HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 1/4
HM5401
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HM5401 is designed for general purpose applications requiring
high breakdown voltages.
Features
•
High current-emitter breakdown voltage.VCEO=150V(@IC=1mA)
•
Complements to NPN type HM5551
SOT-89
Absolute Maximum Ratings
•
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
°C
Junction Temperature .................................................................................... +150
°C
Maximum
•
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C) ....................................................................................... 1 W
•
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage ...................................................................................... -160 V
VCES Collector to Emitter Voltage ................................................................................... -150 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current ...................................................................................................... -600 mA
Characteristics
(Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)1
*VCE(sat)2
*VBE(sat)1
*VBE(sat)2
*hFE1
*hFE2
*hFE3
fT
Cob
Min.
-160
-150
-5
-
-
-
-
-
-
50
60
50
100
-
Max.
-
-
-
-50
-50
-0.2
-0.5
-1
-1
-
240
-
-
6
Unit
V
V
V
nA
nA
V
V
V
V
Test Conditions
IC=-100uA
IC=-1mA
IE=-10uA
VCB=-120V
VEB=-5V
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
IC=-10mA, IB=-1mA
IC=-50mA, IB=-5mA
VCE=-5V, IC=-1mA
VCE=-5V, IC=-10mA
VCE=-5V, IC=-50mA
VCE=-10V, IC=-10mA, f=100MHz
VCB=-10V, f=1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
MHz
pF
HM5401
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000
o
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 2/4
Saturation Voltage & Collector Current
100000
V
CE(sat)
@ I
C
=10I
B
125 C
100
25 C
75 C
o
o
Saturation Voltage (mV)
10000
hFE
1000
75 C
125 C
100
o
o
10
25 C
o
hFE @ V
CE
=5V
1
1
10
100
1000
10
0.1
1
10
100
1000
Collector Current-I
C
(mA)
Collector Current-I
C
(mA)
Saturation Voltage & Collector Current
1000
25 C
o
Capacitance & Reverse-Biased Voltage
100
Saturation Voltage (mV)
75 C
125 C
o
o
Capacitance (pF)
V
BE(sat)
@ I
C
=10I
B
10
Cob
100
0.1
1
10
100
1000
1
0.1
1
10
100
Collector Current-I
C
(mA)
Reverse Biased Voltage (V)
Cutoff Frequency & Collector Current
1000
10000
Safe Operating Area
P
T
=1ms
Cutoff Frequency (MHz)
..
.
Collector Current-I
C
(mA)
1000
P
T
=100ms
P
T
=1s
V
CE
=10V
100
100
10
10
1
10
100
1000
1
1
10
100
Collector Current (mA)
Forward Biased Voltage-V
CE
(V)
HM5401
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 3/4
PD - Tc
6
1.2
PD - Ta
5
1
PD(W) , Power Dissipation
4
PD(W) , Power Dissipation
0
50
100
150
o
0.8
3
0.6
2
0.4
1
0.2
0
200
0
0
50
100
150
o
200
Temperature-T
C
( C )
Temperature-T
a
( C )
HM5401
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
Spec. No. : HE9503
Issued Date : 1996.04.09
Revised Date : 2002.08.27
Page No. : 4/4
C
H
Date Code
HM
5 4 0 1
Laser Marking
B
1
E
F
G
A
2
3
D
Style: Pin 1.Base 2.Collector 3.Emitter
I
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code: M
*: Typical
DIM
A
B
C
D
E
Inches
Min.
Max.
0.1732 0.1811
0.1594 0.1673
0.0591 0.0663
0.0945 0.1024
0.0141 0.0201
Millimeters
Min.
Max.
4.40
4.60
4.05
4.25
1.50
1.70
2.40
2.60
0.36
0.51
DIM
F
G
H
I
Inches
Min.
Max.
0.0583 0.0598
0.1165 0.1197
0.0551 0.0630
0.0138 0.0161
Millimeters
Min.
Max.
1.48
1.52
2.96
3.04
1.40
1.60
0.35
0.41
Notes:
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM5401
HSMC Product Specification
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