REVISIONS
LTR
D
DESCRIPTION
Redrawn with changes made under NOR No. 5962-R116-92 Revision
B and NOR No. 5962-R004-93 Revision C. Added vendor CAGE
numbers 65896 and OK6N4 to the drawing as sources of supply.
Added device types 10UX, 10YX, 11UX, 11YX, and 12UX, 12YX.
Removed vendor CAGE number OBYV4 from drawing as approved
source of supply. Removed vendor CAGE number 61772 as
approved source of supply for devices 01ZX, 02ZX, 03ZX, 05XX,
05YX, 05ZX, 05UX, 06ZX, 07XX, 07YX, 07ZX, 07UX, 08XX, 08YX,
08ZX, 08UX, 09XX, 09YX, 09ZX, and 09UX. Added vendor CAGE
61772 as a source of supply for devices 01MX, 01NX, 02MX, 02NX,
03MX, 03NX, 04NX, 04MX, 06MX, and 06NX. Remove vendor CAGE
34649 as a source of supply for devices 02XX, 02YX, 04XX, and
04YX. Editorial changes throughout.
Drawing updated to reflect current requirements. Editorial changes
throughout. - gap
Added device to cover 12 ns access time. Updated boilerplate,
editorial changes throughout.
ksr
Boilerplate update and part of five year review. tcr
DATE (YR-MO-DA)
94 – 01 – 04
APPROVED
M. A. Frye
E
F
G
00 – 10 – 12
02 – 08 – 16
07 – 11 – 01
Raymond Monnin
Raymond Monnin
Robert M. Heber
THE FRONT PAGE OF THIS DRAWING HAS BEEN REPLACED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
G
15
G
16
G
17
REV
SHEET
G
1
G
2
G
3
G
4
G
5
G
6
G
7
G
8
G
9
G
10
G
11
G
12
G
13
G
14
PREPARED BY
Kenneth Rice
CHECKED BY
Ray Monnin
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-06-03
REVISION LEVEL
G
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 32K X 8 STATIC RANDOM
ACCESS MEMORY (SRAM) LOW
POWER, MONOLITHIC SILICON
SIZE
A
SHEET
1 OF
17
5962-E026-08
CAGE CODE
67268
5962-88552
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88552
01
X
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02, 07
03, 08
04, 09
05
06
10
11
12
13
Generic number 1/
Circuit function
32K x 8 low power CMOS SRAM
Access time
100 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
17 ns
15 ns
12 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
M
N
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
CDFP3-F28
CDIP3-T28 or GDIP4-T28
CDFP4-T28
CQCC3-N28
GDFP2-F28
Terminals
28
32
28
28
28
28
28
Package style
Dual-in-line
Rectangular leadless chip carrier
Flat pack
Dual-in-line
Flat pack
Rectangular leadless chip carrier
Flat pack
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
CC
)...................................................................
Input voltage range...............................................................................
Storage temperature range...................................................................
Thermal resistance, junction-to-case (θ
JC
)............................................
Junction temperature (T
J
) .....................................................................
Power dissipation (P
D
) ..........................................................................
Junction temperature (soldering, 10 seconds) ......................................
1/
2/
3/
-0.5 V dc to +7.0 V dc 2/
-0.5 V dc to +6.0 V dc
-65°C to +150°C
See MIL-STD-1835
+150°C 3/
1.0 W
+260°C
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this
document and will also be listed in MIL-HDBK-103.
All voltages referenced to V
CC
.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions
in accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-88552
SHEET
2
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)...................................................................
Ground voltage (V
SS
) ............................................................................
Input high voltage (V
IH
) .........................................................................
Input low voltage (V
IL
) ...........................................................................
Case operating temperature (T
C
)..........................................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in
the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
+4.5 V dc to +5.5 V dc 4/
0 V dc
+2.2 V dc to V
CC
+0.5 V dc
-0.5 V dc to 0.8 V dc
-55°C to +125°C
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
4/
All voltages referenced to V
CC
.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-88552
SHEET
3
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN
class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing
(QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535
may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval
in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38535, appendix A and herein.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Truth tables. The truth tables shall be as specified on figure 2.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to
MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a "Q" or "QML" certification mark in
accordance with MIL-PRF-38535 to identify when the QML flow option is used.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with
each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be for any change that affects this drawing.
3.9 Verification and review. DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-88552
SHEET
4
Table I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C
≤
T
C
≤
+125°C
V
SS
= 0 V, 4.5 V
≤
V
CC
≤
5.5 V
unless otherwise specified
V
CC
= max, V
IN
= GND to V
CC
V
CC
= max, V
OUT
= GND to V
CC
CE
≥
V
IH
;
WE
≤
V
IL
Output low voltage
Output high voltage
Data retention voltage
Operating supply current
(active)
V
OL
V
OH
V
DR
I
CC1
V
CC
= 5.5 V,
f = f max 1/,
CE = V
IL
, outputs open,
all other inputs at V
IL
V
CC
= 4.5 V, I
OL
= 8 mA,
V
IL
= 0.8 V, V
IH
= 2.2 V
V
CC
= 4.5 V, I
OH
= -4 mA,
V
IL
= 0.8 V, V
IH
= 2.2 V
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
01, 02,
07, 13
03, 08
04, 09
05
06, 11
10
12
01-04
05-09,
13
10-12
05,
07-09,
13
01-04,
06
10-12
05,
07-09,
13
01-04,
06
10-12
All
2.4
2.0
100
125
135
145
155
150
160
3
5
10
900
1.5
5
350
800
750
12
μA
μA
mA
0.4
V
V
V
mA
Group A
subgroups
Device
type
Limits
Unit
Min
1, 2, 3
1, 2, 3
All
All
Input leakage current
Output leakage current
I
LI
I
LO
Max
10
10
μA
μA
Standby power supply
current (TTL)
I
CC2
CE
≥
V
IH
, outputs open
V
CC
= 5.5 V, f = 0 MHz
1, 2, 3
mA
Standby power supply
current (CMOS)
I
CC3
CE
≥
(V
CC
-0.2 V),
f = 0 MHz, outputs open,
V
CC
= 5.5 V all other
inputs
≤
0.2 V or
≥
(V
CC
-0.2 V)
1, 2, 3
Data retention current
I
CC4
2/
V
CC
= 3.0 V, CE
≥
(V
CC
-0.2 V),
f = 0 MHz, outputs open, all
other inputs
≤
0.2 V or
≥
(V
CC
-0.2 V)
1, 2, 3
Input capacitance
C
I
2/
Output capacitance
C
O
2/
V
I
= 5.0 V or GND,
f = 1 MHz, T
C
= +25°C,
See 4.3.1c
V
O
= 5.0 V or GND,
f = 1 MHz, T
C
= +25°C,
See 4.3.1c
4
pF
4
All
12
pF
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
G
5962-88552
SHEET
5
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