REVISIONS
LTR
A
B
C
D
E
F
G
H
J
DESCRIPTION
Make change to 1.3. Add vendor CAGE numbers 01295 and 07933.
In accordance with N.O.R. 5962-R259-92.
Add class V devices and case outline X. Replace vendor CAGE number
06665 with 24355. Make change to I
IB
test and editorial changes throughout.
Redrawn.
Make change to dimensions L, R, and R1 as specified in case X. - ro
Add radiation hardness assurance requirements. - ro
Add device type 02 with radiation hardness requirements. - ro
Make change to table IIB. - ro
Drawing updated to reflect current requirements. Delete figure 1 and make
change to 3.2.4. - ro
Delete Accelerated aging test, 4.4.4.1.1. - ro
Add device type 03 with radiation hardness requirements. Editorial changes
throughout. - jt
DATE (YR-MO-DA)
92-09-24
97-06-09
97-12-17
98-06-17
98-10-29
99-02-10
02-08-08
07-07-06
11-05-25
APPROVED
M. A. FRYE
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. MONNIN
R. HEBER
C. SAFFLE
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
PREPARED BY
JOSEPH A. KERBY
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STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
DAVID H. JOHNSON
APPROVED BY
MICHAEL A. FRYE
DRAWING APPROVAL DATE
88-04-24
REVISION LEVEL
J
SIZE
A
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
MICROCIRCUIT, LINEAR, QUAD, VOLTAGE
COMPARATOR, RADIATION HARDENED,
MONOLITHIC SILICON
CAGE CODE
AMSC N/A
67268
SHEET
1 OF 13
5962-87739
DSCC FORM 2233
APR 97
5962-E315-11
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following examples.
For device classes M and Q:
5962
-
87739
01
C
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
For device class V:
5962
R
87739
01
V
C
A
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
/
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
01
02
03
Generic number
LM139A
LM139
PM139A
Circuit function
Quad voltage comparator
Quad voltage comparator
Quad voltage comparator
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed
below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q
designators will not be included in the PIN and will not be marked on the device.
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, non-
JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
Q or V
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87739
SHEET
J
2
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
D
X
2
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
GDFP1-G14
CQCC1-N20
14
14
14
20
Dual-in-line
Flat pack
Flat pack with gull wing leads
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
S
) .............................................................................. 36 V dc or ±18 V dc
Input voltage range ......................................................................................... -0.3 V dc to 36 V dc
Input current (V
IN
< -0.3 V) ............................................................................. 50 mA
Maximum power dissipation (P
D
) ....................................................................
Sink current .....................................................................................................
Lead temperature (soldering 10 seconds) ......................................................
Storage temperature range .............................................................................
Junction temperature (T
J
) ...............................................................................
900 mW 2/
20 mA approximately
+300°C
-65°C to +150°C
+150°C
Thermal resistance, junction-to- case (θ
JC
):
Cases C, D, and 2 ....................................................................................... See MIL-STD-1835
Case X ........................................................................................................ 23°C/W
1.4 Recommended operating conditions.
Supply voltage (V
S
) ......................................................................................... 5 V dc to 30 V dc
Ambient operating temperature range (T
A
) ..................................................... -55°C to +125°C
1.5 Radiation features.
Device types 01, 02:
Maximum total dose available (dose rate = 50 – 300 rads (Si)/s) ........................ 100 Krads(Si) 3/
Device Type 03:
Maximum total dose available (dose rate </= 10 mrad (Si)/s………………. 50 Krads(Si) 4/
______
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ Derate above 100°C ambient, 10 mW/°C.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883,
method 1019, condition A.
4/ For device type 03, radiation endpoint limits for the noted parameters are guaranteed for the condition specified in MIL-
STD-883, Test Method 1019, Condition D.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87739
SHEET
J
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
https://assist.daps.dla.mil/quicksearch/
or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Logic diagram. The logic diagram shall be as specified on figure 2.
3.2.4 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87739
SHEET
J
4
TABLE I. Electrical performance characteristics.
Conditions
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Max
±2.0
±4.0
Unit
Input offset voltage
V
IO
R
S
= 0
Ω,
V
O
= 1.4 V,
+V
S
= 5 V dc to 30 V dc
M,D,P,L,R 1/ 2/
M, D, P, L 1/ 2/
R
S
= 0
Ω,
V
O
= 1.4 V,
+V
S
= 5 V dc to 30 V dc
M,D,P,L,R 1/ 2/
1
2,3
1
1
1
2,3
1
1
2,3
1
1
1
2,3
1
1
1,2,3
1
2,3
01, 03
mV
01
03
02
±3.0
±5.0
±9.0
±6.0
Input offset current
I
IO
+I
IN
- -I
IN
with output in
the linear range
M,D,P,L,R 1/ 2/
M, D, P, L 1/ 2/
All
±25
±100
nA
01,02
03
All
±25
±100
±300
nA
Input bias current
I
IB
+I
IN
or –I
IN
with output
in the linear range
M,D,P,L,R 1/ 2/
M, D, P, L 1/ 2/
01,02
03
All
All
0
50
25
All
All
6
±100
+V
S
– 2.0
V/mV
V
Input common-mode 3/
voltage range
Voltage gain 3/
V
ICR
A
V
+V
S
= 5 V to 30 V
R
L
≥
15 kΩ, +V
S
= 15 V
Output sink current 3/
Saturation voltage
I
SINK
V
SAT
-V
IN
= 1 V, +V
IN
= 0 V,
V
O
≥
1.5 V, T
A
= +25°C
-V
IN
= 1 V, +V
IN
= 0 V, 3/
I
SINK
≤
4 mA
-V
IN
= 1 V, +V
IN
= 0 V,
I
O
= 4 mA
M,D,P,L,R 1/ 2/
M, D, P, L 1/ 2/
+V
IN
≥
1 V dc, V
O
= 30 V,
-V
IN
= 0 V
M,D,P,L,R 1/ 2/
M, D, P, L 1/ 2/
1
1
1,2,3
1
1
1
1,2,3
1
mA
400
700
400
mV
01,02
03
All
400
0.5
1
µA
Output leakage current
I
OL
01,02
03
0.5
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-87739
SHEET
J
5
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