MX1 | 2MX1 | 2MX1 | 2MX1 | 2MX1 | 2MX1 | 2MX1 |
| 表面贴装 | YES | Yes | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | NO LEAD | NO LEAD | GULL WING | J BEND | GULL WING |
| 端子位置 | QUAD | 四 | QUAD | QUAD | DUAL | DUAL | QUAD | QUAD | QUAD |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | QLCC | - | LCC | LCC | SOIC | SOIC | QFP | QLCC | QFP |
| 包装说明 | QCCJ, LDCC20,.4SQ | - | QCCJ, LDCC44,.7SQ | QCCJ, LDCC44,.7SQ | SON, SOLCC8,.25 | SON, SOLCC8,.25 | TQFP, TQFP44,.47SQ,32 | QCCJ, LDCC20,.4SQ | TQFP, TQFP44,.47SQ,32 |
| 针数 | 20 | - | 44 | 44 | 8 | 8 | 44 | 20 | 44 |
| Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow | unknow | unknow | unknow |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | S-PQCC-J20 | - | S-PQCC-J44 | S-PQCC-J44 | S-PDSO-N8 | S-PDSO-N8 | S-PQFP-G44 | S-PQCC-J20 | S-PQFP-G44 |
| JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 8.966 mm | - | 16.586 mm | 16.586 mm | 5.99 mm | 5.99 mm | 10 mm | 8.966 mm | 10 mm |
| 内存密度 | 2097152 bi | - | 2097152 bi | 2097152 bi | 2097152 bi | 2097152 bi | 2097152 bi | 2097152 bi | 2097152 bi |
| 内存集成电路类型 | CONFIGURATION MEMORY | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| 湿度敏感等级 | 2 | - | 2 | 2 | 3 | 3 | - | 2 | - |
| 字数 | 2097152 words | - | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | - | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | - | QCCJ | QCCJ | SON | SON | TQFP | QCCJ | TQFP |
| 封装等效代码 | LDCC20,.4SQ | - | LDCC44,.7SQ | LDCC44,.7SQ | SOLCC8,.25 | SOLCC8,.25 | TQFP44,.47SQ,32 | LDCC20,.4SQ | TQFP44,.47SQ,32 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | - | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | FLATPACK, THIN PROFILE | CHIP CARRIER | FLATPACK, THIN PROFILE |
| 并行/串行 | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 225 | - | 225 | 225 | 240 | 240 | NOT SPECIFIED | 225 | NOT SPECIFIED |
| 电源 | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | - | 4.572 mm | 4.572 mm | 1.14 mm | 1.14 mm | 1.2 mm | 4.572 mm | 1.2 mm |
| 最大待机电流 | 0.00075 A | - | 0.00075 A | 0.0005 A | 0.00075 A | 0.0005 A | 0.00075 A | 0.0005 A | 0.0005 A |
| 最大压摆率 | 0.01 mA | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 8.966 mm | - | 16.586 mm | 16.586 mm | 5.99 mm | 5.99 mm | 10 mm | 8.966 mm | 10 mm |
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