Flash, 4MX8, 50ns, CDFP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | EDI [Electronic devices inc.] |
| 包装说明 | DFP, FL24/32,.4 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 50 ns |
| 命令用户界面 | YES |
| 数据轮询 | NO |
| JESD-30 代码 | R-CDFP-F24 |
| JESD-609代码 | e0 |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 部门数/规模 | 512 |
| 端子数量 | 24 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4MX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL24/32,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 页面大小 | 512 words |
| 并行/串行 | PARALLEL |
| 电源 | 3.3 V |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 部门规模 | 8K |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.02 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 切换位 | NO |
| Base Number Matches | 1 |
| EDI784MSV50FM | EDI784MSV50BM | EDI784MSV50BC | EDI784MSV50FI | EDI784MSV50BI | EDI784MSV50FC | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 4MX8, 50ns, CDFP24, | Flash, 4MX8, 50ns, CDSO24, | Flash, 4MX8, 50ns, CDSO24, | Flash, 4MX8, 50ns, CDFP24, | Flash, 4MX8, 50ns, CDSO24, | Flash, 4MX8, 50ns, CDFP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] |
| 包装说明 | DFP, FL24/32,.4 | SOP, SOP24/32,.52 | SOP, SOP24/32,.52 | DFP, FL24/32,.4 | SOP, SOP24/32,.52 | DFP, FL24/32,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 最长访问时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 命令用户界面 | YES | YES | YES | YES | YES | YES |
| 数据轮询 | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-CDFP-F24 | R-CDSO-G24 | R-CDSO-G24 | R-CDFP-F24 | R-CDSO-G24 | R-CDFP-F24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bi |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 部门数/规模 | 512 | 512 | 512 | 512 | 512 | 512 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -40 °C | -40 °C | - |
| 组织 | 4MX8 | 4MX8 | 4MX8 | 4MX8 | 4MX8 | 4MX8 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | SOP | SOP | DFP | SOP | DFP |
| 封装等效代码 | FL24/32,.4 | SOP24/32,.52 | SOP24/32,.52 | FL24/32,.4 | SOP24/32,.52 | FL24/32,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | SMALL OUTLINE | SMALL OUTLINE | FLATPACK | SMALL OUTLINE | FLATPACK |
| 页面大小 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 编程电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES | YES | YES |
| 部门规模 | 8K | 8K | 8K | 8K | 8K | 8K |
| 最大待机电流 | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A | 0.00005 A |
| 最大压摆率 | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | GULL WING | GULL WING | FLAT | GULL WING | FLAT |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 切换位 | NO | NO | NO | NO | NO | NO |
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