SILICON DELAY LINE, TRUE OUTPUT, PDSO8, 0.300 INCH, SOIC-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| 其他特性 | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
| 系列 | CMOS/TTL |
| 输入频率最大值(fmax) | 8.33333 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e0 |
| 长度 | 9.4615 mm |
| 逻辑集成电路类型 | SILICON DELAY LINE |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | 240 |
| 可编程延迟线 | NO |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 总延迟标称(td) | 75 ns |
| Base Number Matches | 1 |

| DS1005H-75 | DS1005H-200 | DS1005H-60 | DS1005K-100 | DS1005K-150 | DS1005K-250 | |
|---|---|---|---|---|---|---|
| 描述 | SILICON DELAY LINE, TRUE OUTPUT, PDSO8, 0.300 INCH, SOIC-8 | SILICON DELAY LINE, TRUE OUTPUT, PDSO8, 0.300 INCH, SOIC-8 | SILICON DELAY LINE, TRUE OUTPUT, PDSO8, 0.300 INCH, SOIC-8 | SILICON DELAY LINE, TRUE OUTPUT, PDIP14, 0.300 INCH, DIP-14 | SILICON DELAY LINE, TRUE OUTPUT, PDIP14, 0.300 INCH, DIP-14 | SILICON DELAY LINE, TRUE OUTPUT, PDIP14, 0.300 INCH, DIP-14 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | SOIC | SOIC | SOIC | DIP | DIP | DIP |
| 包装说明 | SOP, | SOP, | SOP, | DIP, | DIP, | DIP, |
| 针数 | 8 | 8 | 8 | 14 | 14 | 14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT | BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT |
| 系列 | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL | CMOS/TTL |
| 输入频率最大值(fmax) | 8.33333 MHz | 3.125 MHz | 10.4167 MHz | 6.25 MHz | 4.16667 MHz | 2.5 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 9.4615 mm | 9.4615 mm | 9.4615 mm | 19.05 mm | 19.05 mm | 19.05 mm |
| 逻辑集成电路类型 | SILICON DELAY LINE | SILICON DELAY LINE | SILICON DELAY LINE | SILICON DELAY LINE | SILICON DELAY LINE | SILICON DELAY LINE |
| 湿度敏感等级 | 1 | 1 | NOT SPECIFIED | 1 | NOT SPECIFIED | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 8 | 8 | 8 | 14 | 14 | 14 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度(摄氏度) | 240 | 240 | 245 | 240 | 245 | 240 |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | 20 | NOT SPECIFIED | 20 |
| 总延迟标称(td) | 75 ns | 200 ns | 60 ns | 100 ns | 150 ns | 250 ns |
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