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HM62V16258B: 产品描述4 M SRAM (256-kword x 16-bit); 文件大小75KB，共16页; 制造商Hitachi （Renesas ）; 官网地址http://www.renesas.com/eng/

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HM62V16258B概述

4 M SRAM (256-kword x 16-bit)

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HM62V16258B Series

4 M SRAM (256-kword

16-bit)

ADE-203-975B (Z)

Rev. 2.0

Oct. 14, 1999

Description

The Hitachi HM62V16258B Series is 4-Mbit static RAM organized 262,144-word

16-bit. HM62V16258B

Series has realized higher density, higher performance and low power consumption by employing Hi-CMOS

process technology. It offers low power standby power dissipation; therefore, it is suitable for battery backup

systems. It is packaged in standard 44-pin plastic TSOPII.

Features

•

Single 3.0 V supply: 2.7 V to 3.6 V

Fast access time: 70 ns/85 ns (max)

Power dissipation:



Active: 9 mW (typ)



Standby: 3 µW (typ)

Completely static memory.



No clock or timing strobe required

Equal access and cycle times

Common data input and output.



Three state output

Battery backup operation.

•

HM62V16258B相似产品对比

	HM62V16258B	HM62V16258BLTT-7SL	HM62V16258BLTT-8	HM62V16258BLTT-8SL	HM62V16258BLTT-7
描述	4 M SRAM (256-kword x 16-bit)	4 M SRAM (256-kword x 16-bit)	4 M SRAM (256-kword x 16-bit)	4 M SRAM (256-kword x 16-bit)	4 M SRAM (256-kword x 16-bit)
是否Rohs认证	-	不符合	不符合	不符合	不符合
厂商名称	-	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）	Hitachi （Renesas ）
零件包装代码	-	TSOP2	TSOP2	TSOP2	TSOP2
包装说明	-	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32	TSOP2, TSOP44,.46,32
针数	-	44	44	44	44
Reach Compliance Code	-	unknow	unknow	unknow	unknow
最长访问时间	-	70 ns	85 ns	85 ns	70 ns
I/O 类型	-	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	-	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44	R-PDSO-G44
JESD-609代码	-	e0	e0	e0	e0
长度	-	18.41 mm	18.41 mm	18.41 mm	18.41 mm
内存密度	-	4194304 bi	4194304 bi	4194304 bi	4194304 bi
内存集成电路类型	-	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	-	16	16	16	16
功能数量	-	1	1	1	1
端子数量	-	44	44	44	44
字数	-	262144 words	262144 words	262144 words	262144 words
字数代码	-	256000	256000	256000	256000
工作模式	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	-	70 °C	70 °C	70 °C	70 °C
组织	-	256KX16	256KX16	256KX16	256KX16
输出特性	-	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	TSOP2	TSOP2	TSOP2	TSOP2
封装等效代码	-	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32	TSOP44,.46,32
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
并行/串行	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	-	3 V	3 V	3 V	3 V
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	-	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最小待机电流	-	2 V	2 V	2 V	2 V
最大压摆率	-	0.07 mA	0.07 mA	0.07 mA	0.07 mA
最大供电电压 (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	-	2.7 V	2.7 V	2.7 V	2.7 V
标称供电电压 (Vsup)	-	3 V	3 V	3 V	3 V
表面贴装	-	YES	YES	YES	YES
技术	-	CMOS	CMOS	CMOS	CMOS
温度等级	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	-	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	-	0.8 mm	0.8 mm	0.8 mm	0.8 mm
端子位置	-	DUAL	DUAL	DUAL	DUAL
宽度	-	10.16 mm	10.16 mm	10.16 mm	10.16 mm

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